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NXP Semiconductors MC34PF8100F3EP

Part No.:
MC34PF8100F3EP
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC34PF8100F3EP.pdf
Description:
POWER MANAGEMENT IC I.MX8 PRE-PR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,062

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Product details

Overview

MC34PF8100F3EP from NXP Semiconductors is an industrial-grade 12-channel power management IC (PMIC) designed for LA1575-based systems with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. Input voltage range is 2.7 V to 5.5 V, and it supports dynamic voltage scaling on six buck channels.

For engineers reviewing the MC34PF8100F3EP datasheet, MC34PF8100F3EP pinout, MC34PF8100F3EP application, or MC34PF8100F3EP equivalent, this page delivers verified technical context, validated pin functions, confirmed regulator specifications, OTP configuration capability, and real-world use cases in industrial embedded systems requiring robust, programmable multi-rail power sequencing.

Technical Context

The MC34PF8100F3EP implements a deterministic state machine for startup, fault handling, and power-state transitions - including standby, run, fail-safe, and hard reset modes - with built-in self-test (ABIST) and thermal shutdown at 150 °C. Its 3.4 MHz I²C interface enables real-time register tuning of output voltages, sequencing, soft-start, and protection thresholds post-boot.

It features dual-phase and triple-phase buck configurations (e.g., SW1+SW2 as dual-phase; SW1+SW2+SW3 as triple-phase up to 7.5 A), VTT termination mode on SW6, spread-spectrum switching, and 24-channel analog multiplexer for system diagnostics. The OTP memory stores boot-critical settings, eliminating external resistor networks for voltage and sequence setup.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.7 V to 5.5 V VIN - supports wide-input industrial supplies and battery-backed operation
Buck Regulators 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5 % accuracy, 2.5 A); SW7 (1.0–4.1 V, ±2 %, 2.5 A)
LDO Regulators 4 channels: LDO1–LDO4 (1.5–5.0 V, ±3 % accuracy, 400 mA each, optional load switch)
RTC & Backup VSNVS output (1.8/3.0/3.3 V, 10 mA); LICELL input (up to 4.2 V) with programmable coin cell charging
I²C Interface High-speed mode up to 3.4 MHz - enables fast runtime reconfiguration without interrupting system operation
Safety Compliance ASIL B monitoring circuitry: independent voltage/thermal/fault detection, ABIST, PGOOD, and watchdog with programmable timeout
Package HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, thermally enhanced wettable flank (EPAD grounded)

Pinout & Package

HVQFN56 package with exposed thermal pad (EPAD), 56-pin layout optimized for thermal dissipation and high-density PCB routing. Pin 1 marked via laser scribe; EPAD must be soldered to solid ground plane for thermal and electrical integrity.

Pin/Terminal Circuit Role Design Meaning
VIN (Pin 50) Main PMIC input supply Accepts 2.7–5.5 V; powers internal LDOs and buck controller logic; requires local bulk capacitance
SW1FB–SW7FB (Pins 2,3,12,13,30,31,38) Buck feedback inputs Resistive divider inputs for closed-loop regulation; support ±1.5 % (SW1–SW6) or ±2 % (SW7) output accuracy
SW1LX–SW7LX (Pins 5,6,9,10,33,34,36) Buck switching node outputs Connect to external inductor; tolerate −3.0 V transient spikes during dead time; require low-inductance layout
LDO1OUT–LDO4OUT (Pins 15,18,25,28) Linear regulator outputs Deliver 1.5–5.0 V @ 400 mA; support load-switch mode for rail gating and power domain isolation
VSNVS (Pin 47) RTC backup supply Provides 1.8/3.0/3.3 V @ 10 mA; sourced from VIN or LICELL; enables always-on memory retention
SCL/SDA (Pins 55/56) I²C interface signals Support 3.4 MHz Fast Mode Plus; require pull-up to VDDIO (1.6–3.3 V); enable full register access and runtime tuning

Key Features

Feature Design Value
OTP-configurable startup Eliminates external resistors for voltage setpoints and power-up sequencing - reduces BOM count and board area
Dual/triple/quad-phase buck capability SW1–SW4 configurable as quad-phase regulator delivering up to 10 A - supports high-current CPU/GPU cores
VTT termination on SW6 Enables DDR memory termination compliance without external components - simplifies LPDDR4/DDR4 interface design
24-channel analog multiplexer Allows system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input - reduces external sensing components
ASIL B functional safety architecture Includes independent voltage monitors, thermal shutdown, watchdog with counter, CRC-protected registers, and ABIST - meets automotive-adjacent industrial requirements
Programmable soft-start & power-down Prevents inrush current and ensures controlled rail ramp-up/down - critical for avoiding processor brownouts during boot/shutdown

Applications

Industrial Edge Gateway LA1575-Based Telematics Unit

Use Scenario: High-reliability edge gateway processing cellular, GNSS, and CAN data in harsh temperature environments (−40 °C to +105 °C).

IC Role / Device Role / Timing Role: Primary PMIC supplying LA1575 SoC core, LPDDR4 memory, RF front-end, and peripheral interfaces with precise sequencing and fault recovery.

Use Value: OTP-stored startup configuration ensures deterministic boot across temperature extremes; ASIL B monitoring enables safe failover during voltage/thermal faults.

Use Scenario: In-vehicle telematics unit integrating LA1575 GNSS + LTE modem, requiring always-on RTC, secure boot power, and DDR memory regulation.

IC Role / Device Role / Timing Role: Single-chip power solution for LA1575, providing VSNVS-backed RTC, LPDDR4 VDD/VTT rails, and isolated I/O supplies.

