Microchip Technology MCP16501TC-E/RMB

Overview

MCP16501TC-E/RMB from Microchip Technology is a highly integrated power management IC (PMIC) designed for embedded MPUs including SAMA5DX, SAM9X6, and SAMA7G families. It delivers three 1A synchronous buck regulators (2 MHz PWM, 100% duty cycle), one 300 mA LDO, ±1% output voltage accuracy on DDR (Buck2) and core (Buck3) rails, and automotive-grade AEC-Q100 qualification for industrial and automotive MPU power systems.

For engineers reviewing the MCP16501TC-E/RMB datasheet, MCP16501TC-E/RMB pinout, MCP16501TC-E/RMB application, or MCP16501TC-E/RMB equivalent, key selection criteria include its MPU-specific sequencing logic, pin-selectable DDR/core voltages (e.g., Buck2: 1.2V/1.35V/1.8V; Buck3: 1.0V/1.15V/1.25V), low-quiescent-current hibernate mode (110 µA), and 24-pin 4 mm × 4 mm VQFN package with thermal pad.

Technical Context

The MCP16501TC-E/RMB implements peak current-mode control across all three buck channels, with internal slope compensation optimized for 1.5–2.2 µH inductors and fixed 2 MHz switching frequency in forced PWM mode. Each buck supports pre-biased start-up and active discharge via integrated 25 Ω resistors.

Its MPU interface includes dedicated sequencing signals (nSTRT, PWRHLD, LPM), open-drain status outputs (nRSTO, nSTRTO), and three-state SELV2/SELV3 pins enabling precise, resistor-free DDR/core voltage selection - eliminating feedback resistor tolerance errors while supporting LPDDR2 memory compatibility per device variant.

Key Specifications

Pinout & Package

Package: 24-pin 4 mm × 4 mm VQFN with exposed thermal pad (EP), rated for -40°C to +125°C junction temperature and qualified to AEC-Q100 Grade 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with TPS65023BRSBR and MCP16502T-E/MB, the MCP16501TC-E/RMB provides tighter voltage accuracy (±1% vs ±2%), lower hibernate IQ (110 µA vs 250 µA), and MPU-tailored sequencing - making it optimal for Microchip eMPU designs where BOM count, thermal performance, and firmware simplicity are critical.

Availability

MCP16501TC-E/RMB is available at Aetrix Electronics and suitable for industrial HMI, automotive infotainment, and edge gateway applications requiring stable component supply, AEC-Q100 compliance, and long-term MPU platform support.

Supply support for MCP16501TC-E/RMB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a leading provider of microcontrollers, analog devices, and power management ICs, serving industrial, automotive, and consumer markets with high-reliability silicon and development tools.

The MCP16501 product line delivers cost- and size-optimized PMICs specifically engineered for Microchip's SAMA5DX, SAM9X6, and SAMA7G embedded MPUs - integrating power sequencing, DDR memory support, and hibernate mode logic into a single 4 mm × 4 mm package.

FAQ

What is the function of the SELV2 and SELV3 pins on the MCP16501TC-E/RMB?

The SELV2 and SELV3 pins on the MCP16501TC-E/RMB are three-state inputs that configure the output voltage of Buck2 (DDR rail) and Buck3 (core rail), respectively. SELV2 selects among 1.2V, 1.35V, or 1.8V for VOUT2; SELV3 selects among 1.0V, 1.15V, or 1.25V for VOUT3. This resistor-free method ensures ±1% accuracy and simplifies voltage migration across memory generations without changing the BOM.

Does the MCP16501TC-E/RMB support LPDDR2 memory interfaces?

Yes, the MCP16501TC-E/RMB supports LPDDR2 memory interfaces when configured as the MCP16501D variant. The device achieves this through its pin-selectable Buck2 output (1.2V nominal), built-in hibernate mode sequencing, and nRSTO timing aligned to LPDDR2 self-refresh entry/exit requirements - as validated in the application schematic with SAMA5D2 and LPDDR2.

What is the maximum junction temperature and thermal resistance of the MCP16501TC-E/RMB?

The MCP16501TC-E/RMB has a maximum junction temperature of +150°C and an operating junction temperature range of -40°C to +125°C. Its package thermal resistance θJA is 38°C/W, measured in standard JEDEC 2-layer board conditions. The exposed pad (EP) must be soldered to a thermal plane with multiple vias to achieve this rating and sustain full 1A load per buck channel continuously.

How does the MCP16501TC-E/RMB enter hibernate mode?

The MCP16501TC-E/RMB enters hibernate mode when the LPM pin is driven high and PWRHLD remains high. In this state, Buck2 remains active to maintain LPDDR2 self-refresh voltage while Buck1 and Buck3 shut down, reducing total quiescent current to 110 µA typical. The LDO stays enabled if LEN is asserted, supporting analog retention circuits during hibernate.

What protection features are integrated into the MCP16501TC-E/RMB?

The MCP16501TC-E/RMB integrates thermal shutdown (160°C threshold, 20°C hysteresis), cycle-by-cycle overcurrent limiting (1.2–2.4A high-side peak), hiccup-mode short-circuit protection, and active discharge (25 Ω per output). It also includes undervoltage lockout (2.55V typical) and ESD protection (2 kV HBM) on all pins - ensuring robust operation in harsh industrial and automotive environments.