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Microchip Technology MCP16501TE-E/RMB
- Part No.:
- MCP16501TE-E/RMB
- Manufacturer:
- Microchip Technology
- Category:
- Power Management - Specialized
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
MCP16501TE-E/RMB.pdf
- Description:
- PMIC FOR SAMA5DX/SAM9X6 MPUS
- Quantity:
- Payment:
- Shipping:
Inventory:4,180
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Product details
Overview
MCP16501TE-E/RMB from Microchip Technology is a highly integrated, automotive-qualified power management IC (PMIC) designed specifically for SAMA5DX, SAM9X6, and SAMA7G embedded MPUs. It delivers three 1A synchronous buck regulators (2 MHz PWM, 100% duty cycle capable), one 300 mA LDO, ±1% output voltage accuracy on DDR (Buck2) and core (Buck3) rails, and built-in MPU-specific sequencing with nRSTO assertion delay - enabling robust, low-noise power delivery in industrial and automotive embedded systems.
For engineers reviewing the MCP16501TE-E/RMB datasheet, MCP16501TE-E/RMB pinout, MCP16501TE-E/RMB application, or MCP16501TE-E/RMB equivalent, key selection considerations include its AEC-Q100 qualification, pin-selectable DDR/core voltages (1.2V/1.35V/1.8V and 1.0V/1.15V/1.25V), 250 µA low-power mode quiescent current with all channels active, and thermal shutdown/current limit protection in a compact 24-pin 4 mm × 4 mm VQFN package.
Technical Context
The MCP16501TE-E/RMB implements peak-current-mode control across all three buck channels, with internal slope compensation optimized for 1.5–2.2 µH inductors and fixed 2 MHz switching frequency in forced PWM mode. Its LDO features 63 dB PSRR at 1 kHz and 46 dB at 10 kHz, supporting noise-sensitive analog loads.
MPU interface logic includes dedicated LPM and PWRHLD inputs to manage hibernate, low-power, and backup modes - with automatic nRSTO assertion timing aligned to SAMA5D2 requirements. The device supports safe startup into pre-biased outputs and includes active discharge resistors (25 Ω) on all regulated outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports single-supply operation from common Li-ion, USB, or industrial 3.3V/5V rails without external regulators. |
| Buck Output Current | 3 × 1A - sufficient to power MPU I/O, DDR memory, and core logic simultaneously under full load conditions. |
| Switching Frequency | 2 MHz (±10%) - enables use of small 1.5–2.2 µH inductors and reduces EMI filtering complexity. |
| Voltage Accuracy (Buck2/Buck3) | ±1% - ensures stable DDR termination and MPU core voltage compliance across -40°C to +125°C junction temperature. |
| Quiescent Current (Low-Power Mode) | 250 µA typical - maintains system readiness during extended sleep while minimizing battery drain in backup-supplied applications. |
| Shutdown Current | 6 µA max at VIN = 4.5V, TJ = +105°C - meets stringent automotive hibernate leakage requirements. |
| Package | 24-pin 4 mm × 4 mm VQFN - thermally enhanced footprint with exposed pad for efficient heat dissipation in space-constrained PCBs. |
Pinout & Package
24-pin 4 mm × 4 mm VQFN package with exposed thermal pad (EP), rated for -40°C to +125°C junction temperature and qualified per AEC-Q100 Grade 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1, OUT2, OUT3 | Buck output voltage sense | Direct feedback connection point for each buck regulator - must be routed to respective regulation node with minimal trace length to maintain ±1% accuracy. |
| PVIN1/PVIN2/PVIN3 | Buck input power supply | Dedicated high-current input pins per channel - require local 4.7 µF ceramic decoupling to PGNDx to suppress switching noise and stabilize loop response. |
| SW1/SW2/SW3 | Buck switch node | Connection point for external inductor - high dv/dt node requiring tight layout with minimized loop area to reduce EMI and MOSFET stress. |
| PGND1/PGND2/PGND3 | Power ground return | Separate low-impedance ground paths per buck channel - prevent cross-talk between switching loops and ensure accurate current limiting. |
| SELV2, SELV3 | Three-state voltage select | Pin-strapped configuration for DDR (Buck2) and core (Buck3) outputs - eliminates external resistor dividers and improves voltage setting precision. |
| nRSTO, nSTRTO | Open-drain status outputs | Assert reset and start-event signals to MPU - require external pull-up resistors; compatible with 1.8V/3.3V logic levels. |