Use Value: Integrated coin cell charger and VSNVS LDO eliminate discrete backup circuitry; VTT mode on SW6 directly supports LPDDR4 termination specs.

Industrial HMI Controller Secure Industrial IoT Node

Use Scenario: Fanless HMI panel with i.MX 8-derived LA1575, driving high-resolution display and touch interface under continuous operation.

IC Role / Device Role / Timing Role: Manages multi-rail power for CPU, GPU, DDR, display interface (LVDS/eDP), and USB peripherals with dynamic voltage scaling.

Use Value: DVS on SW1–SW6 enables real-time performance/power trade-offs; 24-channel AMUX supports on-board thermal and rail health monitoring.

Use Scenario: Tamper-resistant IoT sensor node with secure boot, encrypted storage, and long-term battery backup.

IC Role / Device Role / Timing Role: Provides regulated power to secure element, MCU, sensors, and radio while maintaining RTC and memory retention during main power loss.

Use Value: Programmable watchdog and early-warning interrupt (EWARN) enable firmware-level fault containment; LICELL charging extends offline operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC34PF8200F3EP Includes ASIL B safety features not present in MC34PF8100F3EP: FSOB fail-safe output, ABIST on-demand, secure I²C write, and fault counter lock-down Required for automotive ASIL B-certified designs; not needed for industrial QM-grade systems where functional safety is not mandated Select MC34PF8200F3EP only if formal ASIL B compliance, fail-safe state assertion, or safety-critical fault containment is required
MC33PF8100F3ES Automotive-qualified (AEC-Q100 Grade 2), same OTP configuration and regulator topology, but rated for −40 °C to +125 °C junction temperature Targeted for automotive infotainment and ADAS; includes automotive-specific qualification testing and traceability Choose MC33PF8100F3ES for automotive programs; MC34PF8100F3EP is optimized for cost-sensitive industrial applications with QM safety grade

Compared with MC34PF8200F3EP and MC33PF8100F3ES, the MC34PF8100F3EP delivers identical power architecture and industrial temperature support at lower cost and complexity - ideal for LA1575-based systems where ASIL B certification or automotive qualification is unnecessary.

Availability

MC34PF8100F3EP is available at Aetrix Electronics and suitable for industrial edge gateways, LA1575-based telematics units, and secure IoT nodes requiring stable component supply, long-term lifecycle support, and QM-grade functional safety compliance.

Supply support for MC34PF8100F3EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in application processors and power management.

The PF8100 product line targets high-performance embedded systems based on NXP i.MX and LA-series processors, delivering integrated, OTP-programmable, and safety-aware power solutions for complex multi-rail architectures.

FAQ

What is the primary target processor for the MC34PF8100F3EP?

The MC34PF8100F3EP is specifically configured for the LA1575 processor with LPDDR4 memory, as indicated in NXP's official ordering information. It provides optimized voltage rails, sequencing, and termination support for that platform - unlike variants tuned for i.MX 8QM or i.MX 8QXP. The OTP configuration file MC34PF8100F3.zip confirms this mapping.

Does the MC34PF8100F3EP support ASIL B functional safety?

No - the MC34PF8100F3EP is qualified to QM (Quality Management) level per ISO 26262, not ASIL B. It includes monitoring circuits and watchdog functionality, but lacks the fail-safe output (FSOB), secure register writes, and ABIST-on-demand features found in the ASIL B-capable MC34PF8200F3EP variant.

What package type and thermal characteristics does the MC34PF8100F3EP use?

The MC34PF8100F3EP uses the HVQFN56 package (SOT684-21), 8 mm × 8 mm × 0.85 mm, with wettable flanks and exposed thermal pad. Its thermal resistance is RθJA = 27 °C/W on a 4-layer board, enabling reliable operation up to +105 °C ambient with proper PCB copper pour and thermal vias under the EPAD.

Can the MC34PF8100F3EP be used with DDR4 memory instead of LPDDR4?

No - the MC34PF8100F3EP's OTP configuration is fixed for LPDDR4 memory on the LA1575 platform. While the PMIC hardware supports VTT and voltage ranges compatible with DDR4, the pre-programmed startup sequence, timing, and rail dependencies are specific to LPDDR4. For DDR4, NXP specifies MC34PF8100EREP or MC34PF8100CHER.

How is the MC34PF8100F3EP programmed for custom voltage settings?

The MC34PF8100F3EP uses one-time programmable (OTP) memory for factory-set parameters like default voltages and power-up sequence. Runtime adjustments are made via its 3.4 MHz I²C interface - allowing engineers to dynamically tune output voltages, enable/disable rails, configure DVS, and modify protection thresholds after system boot without OTP reprogramming.

MC34PF8100F3EP Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
High Performance i.MX 8, S32x Processor Based
Current - Supply:
-
Voltage - Supply:
2.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC34PF8100F3EP FAQ

1.How can I place an order for MC34PF8100F3EP through Aetrix?

Please submit a Request for Quotation (RFQ) for MC34PF8100F3EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC34PF8100F3EP reliable?

The price and inventory of MC34PF8100F3EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100F3EP is usually 5 days.

3.What payment methods are accepted for MC34PF8100F3EP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF8100F3EP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC34PF8100F3EP?

MC34PF8100F3EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC34PF8100F3EP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC34PF8100F3EP?

For technical support, including MC34PF8100F3EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100F3EP requirements.

6.How does Aetrix verify that MC34PF8100F3EP is sourced from the original manufacturer or authorized distributors?

All MC34PF8100F3EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100F3EP meets industry standards.

7.What is the process for return or replacement of MC34PF8100F3EP?

All MC34PF8100F3EP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100F3EP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC34PF8100F3EP part is unused and in its original packaging.

Return procedure for MC34PF8100F3EP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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