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NXP Semiconductors MC34PF8100F3EPR2

Part No.:
MC34PF8100F3EPR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC34PF8100F3EPR2.pdf
Description:
POWER MANAGEMENT IC I.MX8 PRE-PR
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,902

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Product details

Overview

MC34PF8100F3EPR2 from NXP Semiconductors is an industrial-grade 12-channel power management IC (PMIC) designed for LA1575-based systems with LPDDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. Input voltage range is 2.7 V to 5.5 V, and it supports dynamic voltage scaling across six buck channels for processor core and memory rail optimization.

For engineers reviewing the MC34PF8100F3EPR2 datasheet, MC34PF8100F3EPR2 pinout, MC34PF8100F3EPR2 application, or MC34PF8100F3EPR2 equivalent, this page delivers verified specifications, validated pin functions, confirmed industrial use cases for LPDDR4-powered edge devices, and two technically documented alternative PMICs compatible with i.MX 8 and LA1575 platforms.

Technical Context

The MC34PF8100F3EPR2 implements a deterministic state machine for fault-aware power sequencing, with OTP-programmed startup configuration and runtime I²C reconfiguration at up to 3.4 MHz. Its seven buck regulators include SW1–SW6 (0.4 V–1.8 V, ±1.5 % accuracy, 2.5 A each) and SW7 (1.0 V–4.1 V, ±2 %, 2.5 A), supporting multi-phase configurations (dual/triple/quad) and VTT termination on SW6.

Four P-type LDOs (LDO1–LDO4) deliver 1.5 V–5.0 V at 400 mA with ±3 % accuracy and optional load-switch mode. Integrated safety features include independent voltage/thermal monitoring, ABIST, programmable watchdog timeout, and fail-safe output (FSOB), all meeting ASIL B functional safety requirements per ISO 26262.

Key Specifications

Parameter Value and Actual Design Meaning
Regulator Count 12 total: 7 buck (SW1–SW7) + 4 LDO (LDO1–LDO4) + VSNVS RTC supply
Input Voltage Range 2.7 V to 5.5 V VIN - supports single-supply operation from common industrial rails
Buck Output Accuracy ±1.5 % for SW1–SW6; ±2 % for SW7 - ensures stable core/memory voltage under load transients
I²C Interface Speed Up to 3.4 MHz - enables fast runtime configuration and telemetry updates without bus contention
Thermal Operating Range −40 °C to +105 °C ambient - qualified for extended industrial temperature environments
Safety Certification ASIL B monitoring circuit - provides independent fault detection for voltage, thermal, and watchdog events
Package HVQFN56, 8 mm × 8 mm × 0.85 mm - thermally enhanced, wettable flank variant for reliable reflow and thermal dissipation

Pinout & Package

HVQFN56 package (SOT684-21), 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, exposed thermal pad (EPAD) connected to GND.

Pin/Terminal Circuit Role Design Meaning
SW1FB–SW7FB Buck feedback inputs Enable precise closed-loop regulation of each buck output; support external resistor divider tuning
SW1IN–SW7IN Buck input supplies Accept main input (VIN) or intermediate rail; require local decoupling and current-handling layout
SW1LX–SW7LX Switching node outputs Drive external inductors; tolerate −3.0 V transient spikes during dead time - demand low-inductance PCB routing
LDO1OUT–LDO4OUT LDO regulated outputs Provide low-noise analog/digital supplies; support load-switch mode for power gating peripherals
VSNVS RTC supply output Delivers 1.8 V / 3.0 V / 3.3 V at 10 mA - powered from VIN or coin cell (LICELL) for battery-backed real-time clock
SCL / SDA I²C interface High-speed (3.4 MHz) bidirectional control bus - requires pull-up resistors and noise filtering for robust communication
PGOOD / INTB / RESETBMCU Status and control signals Open-drain outputs for system-level power-good assertion, interrupt generation, and MCU reset coordination
EPAD Exposed thermal pad Must be soldered to solid GND plane - critical for thermal performance (RθJC = 0.6 °C/W)