| LPM, PWRHLD | MPU-controlled power state inputs | Define active/low-power/hibernate modes - enable seamless transition between runtime, suspend, and backup states per SAMA5D2 requirements. |
| LEN | LDO enable input | LV logic-compatible enable signal - allows independent control of auxiliary 300 mA LDO for analog peripherals without affecting buck rails. |
Key Features
| Feature | Design Value |
|---|---|
| MPU-specific default sequencing | Hardwired startup order and nRSTO assertion delay match SAMA5DX/SAM9X6/SAMA7G timing requirements - eliminates need for external sequencer or firmware coordination. |
| Leakage-free MPU interfacing | Optimized ESD protection (2 kV HBM) prevents back-powering or leakage into MPU I/Os even when VIN is removed - critical for fail-safe system behavior. |
| Safe start-up into pre-biased outputs | Enables reliable power-up when downstream rails retain residual voltage - avoids reverse current flow and potential damage to connected DRAM or logic. |
| Active discharge on all outputs | 25 Ω internal discharge path per rail - ensures rapid, controlled ramp-down of VOUT1/VOUT2/VOUT3 during shutdown, preventing latch-up in downstream circuitry. |
| Hibernate mode quiescent current | 110–190 µA depending on channel configuration - sustains DDR self-refresh and MPU retention with minimal battery load in backup-supplied systems. |
Applications
| Industrial Human-Machine Interface (HMI) | Automotive Infotainment Head Unit |
|---|---|
|
Use Scenario: Compact ARM-based display controller powering LCD interface, touch controller, and audio codec from a single 5V input. IC Role / Device Role: Single-chip power solution delivering 3.3V I/O, 1.2V DDR2, and 1.25V core for SAMA5D2 MPU with integrated LDO for audio bias. Use Value: Reduces BOM count by eliminating discrete DC-DCs and LDOs while maintaining ±1% DDR voltage accuracy required for stable LPDDR2 operation. |
Use Scenario: In-vehicle navigation system operating in extended temperature range with backup battery support during engine-off periods. IC Role / Device Role: PMIC managing MPU core, memory, and peripheral rails with hibernate mode entry via LPM/PWRHLD handshake and automatic nRSTO assertion. Use Value: 6 µA shutdown current and AEC-Q100 qualification ensure compliance with automotive cold-cranking and long-term storage requirements. |
| Secure Edge Gateway Controller | Ruggedized Industrial PLC CPU Module |
|
Use Scenario: Secure boot-capable edge node using SAMA7G MPU with cryptographic acceleration and isolated communication interfaces. IC Role / Device Role: Power manager supplying 3.3V I/O, 1.2V DDR3L, and 1.25V core with pin-selectable voltages enabling migration across memory generations. Use Value: Eliminates external feedback resistors for DDR/core rails - improving voltage setting repeatability and reducing layout sensitivity to parasitic effects. |
Use Scenario: DIN-rail mounted programmable logic controller with extended temperature operation and redundant power inputs. IC Role / Device Role: Robust power subsystem delivering regulated rails to MPU, FPGA configuration memory, and isolated CAN/RS-485 transceivers. Use Value: Thermal shutdown (160°C) and current limit protection safeguard against overloads in harsh industrial environments with limited airflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP16501D-E/RMB | Supports LPDDR2/3 memory interface; lacks Hysteretic Control Mode (HCM); identical pinout and sequencing logic. | Required for designs using LPDDR2/3 memory; not suitable where HCM-enabled light-load efficiency is needed. | Select MCP16501D-E/RMB when interfacing with LPDDR2/3; verify memory timing compatibility before substitution. |
| TPS65023BRSBR | Triple 1.5A buck + dual LDO; 2.25–6V input; no pin-selectable DDR/core voltages; different sequencing control scheme. | Broader input range and higher current per rail; requires external resistor networks and firmware coordination for MPU sequencing. | Choose TPS65023BRSBR only if higher current headroom or wider VIN range is required - expect layout and firmware rework. |
Compared with MCP16501D-E/RMB, the MCP16501TE-E/RMB trades LPDDR2/3 support for Hysteretic Control Mode to improve light-load efficiency, while both share identical packaging, pinout, and MPU interface logic. Against TPS65023BRSBR, the MCP16501TE-E/RMB offers tighter integration for Microchip MPUs but lower per-rail current capability.
