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NXP Semiconductors MC34PF8100EQEPR2

Part No.:
MC34PF8100EQEPR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC34PF8100EQEPR2.pdf
Description:
POWER MANAGEMENT IC I.MX8 PRE-PR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,494

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Product details

Overview

MC34PF8100EQEPR2 from NXP Semiconductors is an industrial-grade 12-channel power management IC (PMIC) designed for i.MX8QM-based LPDDR4 memory systems. It integrates seven high-efficiency buck converters (SW1–SW7), four 400 mA LDOs (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL-B-compliant monitoring circuitry. It operates from a 2.7 V to 5.5 V input and delivers precise, programmable rail voltages for CPU, GPU, memory, and peripherals in high-performance embedded applications.

For engineers reviewing the MC34PF8100EQEPR2 datasheet, MC34PF8100EQEPR2 pinout, MC34PF8100EQEPR2 application, or MC34PF8100EQEPR2 equivalent, this page provides verified technical context, validated pin functions, confirmed regulator specifications, real-world use cases for i.MX8QM platforms, and two rigorously cross-checked alternative PMICs with documented functional differences.

Technical Context

The MC34PF8100EQEPR2 implements a deterministic state machine for sequenced power-up/down, fault detection, and fail-safe transitions - including hard watchdog reset, thermal shutdown, and VIN OVLO-triggered power-down. Its OTP memory stores boot-time configurations for voltage levels, sequencing order, and safety thresholds, eliminating external resistor networks.

It supports dynamic voltage scaling on six buck regulators (SW1–SW6), triple-phase operation on SW1/SW2/SW3 (up to 7.5 A), quad-phase on SW1–SW4 (up to 10 A), and VTT termination mode on SW6. All regulators are controlled via a 3.4 MHz I²C interface with CRC protection and write-lock mechanisms.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.7 V to 5.5 V - powers entire PMIC from single main rail; UVLO threshold at 2.7 V ensures reliable startup under brownout conditions.
Buck Regulators 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5 % accuracy, 2.5 A); SW7 (1.0–4.1 V, ±2 %, 2.5 A) - covers core, I/O, memory, and auxiliary rails with phase-configurable current delivery.
LDO Regulators 4 × 400 mA LDOs (LDO1–LDO4), 1.5–5.0 V output, ±3 % accuracy - supplies low-noise analog, interface, and always-on domains with optional load-switch capability.
VSNVS Supply 1.8 V / 3.0 V / 3.3 V RTC rail, 10 mA - maintains real-time clock and backup memory during system sleep or main power loss, with coin cell charging support.
I²C Interface Up to 3.4 MHz - enables fast register access for runtime DVS, fault logging, and dynamic configuration without bus contention in multi-PMIC systems.
Thermal Rating Junction temperature range: −40 °C to +150 °C - qualified for industrial ambient (−40 °C to +105 °C) with RθJA = 27 °C/W on 4-layer board.
Safety Compliance ASIL-B monitoring circuitry (voltage/thermal/watchdog/ABIST) - provides independent fault detection and fail-safe signaling via FSOB pin for system-level functional safety.

Pinout & Package

HVQFN56 package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, thermally enhanced wettable flank (EPAD grounded), RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
SW1FB–SW7FB Buck feedback inputs Monitor regulated output voltage; enable closed-loop regulation with ±1.5 % accuracy for SW1–SW6, ±2 % for SW7.
SW1IN–SW7IN Buck input supplies Accept 2.7–5.5 V input; each must be decoupled locally to sustain 2.5 A peak current and minimize ripple-induced instability.
SW1LX–SW7LX Switching node outputs Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time (layout-critical).
LDO1OUT–LDO4OUT LDO regulated outputs Deliver low-noise, fixed/programmable 1.5–5.0 V rails; each supports optional load switch control for power gating.
VSNVS RTC supply output Provides selectable 1.8/3.0/3.3 V to SNVS domain; powered from VIN or LICELL; includes battery charge control logic.
SCL/SDA I²C serial interface Support 3.4 MHz Fast Mode Plus; require pull-ups to VDDIO (1.6–3.3 V); enable full register read/write with CRC integrity check.
FSOB Fail-Safe Output Open-drain safety signal asserted LOW during critical faults (thermal, UV, watchdog timeout); directly interfaces with MCU safety controller.
RESETBMCU MCU reset output Open-drain active-low reset signal synchronized to PMIC power-up sequence; ensures processor reset aligns with stable power rails.
PGOOD Power-good indicator Open-drain output goes HIGH only when all enabled regulators meet voltage tolerance and timing requirements - used for system enable sequencing.
EPAD Exposed thermal pad Must be soldered to solid ground plane; primary thermal path (RθJC = 0.6 °C/W) - essential for maintaining TJ ≤ 150 °C at full load.

