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NXP Semiconductors MC34PF8100EREP
- Part No.:
- MC34PF8100EREP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC34PF8100EREP.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:4,585
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Product details
Overview
MC34PF8100EREP from NXP Semiconductors is an industrial-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX8QM processors with DDR4 memory (PMIC1 role). It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–capable monitoring circuitry. Input voltage range is 2.7 V to 5.5 V, supporting LPDDR4/DDR4 memory subsystems in high-performance embedded systems.
For engineers reviewing the MC34PF8100EREP datasheet, MC34PF8100EREP pinout, MC34PF8100EREP application, or MC34PF8100EREP equivalent, this page delivers verified technical context, validated pin functions, confirmed regulator specifications, OTP configuration scope, and real-world use cases in i.MX8QM-based industrial platforms - all grounded in NXP's official PF8100/PF8200 Rev. 13 product data sheet.
Technical Context
The MC34PF8100EREP implements a deterministic state machine for sequenced power-up/down of processor cores, memory rails, and peripherals, with programmable soft-start and fault recovery logic. Its 3.4 MHz I²C interface enables dynamic voltage scaling on six buck channels (SW1–SW6) and runtime reconfiguration of regulator parameters post-boot.
It features 24-channel analog multiplexing for system-level diagnostics, independent voltage monitors per rail (±1.5 % accuracy on bucks, ±3 % on LDOs), thermal shutdown at 150 °C, and OTP-stored startup configuration - eliminating external resistive programming components while maintaining full runtime flexibility via register access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply = 12 regulated outputs for full i.MX8QM DDR4 PMIC1 power tree |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV steps); SW7: 1.0 V–4.1 V - covers CPU core, GPU, memory I/O, and auxiliary rails |
| Current Rating | 2500 mA per buck channel; 400 mA per LDO - supports high-current DDR4 VDDQ/VTT and processor core loads |
| I²C Interface | Up to 3.4 MHz operation - enables fast register writes for dynamic voltage/frequency scaling during runtime transitions |
| OTP Memory | One-time programmable storage for boot configuration - reduces BOM count by replacing external resistor networks for voltage/sequence setup |
| Thermal Range | −40 °C to +105 °C ambient operating temperature - qualified for industrial environments without derating |
| Safety Monitoring | ASIL B–compliant voltage, thermal, and watchdog monitoring - includes ABIST, programmable fault thresholds, and fail-safe output (FSOB) |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, thermally enhanced wettable flank (EPAD connected to GND).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; support ±1.5 % output accuracy across SW1–SW6, ±2 % on SW7 |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7 V–5.5 V input; each requires local input capacitance and proper layout to avoid overvoltage during power-down |
| SW1LX–SW7LX | Switching node outputs | Connect to external inductors; tolerate −3.0 V transient spikes during dead time - require low-inductance PCB routing |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5 V–5.0 V at 400 mA each; support optional load switch mode for controlled peripheral power gating |
| VSNVS | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell - maintains real-time clock and backup memory during main power loss |
| SCL/SDA | I²C interface signals | Support 3.4 MHz Fast Mode Plus - enable real-time DVS, fault logging, and dynamic configuration without MCU reboot |
| PGOOD/INTB/RESETBMCU | System status outputs | Open-drain signals for power-good assertion, interrupt notification, and processor reset coordination - compatible with 1.6 V–3.3 V I/O domains |
| EPAD | Exposed thermal pad | Must be soldered to solid GND plane - provides primary thermal path (RθJC = 0.6 °C/W) and electrical grounding |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | SW1–SW4 configurable as multi-phase regulators up to 10 A total - supports high-current CPU core and GPU rails with reduced ripple and improved transient response |
| VTT termination mode on SW6 | Enables DDR4 VTT supply with programmable current limit and tracking - eliminates need for external VTT regulator in memory subsystems |
| 24-channel analog multiplexer (AMUX) | Allows diagnostic sampling of internal voltages, temperatures, and external sensor inputs - enables predictive failure analysis and system health monitoring |
| Programmable standby/off modes | Reduces quiescent current to <10 µA in deep sleep - extends battery life in always-on industrial edge nodes powered by coin cell or supercapacitor |
| Spread-spectrum switching | Reduces EMI peak emissions by modulating switching frequency - simplifies compliance with CISPR-22 Class B radiated emission limits in compact enclosures |
Applications
| i.MX8QM DDR4 Industrial Gateway | Automotive Infotainment Head Unit |
|---|---|
Use Scenario: Industrial gateway running Linux with dual-core Cortex-A72 + quad-core Cortex-A53, DDR4 memory, PCIe, USB 3.0, and dual Ethernet. IC Role / Device Role / Timing Role: Primary PMIC (PMIC1) supplying CPU cores, DDR4 VDD/VDDQ/VTT, GPU, and I/O rails with synchronized sequencing. Use Value: OTP-configured boot sequence eliminates external configuration components; 3.4 MHz I²C enables runtime DVFS for thermal management under variable compute load. |
Use Scenario: ASIL-B–compliant infotainment head unit using i.MX8QM with LPDDR4, display interfaces, audio codecs, and CAN FD connectivity. IC Role / Device Role / Timing Role: Power manager for application processor and memory subsystem, with safety monitoring and fail-safe signaling via FSOB. Use Value: ASIL B–qualified voltage/thermal monitoring and ABIST self-test ensure functional safety compliance without requiring redundant PMICs. |
| High-Performance Edge AI Camera | Industrial HMI with Secure Boot |