Key Features

Feature Design Value
OTP-configurable startup sequence Eliminates external resistors and timing components - reduces BOM count and board area for fixed-function boot
Dual/triple/quad-phase buck configuration Enables scalable current delivery: SW1+SW2 = 5 A dual-phase; SW1+SW2+SW3 = 7.5 A triple-phase; SW1–SW4 = 10 A quad-phase
VTT termination on SW6 Directly powers DDR memory termination networks - avoids need for external VTT regulator in LPDDR4 designs
24-channel analog multiplexer (AMUX) Supports system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input
Programmable soft-start and power-down sequencing Prevents inrush current and ensures safe power-state transitions - configurable per rail via I²C or OTP
Coin cell charger with programmable current/voltage Maintains RTC backup during main power loss - configurable charge profile prevents overcharging of Li-MnO₂ or alkaline cells

Applications

Automotive Infotainment Head Unit Industrial Edge Gateway

Use Scenario: Powering i.MX 8QM processor, LPDDR4 memory, and display/video subsystems in vehicle head units operating at −40 °C to +105 °C.

IC Role / Device Role / Timing Role: Primary PMIC managing CPU core (SW1–SW3), GPU (SW4), DDR4 memory (SW5–SW6), and RTC (VSNVS).

Use Value: OTP-programmed sequencing eliminates external timing components; ASIL B monitoring satisfies automotive functional safety requirements.

Use Scenario: Supplying LA1575 GNSS SoC with LPDDR4 memory and RF front-end in ruggedized outdoor gateways.

IC Role / Device Role / Timing Role: Single-chip power solution delivering 12 regulated rails including VDD_CORE, VDD_IO, VTT, and coin-cell-backed RTC.

Use Value: High integration reduces component count; spread-spectrum switching minimizes EMI in dense RF environments.

High-End Consumer Media Hub Medical Imaging Control Module

Use Scenario: Powering i.MX 8QXP-based media hubs with HDMI, USB 3.0, and multi-camera interfaces in home automation systems.

IC Role / Device Role / Timing Role: Central PMIC generating 1.0 V CPU, 1.1 V GPU, 1.8 V I/O, 0.6 V VTT, and 3.3 V peripheral rails.

Use Value: Dynamic voltage scaling on six buck channels enables real-time power/performance optimization during video decode.

Use Scenario: Supporting FPGA-based image processing modules requiring tightly regulated, low-noise analog and digital supplies in diagnostic equipment.

IC Role / Device Role / Timing Role: Supplies FPGA core (SW1), transceiver banks (SW2–SW4), DDR memory (SW5–SW6), and analog sensors (LDO1–LDO4).

Use Value: ±1.5 % buck accuracy and ±3 % LDO accuracy ensure signal integrity for high-resolution ADC/DAC interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC34PF8200FJTS Includes full ASIL B safety features (ABIST, FSOB, secure I²C, fail-safe state) not present in MC34PF8100F3EPR2 Required for automotive ASIL B-certified systems; not needed for industrial LA1575 applications Select MC34PF8200FJTS only if functional safety certification is mandated; otherwise MC34PF8100F3EPR2 offers lower cost and identical power capability
MPQ4436-AEC1 Single 3A buck converter (no integrated LDOs, no OTP, no I²C, no safety monitoring) Requires external LDOs, sequencer, and safety logic - increases design complexity and footprint Use MPQ4436-AEC1 only for simple point-of-load replacement; MC34PF8100F3EPR2 provides full-system integration for LA1575 platforms

Compared with MC34PF8200FJTS, MC34PF8100F3EPR2 omits redundant safety logic for industrial use, reducing cost and enabling faster qualification. Versus MPQ4436-AEC1, it delivers complete 12-rail power architecture with sequencing, monitoring, and memory interface support - eliminating 11 discrete regulators and associated passive components.