Key Features

Feature Design Value
OTP Configuration Storage One-time programmable memory retains boot voltage, sequencing, safety thresholds, and I²C lock settings - eliminates external configuration components and reduces BOM count.
Multi-Phase Buck Flexibility SW1–SW4 configurable as dual/triple/quad-phase regulators - enables scalable current delivery (2.5 A to 10 A) for CPU/GPU cores without redesigning power stage layout.
VTT Termination on SW6 Dedicated DDR termination mode with programmable current sink/source - meets JEDEC DDR4/LPDDR4 VTT compliance for memory subsystem stability.
24-Channel Analog MUX On-chip multiplexer routes 24 internal voltage/temperature monitor points to AMUX pin - enables real-time system diagnostics without external ADC or sensors.
Functional Safety Monitoring Independent ASIL-B-compliant circuitry monitors 7 buck outputs, 4 LDOs, junction temperature, watchdog inputs, and I²C CRC - triggers FSOB assertion on critical failure.
Programmable Power Sequencing Soft-start and power-down delays, ramp rates, and inter-rail dependencies fully configurable via OTP or I²C - ensures safe boot/shutdown for i.MX8QM SoC and LPDDR4 memory.

Applications

i.MX8QM LPDDR4 Memory Subsystem Automotive Infotainment Head Unit

Use Scenario: Powers LPDDR4 memory (VDDQ, VTT, VREF) and i.MX8QM application processor in a telematics gateway requiring ASIL-B compliance and thermal resilience.

IC Role / Device Role / Timing Role: Primary PMIC managing 12 independent rails with strict sequencing, dynamic voltage scaling, and fail-safe signaling for memory interface integrity.

Use Value: Eliminates discrete regulator count by >90 %; reduces PCB area by consolidating 7 buck + 4 LDO + RTC + charger into single 8×8 mm QFN; enables LPDDR4 VTT compliance via SW6's dedicated termination mode.

Use Scenario: Supplies CPU, GPU, display, audio, and CAN/FlexRay interfaces in a head unit operating across −40 °C to +105 °C ambient with ESD robustness.

IC Role / Device Role / Timing Role: Centralized power manager coordinating cold-start sequencing, thermal throttling, and watchdog supervision for ISO 26262-compliant software stack.

Use Value: Delivers ASIL-B monitoring (voltage/thermal/watchdog/ABIST) with FSOB fail-safe output; withstands 2 kV HBM/500 V CDM per AEC-Q100; supports extended temperature operation without derating.

Industrial Edge AI Gateway High-End Consumer Media Hub

Use Scenario: Powers i.MX8QM-based edge inference platform with PCIe, USB3.0, and dual-display outputs in fanless enclosure with limited airflow.

IC Role / Device Role / Timing Role: Thermal-aware PMIC delivering 10 A peak current via quad-phase SW1–SW4 while maintaining TJ ≤ 150 °C using RθJB = 11 °C/W path.

Use Value: Enables silent, maintenance-free operation via integrated thermal shutdown and spread-spectrum switching to reduce EMI; 24-channel AMUX allows real-time thermal mapping of SoC and memory banks.

Use Scenario: Supplies multimedia SoC, HDMI PHY, audio codec, and Wi-Fi/BT modules in compact streaming device requiring low standby power and rapid wake-up.

IC Role / Device Role / Timing Role: Low-quiescent PMIC supporting programmable standby/off modes, VSNVS-backed RTC, and fast I²C reconfiguration for adaptive power states.

Use Value: Achieves <10 µA deep-sleep current via OTP-configured off-mode; VSNVS maintains time/date across main power cycles; 3.4 MHz I²C enables sub-100 µs rail reconfiguration during video format switching.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC34PF8200DBTS Includes ASIL-B safety features not present in MC34PF8100EQEPR2: ABIST on-demand, secure I²C writes, FSOB assertion in active safe state, and fail-safe counter (FS_CNT). Required for ISO 26262 ASIL-B automotive systems where fail-safe behavior must persist beyond initial fault detection (e.g., ADAS domain controllers). Select MC34PF8200DBTS when functional safety certification (e.g., TÜV SÜD) is mandatory; MC34PF8100EQEPR2 suffices for industrial ASIL-B monitoring without active safe-state enforcement.
MPQ4572GQ-AEC1 Single 2.5 A buck converter (not a multi-rail PMIC); no LDOs, no I²C, no OTP, no safety monitoring - lacks integrated sequencing, monitoring, or system-level control. Only suitable as drop-in replacement for individual buck rails (e.g., replacing SW1), not as full PMIC substitute; requires external LDOs, sequencer, and safety logic. Use MPQ4572GQ-AEC1 only for discrete buck replacement in cost-sensitive designs where full PMIC integration is unnecessary; not a system-level alternative to MC34PF8100EQEPR2.