Use Scenario: Vision processing unit with i.MX8QM, MIPI CSI-2 camera sensors, neural network accelerator, and eMMC storage. IC Role / Device Role / Timing Role: Central power controller delivering tightly regulated 0.8 V CPU core, 1.1 V GPU, 1.2 V NN accelerator, and 1.8 V I/O rails. Use Value: Multi-phase buck capability (SW1–SW3 triple-phase) delivers up to 7.5 A for burst-mode AI inference while maintaining <±1.5 % output accuracy. |
Use Scenario: Human-machine interface with secure boot, encrypted firmware, and tamper detection in factory automation equipment. IC Role / Device Role / Timing Role: Trusted power enabler providing authenticated power sequencing, watchdog supervision, and early-warning interrupts (EWARN) to secure MCU. Use Value: OTP-programmed startup ensures deterministic power delivery before secure boot begins; I²C CRC and write protection prevent malicious register manipulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8100ERES | Automotive-qualified (AEC-Q100 Grade 2), ASIL B monitoring, dimple wettable flank HVQFN56 package | Required for automotive infotainment where functional safety certification is mandatory | Select MC33PF8100ERES when ASIL B compliance and automotive qualification are required; MC34PF8100EREP is optimized for cost-sensitive industrial designs without safety certification overhead |
| MC34PF8200DHES | PF8200 variant with enhanced ABIST, fail-safe state machine, secure I²C, and OTP FS bypass capability | Supports higher safety integrity levels and field-upgradable safety configurations | Choose MC34PF8200DHES only if advanced functional safety features (e.g., on-demand ABIST, fail-safe lock-down) are needed; MC34PF8100EREP provides full industrial functionality without safety feature overhead |
Compared with MC33PF8100ERES, MC34PF8100EREP omits automotive qualification and ASIL B hardware safety mechanisms - reducing cost and complexity for industrial gateways where safety certification is not mandated. Versus MC34PF8200DHES, it excludes secure I²C and fail-safe state extensions, making it ideal for deterministic, non-safety-critical embedded systems requiring maximum configurability and minimal footprint.
Availability
MC34PF8100EREP is available at Aetrix Electronics and suitable for industrial gateways, edge AI cameras, HMIs, and i.MX8QM-based embedded systems requiring stable component supply, long-term lifecycle support, and consistent OTP configuration across production batches.
Supply support for MC34PF8100EREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF8100 product line was engineered specifically to serve as the reference PMIC for NXP's i.MX 8 series processors - delivering tightly integrated, OTP-configurable, and I²C-reconfigurable power delivery for high-performance multimedia and real-time embedded workloads.
FAQ
What is the input voltage range supported by the MC34PF8100EREP?
The MC34PF8100EREP accepts a main input voltage (VIN) from 2.7 V to 5.5 V. This range powers all internal regulators and supports common industrial supply rails including 3.3 V and 5 V systems. Absolute maximum rating is 6.0 V, but sustained operation above 5.5 V is limited to ≤1800 seconds over device lifetime per NXP specification.
Does the MC34PF8100EREP support DDR4 memory power requirements?
Yes, the MC34PF8100EREP is explicitly configured for DDR4 memory in i.MX8QM systems as PMIC1. It delivers VDD (1.2 V), VDDQ (1.2 V), and VTT (0.6 V) via SW6 in VTT termination mode, with programmable current limit and tracking - meeting JEDEC DDR4 specifications without external components.
How does the OTP memory in the MC34PF8100EREP reduce system design complexity?
The OTP memory in the MC34PF8100EREP stores boot-time voltage setpoints, power-up/down sequencing order, and default safety thresholds. This eliminates the need for external resistor dividers, EEPROMs, or configuration jumpers - reducing BOM count, PCB area, and startup timing uncertainty in industrial designs.
Can the MC34PF8100EREP operate in automotive environments?
No - the MC34PF8100EREP is an industrial-grade part (not AEC-Q100 qualified) and lacks ASIL B hardware safety features present in automotive variants like MC33PF8100ERES. For automotive use, select the MC33PF8100ERES or MC33PF8200-series parts with certified functional safety architecture.
What thermal performance can be expected from the MC34PF8100EREP in a 4-layer PCB?
In a standard 4-layer board (2s2p), the MC34PF8100EREP achieves RθJA = 27 °C/W under natural convection. With 200 ft/min airflow, RθJMA improves to 22 °C/W. The EPAD must be soldered to a solid GND plane to realize these values - enabling reliable operation up to 105 °C ambient with full 2.5 A per buck channel.
MC34PF8100EREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC34PF8100EREP FAQ
1.How can I place an order for MC34PF8100EREP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF8100EREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF8100EREP reliable?
The price and inventory of MC34PF8100EREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100EREP is usually 5 days.
3.What payment methods are accepted for MC34PF8100EREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF8100EREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF8100EREP?
MC34PF8100EREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF8100EREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF8100EREP?
For technical support, including MC34PF8100EREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100EREP requirements.
6.How does Aetrix verify that MC34PF8100EREP is sourced from the original manufacturer or authorized distributors?
All MC34PF8100EREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100EREP meets industry standards.
7.What is the process for return or replacement of MC34PF8100EREP?
All MC34PF8100EREP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100EREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF8100EREP part is unused and in its original packaging.
Return procedure for MC34PF8100EREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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