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NXP Semiconductors MC34PF8101A0EP
- Part No.:
- MC34PF8101A0EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC34PF8101A0EP.pdf
- Description:
- IC POWER MANAGEMENT
- Quantity:
- Payment:
- Shipping:
Inventory:4,523
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Product details
Overview
MC34PF8101A0EP from NXP Semiconductors is an industrial-grade 9-channel power management IC (PMIC) designed for i.MX 8-series application processors. It integrates five high-efficiency buck converters (SW1–SW7, with SW7 independent), three linear regulators (LDO1–LDO3), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–capable monitoring circuitry. It powers CPU cores, DDR I/O, GPU, SCU, and peripherals in high-performance embedded systems.
For engineers reviewing the MC34PF8101A0EP datasheet, MC34PF8101A0EP pinout, MC34PF8101A0EP application, or MC34PF8101A0EP equivalent, this page delivers verified regulator accuracy (±1.5 % for SW1–SW6), OTP-configurable startup sequencing, 3.4 MHz I²C interface, thermal shutdown protection, and HVQFN56 package details - all critical for i.MX 8 system power architecture validation and BOM selection.
Technical Context
The MC34PF8101A0EP implements a deterministic state machine for seamless processor handshaking, supporting programmable soft-start/power-down sequences, dynamic voltage scaling on SW1/SW2/SW5/SW6, and dual-phase configuration options for SW1+SW2 and SW5+SW6. Its integrated 24-channel analog multiplexer enables real-time system diagnostics across voltage rails and temperature sensors.
It features dedicated safety infrastructure including independent voltage monitors, thermal protection (TJ max = 150 °C), ABIST-capable self-test logic (though ABIST-on-demand and fail-safe state are disabled vs. PF8201), and I²C CRC write protection - meeting QM functional safety requirements for industrial applications without ASIL B certification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 9 channels: 5 buck (SW1–SW7), 3 LDOs (LDO1–LDO3), + VSNVS RTC/coin-cell supply |
| Buck Output Range | SW1–SW6: 0.4 V to 1.8 V (6.25 mV steps); SW7: 1.0 V to 4.1 V - supports core, I/O, and memory rail flexibility |
| Current Rating | 2500 mA per buck; 400 mA per LDO; 10 mA VSNVS - sufficient for i.MX 8 CPU, GPU, DDR, and peripheral loads |
| Accuracy | ±1.5 % for SW1–SW6; ±2 % for SW7; ±3 % for LDO1–LDO3 - ensures stable operation under load transients |
| I²C Interface | Up to 3.4 MHz high-speed mode - enables rapid runtime reconfiguration of voltage, sequencing, and DVS states |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank - optimized for thermal dissipation in dense PCB layouts |
| Operating Temp | −40 °C to +105 °C ambient - validated for industrial environments with self-heating margin to 150 °C junction |
Pinout & Package
HVQFN56 thermally enhanced plastic quad flat package (SOT684-21), 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, exposed pad (EPAD) connected to GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 50) | Main input supply | Accepts 2.7 V–5.5 V input; powers internal regulators and LDO inputs - primary PMIC energy source |
| SW1FB (Pin 3), SW2FB (Pin 2), SW5FB (Pin 31), SW6FB (Pin 30), SW7FB (Pin 38) | Buck feedback inputs | Resistor-divider nodes for closed-loop output voltage regulation - enable precise rail tuning |
| LDO1OUT (Pin 15), LDO2OUT (Pin 18), LDO3OUT (Pin 25) | LDO regulated outputs | Provide low-noise, fixed/programmable analog/digital supplies (1.5 V–5.0 V) with optional load switch control |
| VSNVS (Pin 47) | RTC supply output | Delivers 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or LICELL - maintains real-time clock during main power loss |
| SCL (Pin 55), SDA (Pin 56) | I²C interface | Support up to 3.4 MHz communication for runtime configuration, monitoring, and fault reporting |
| PGOOD (Pin 42), INTB (Pin 24), RESETBMCU (Pin 21) | System control signals | Open-drain status outputs for power-good assertion, interrupt generation, and MCU reset coordination |
| EPAD (Pin 57) | Exposed thermal pad | Must be soldered to PCB ground plane - provides primary thermal path (RθJC = 0.6 °C/W) and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates external resistor networks for voltage setpoints and power-up sequence - reduces BOM count and layout complexity |