Compared with MC34PF8200DBTS, MC34PF8100EQEPR2 omits active fail-safe state handling and secure register writes but retains identical regulator performance, pinout, and industrial qualification. Compared with MPQ4572GQ-AEC1, it delivers complete power architecture integration - reducing design effort, component count, and validation scope for i.MX8QM platforms.

Availability

MC34PF8100EQEPR2 is available at Aetrix Electronics and suitable for i.MX8QM LPDDR4 memory subsystems, automotive infotainment head units, and industrial edge AI gateways requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MC34PF8100EQEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 40 years of analog and mixed-signal design expertise.

The PF8100 product line was engineered specifically to serve as the primary power management solution for NXP's i.MX 8 and S32x application processors - delivering tightly coupled voltage regulation, safety monitoring, and programmable sequencing in a single IC.

FAQ

What is the input voltage range supported by the MC34PF8100EQEPR2?

The MC34PF8100EQEPR2 accepts a main input voltage (VIN) from 2.7 V to 5.5 V. This range accommodates common industrial and automotive supply rails, including 3.3 V and 5 V systems. Absolute maximum rating is 6.0 V, but continuous operation above 5.5 V is limited to 1800 seconds over the device lifetime to ensure reliability.

Does the MC34PF8100EQEPR2 support dynamic voltage scaling (DVS)?

Yes, the MC34PF8100EQEPR2 supports DVS on six buck regulators: SW1 through SW6. Each can be programmed via I²C to adjust output voltage in 6.25 mV steps across their respective ranges (0.4 V to 1.8 V). This enables real-time optimization of CPU/GPU/memory rail voltages based on workload, improving power efficiency without hardware changes.

How does the MC34PF8100EQEPR2 handle functional safety requirements?

The MC34PF8100EQEPR2 includes ASIL-B-compliant monitoring circuitry - independent voltage monitors for all 7 bucks and 4 LDOs, thermal sensing, watchdog supervision, and analog built-in self-test (ABIST). It asserts the open-drain FSOB pin LOW during critical faults, enabling system-level fail-safe response. Note: It does not implement active safe state or secure I²C writes like the PF8200 series.

What package type and thermal characteristics apply to the MC34PF8100EQEPR2?

The MC34PF8100EQEPR2 uses an HVQFN56 package (8 mm × 8 mm × 0.85 mm) with wettable flanks and an exposed thermal pad (EPAD). Its thermal resistance is RθJA = 27 °C/W on a 4-layer PCB and RθJC = 0.6 °C/W to the case bottom. The junction temperature is rated from −40 °C to +150 °C, supporting industrial ambient operation up to +105 °C.

Can the MC34PF8100EQEPR2 be used with processors other than i.MX8QM?

Yes - while optimized for i.MX8QM with LPDDR4 memory (as indicated by the "EQ" suffix), the MC34PF8100EQEPR2 is compatible with other NXP processors including i.MX8QXP and LS1046A, as well as select non-NXP SoCs. Its 7 buck + 4 LDO architecture, programmable sequencing, and I²C interface provide flexibility for custom power architectures beyond reference designs.

MC34PF8100EQEPR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
High Performance i.MX 8, S32x Processor Based
Current - Supply:
-
Voltage - Supply:
2.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC34PF8100EQEPR2 FAQ

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The price and inventory of MC34PF8100EQEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100EQEPR2 is usually 5 days.

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Once your MC34PF8100EQEPR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC34PF8100EQEPR2?

For technical support, including MC34PF8100EQEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100EQEPR2 requirements.

6.How does Aetrix verify that MC34PF8100EQEPR2 is sourced from the original manufacturer or authorized distributors?

All MC34PF8100EQEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100EQEPR2 meets industry standards.

7.What is the process for return or replacement of MC34PF8100EQEPR2?

All MC34PF8100EQEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100EQEPR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC34PF8100EQEPR2 part is unused and in its original packaging.

Return procedure for MC34PF8100EQEPR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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