Availability

MC34PF8100F3EPR2 is available at Aetrix Electronics and suitable for industrial edge gateways, LA1575-based GNSS modules, and i.MX 8QXP media hubs requiring stable component supply, long-term lifecycle support, and automotive-qualified reliability in extended temperature environments.

Supply support for MC34PF8100F3EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.

The PF8100 product line targets high-performance multimedia SoCs like i.MX 8 and LA1575, delivering fully integrated, OTP-configurable, and safety-aware power architectures to simplify complex system power design.

FAQ

What is the input voltage range supported by the MC34PF8100F3EPR2?

The MC34PF8100F3EPR2 supports a main input voltage range of 2.7 V to 5.5 V on its VIN pin. This allows direct connection to common industrial power rails such as 3.3 V or 5 V supplies. The device also accepts coin cell input (LICELL) up to 4.2 V for RTC backup, and regulator-specific inputs (e.g., SW1IN, LDO12IN) share the same absolute maximum rating of −0.3 V to 6.0 V.

Does the MC34PF8100F3EPR2 support dynamic voltage scaling (DVS)?

Yes, the MC34PF8100F3EPR2 supports dynamic voltage scaling on SW1 through SW6 - all six primary buck regulators. DVS is implemented via I²C commands that adjust output voltage in 6.25 mV steps within their respective ranges (0.4 V–1.8 V). This enables real-time power/performance tuning for LA1575 and i.MX 8 processors during varying computational loads.

How does the MC34PF8100F3EPR2 handle functional safety requirements?

The MC34PF8100F3EPR2 includes a monitoring circuit certified to ASIL B per ISO 26262, featuring independent voltage/thermal fault detection, programmable watchdog timeout, ABIST, and fail-safe output (FSOB). While it lacks the full safety feature set of the PF8200 (e.g., secure I²C, fail-safe state), its ASIL B monitoring is sufficient for industrial systems where functional safety is required but full automotive certification is not mandated.

Can the MC34PF8100F3EPR2 power LPDDR4 memory directly?

Yes, the MC34PF8100F3EPR2 is explicitly configured for LPDDR4 memory support in LA1575 systems. SW5 and SW6 provide core and I/O supplies, while SW6 operates in VTT termination mode - eliminating the need for an external VTT regulator. The OTP configuration file MC34PF8100F3.zip confirms LPDDR4-specific startup sequences and voltage settings for this exact part number.

What package type and thermal characteristics does the MC34PF8100F3EPR2 use?

The MC34PF8100F3EPR2 uses the HVQFN56 (SOT684-21) package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, with wettable flanks. Its thermal resistance is RθJA = 27 °C/W on a 4-layer board and RθJC = 0.6 °C/W to the case bottom. The exposed EPAD must be soldered to a solid GND plane to achieve rated thermal performance and sustain 10 A aggregate output current.

MC34PF8100F3EPR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
High Performance i.MX 8, S32x Processor Based
Current - Supply:
-
Voltage - Supply:
2.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC34PF8100F3EPR2 FAQ

1.How can I place an order for MC34PF8100F3EPR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC34PF8100F3EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC34PF8100F3EPR2 reliable?

The price and inventory of MC34PF8100F3EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8100F3EPR2 is usually 5 days.

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MC34PF8100F3EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC34PF8100F3EPR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC34PF8100F3EPR2?

For technical support, including MC34PF8100F3EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8100F3EPR2 requirements.

6.How does Aetrix verify that MC34PF8100F3EPR2 is sourced from the original manufacturer or authorized distributors?

All MC34PF8100F3EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8100F3EPR2 meets industry standards.

7.What is the process for return or replacement of MC34PF8100F3EPR2?

All MC34PF8100F3EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8100F3EPR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC34PF8100F3EPR2 part is unused and in its original packaging.

Return procedure for MC34PF8100F3EPR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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