| Dual-phase buck capability | SW1+SW2 or SW5+SW6 can be paralleled to deliver up to 5 A with interleaved switching - lowers output ripple and improves transient response |
| VTT termination mode | SW6 supports DDR VTT termination (0.4 V–1.8 V) with programmable current limit - simplifies high-speed memory interface design |
| 24-channel analog multiplexer | Enables centralized monitoring of rail voltages, die temperature, and external sensors via single ADC input - reduces system-level diagnostic component count |
| Programmable standby/off modes | Reduces quiescent current during low-power states while retaining RTC and wake-up capability - extends battery-backed operation time |
Applications
| Industrial HMI Panel | i.MX 8-Based Edge Gateway |
|---|---|
Use Scenario: Touch-enabled factory floor display with Ethernet, USB, and CAN connectivity running Linux-based UI. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1/SW2), DDR I/O (SW6), GPU (SW7), SCU (LDO2), and RTC (VSNVS). Use Value: OTP-configured sequencing ensures deterministic boot; 105 °C operation sustains reliability in uncooled enclosures; I²C runtime tuning adapts rail voltages to workload changes. |
Use Scenario: Secure, fanless edge node aggregating sensor data, performing AI inference, and forwarding to cloud via LTE/Wi-Fi. IC Role / Device Role / Timing Role: Centralized power controller delivering regulated rails to i.MX 8 QuadMax, LPDDR4, eMMC, SIM card, and crypto co-processor. Use Value: Dual-phase SW1+SW2 supports 4 GHz CPU burst loads; VTT mode on SW6 meets DDR4-2400 termination specs; coin cell backup preserves timekeeping during mains failure. |
| Medical Imaging Control Unit | High-End Industrial PLC |
Use Scenario: Real-time ultrasound control module requiring deterministic timing, low-noise analog supplies, and fail-safe shutdown. IC Role / Device Role / Timing Role: Powers ARM Cortex-A72 cluster (SW1/SW2), image signal processor (SW7), ADC reference (LDO1), and FPGA I/O (SW6). Use Value: ±1.5 % buck accuracy ensures stable clock domain operation; thermal monitoring prevents overheating during sustained imaging sessions; PGOOD/INTB enable coordinated system-level fault response. |
Use Scenario: Modular automation controller with hot-swap I/O modules, EtherCAT master, and redundant power inputs. IC Role / Device Role / Timing Role: Supplies CPU (SW1), FPGA fabric (SW5), SERDES (SW7), isolated I/O banks (LDO3), and RTC (VSNVS) from dual-input redundancy circuitry. Use Value: Spread-spectrum switching reduces EMI in noise-sensitive control loops; programmable soft-start prevents inrush current on module insertion; watchdog integration ensures deterministic recovery after firmware hang. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8101A0ES | Automotive-qualified (AEC-Q100 Grade 2), wettable flank HVQFN56, same OTP and regulator specs - differs only in qualification grade and package finish. | Required for automotive infotainment or ADAS subsystems where temperature range (−40 °C to +125 °C) and qualification are mandatory. | Select MC33PF8101A0ES when automotive compliance (AEC-Q100) and extended temp operation are required; otherwise MC34PF8101A0EP suffices for industrial use. |
| MC34PF8201A0TS | ASIL B–certified variant with ABIST-on-demand, fail-safe state (FSOB), secure I²C writes, and enhanced self-test - not available in MC34PF8101A0EP. | Targeted at functional safety–critical applications (e.g., industrial safety controllers, medical devices) requiring ISO 26262 or IEC 61508 compliance. | Choose MC34PF8201A0TS only if ASIL B safety mechanisms (fail-safe transition, FSOB assertion, secure register access) are architecturally required - adds cost and complexity. |
Compared with MC33PF8101A0ES, MC34PF8101A0EP trades automotive qualification for lower cost and simplified sourcing in industrial settings; compared with MC34PF8201A0TS, it omits safety-critical ABIST and fail-safe logic - making it ideal for non-safety-rated high-performance embedded systems where deterministic power delivery and thermal robustness are primary concerns.
Availability
MC34PF8101A0EP is available at Aetrix Electronics and suitable for industrial HMI panels, i.MX 8-based edge gateways, and medical imaging control units requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MC34PF8101A0EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF8101 product line targets high-performance i.MX 8 processor platforms, delivering integrated, OTP-configurable power solutions that reduce external component count while enabling flexible runtime control - specifically engineered for industrial and commercial embedded systems demanding reliability and scalability.
FAQ
What is the key functional difference between MC34PF8101A0EP and MC34PF8201A0TS?
The MC34PF8101A0EP is a QM-grade industrial PMIC without ASIL B safety features, whereas MC34PF8201A0TS includes ABIST-on-demand, fail-safe state (FSOB), secure I²C writes, and enhanced self-test logic. MC34PF8101A0EP supports identical regulator topology and I²C functionality but lacks certified safety mechanisms - making it appropriate for non-safety-critical industrial designs where cost and simplicity are prioritized over functional safety certification.
Does MC34PF8101A0EP support dynamic voltage scaling (DVS) on all buck regulators?
Yes, MC34PF8101A0EP supports DVS on SW1, SW2, SW5, and SW6 - allowing real-time adjustment of output voltage via I²C to match processor performance states. SW7 does not support DVS and is configured as a fixed-output or one-time-programmed rail. DVS capability is implemented in hardware and enabled through OTP or runtime register writes, with step resolution of 6.25 mV for SW1–SW6.
What is the role of the VSNVS output on MC34PF8101A0EP, and how is it powered?
The VSNVS output on MC34PF8101A0EP provides a selectable 1.8 V / 3.0 V / 3.3 V supply at up to 10 mA for real-time clock (RTC) and battery-backed memory. It is powered either from the main VIN input or from an external coin cell connected to the LICELL pin (Pin 46). The PMIC automatically switches to coin cell backup when VIN drops below UVLO threshold, ensuring continuous RTC operation during main power loss.
Can MC34PF8101A0EP be used with i.MX 6 series processors?
Yes, MC34PF8101A0EP is explicitly supported for high-end i.MX 6 series processors in addition to i.MX 8. Its 9-channel architecture, wide output voltage ranges (0.4 V–4.1 V), and programmable sequencing accommodate the diverse rail requirements of i.MX 6Quad/DualPlus SoCs - including CPU cores, DDR, GPU, and peripheral I/O. NXP documentation confirms compatibility across both families with minor OTP configuration adjustments.
What thermal performance can be expected from MC34PF8101A0EP in a standard 4-layer PCB layout?
In a standard 4-layer PCB (2s2p) with proper EPAD grounding, MC34PF8101A0EP achieves RθJA = 27 °C/W under natural convection and RθJMA = 22 °C/W at 200 ft/min airflow. This allows sustained operation up to 105 °C ambient with full regulator loading, provided total power dissipation remains within thermal limits - verified by NXP's JEDEC-compliant characterization using JESD51-2 and JESD51-6 standards.
MC34PF8101A0EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC34PF8101A0EP FAQ
1.How can I place an order for MC34PF8101A0EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC34PF8101A0EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC34PF8101A0EP reliable?
The price and inventory of MC34PF8101A0EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC34PF8101A0EP is usually 5 days.
3.What payment methods are accepted for MC34PF8101A0EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC34PF8101A0EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC34PF8101A0EP?
MC34PF8101A0EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC34PF8101A0EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC34PF8101A0EP?
For technical support, including MC34PF8101A0EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC34PF8101A0EP requirements.
6.How does Aetrix verify that MC34PF8101A0EP is sourced from the original manufacturer or authorized distributors?
All MC34PF8101A0EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC34PF8101A0EP meets industry standards.
7.What is the process for return or replacement of MC34PF8101A0EP?
All MC34PF8101A0EP units undergo pre-shipment inspection (PSI). If there is an issue with MC34PF8101A0EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC34PF8101A0EP part is unused and in its original packaging.
Return procedure for MC34PF8101A0EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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