Availability
MCP16501TE-E/RMB is available at Aetrix Electronics and suitable for industrial HMI, automotive infotainment, secure edge gateways, and ruggedized PLC CPU modules requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for MCP16501TE-E/RMB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog devices, and power management solutions, serving automotive, industrial, and consumer markets with vertically integrated silicon and development tools.
The MCP16501 product line is engineered as a cost- and size-optimized PMIC family for Microchip's SAMA5DX, SAM9X6, and SAMA7G embedded MPUs - delivering tightly coupled power sequencing, memory interface support, and automotive-grade reliability in a single chip.
FAQ
What is the primary target application for the MCP16501TE-E/RMB?
The MCP16501TE-E/RMB is specifically designed for power management in Microchip's SAMA5DX, SAM9X6, and SAMA7G embedded MPUs. It provides tightly integrated, sequenced power rails for MPU core, DDR memory, and I/O - with built-in support for hibernate mode, backup supply operation, and AEC-Q100-compliant automotive deployment. Its pin-selectable voltages and MPU-synchronized nRSTO make it ideal for industrial HMI and infotainment systems.
Does the MCP16501TE-E/RMB support LPDDR2 or LPDDR3 memory interfaces?
No, the MCP16501TE-E/RMB does not support LPDDR2 or LPDDR3 memory interfaces. That functionality is exclusive to the MCP16501D variant. The MCP16501TE-E/RMB instead implements Hysteretic Control Mode (HCM) for improved light-load efficiency in Auto-PFM mode - a trade-off confirmed in Table 4-1 of the datasheet. Designs requiring LPDDR2/3 must use MCP16501D-E/RMB or other compatible variants.
What are the key differences between MCP16501TE-E/RMB and MCP16501D-E/RMB?
The MCP16501TE-E/RMB and MCP16501D-E/RMB share identical pinout, package, and core architecture but differ in two key factory-programmed features: MCP16501TE-E/RMB enables Hysteretic Control Mode for enhanced light-load efficiency, while MCP16501D-E/RMB supports LPDDR2/3 memory interface timing. Neither variant is pin-compatible with the other in terms of memory interface capability or HCM behavior - selection must align with the target MPU memory type and efficiency requirements.
How does the MCP16501TE-E/RMB handle power sequencing for SAMA5D2 MPUs?
The MCP16501TE-E/RMB implements hardwired, MPU-specific default sequencing that matches SAMA5D2 timing requirements - including precise nRSTO assertion delay after all rails stabilize. Sequencing is controlled via PWRHLD and LPM inputs, with automatic transitions between active, low-power, and hibernate modes. No external sequencer or firmware intervention is required, as the sequence is embedded in OTP memory at manufacture and validated for SAMA5D2 interoperability.
What is the maximum output capacitance allowed on the LDO (LOUT) of the MCP16501TE-E/RMB?
The MCP16501TE-E/RMB specifies a maximum LDO output capacitance of 20 µF, with minimum recommendations of 2.2 µF for loads ≤150 mA and 4.7 µF for loads ≤300 mA. Exceeding 20 µF risks instability or unintended activation of hiccup-mode overcurrent protection during soft-start. These limits are defined in Section 4.2 of the datasheet and apply directly to the MCP16501TE-E/RMB variant.
MCP16501TE-E/RMB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- 14mA
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-VQFN (4x4)
MCP16501TE-E/RMB FAQ
1.How can I place an order for MCP16501TE-E/RMB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP16501TE-E/RMB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP16501TE-E/RMB reliable?
The price and inventory of MCP16501TE-E/RMB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP16501TE-E/RMB is usually 5 days.
3.What payment methods are accepted for MCP16501TE-E/RMB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP16501TE-E/RMB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP16501TE-E/RMB?
MCP16501TE-E/RMB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP16501TE-E/RMB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP16501TE-E/RMB?
For technical support, including MCP16501TE-E/RMB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP16501TE-E/RMB requirements.
6.How does Aetrix verify that MCP16501TE-E/RMB is sourced from the original manufacturer or authorized distributors?
All MCP16501TE-E/RMB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP16501TE-E/RMB meets industry standards.
7.What is the process for return or replacement of MCP16501TE-E/RMB?
All MCP16501TE-E/RMB units undergo pre-shipment inspection (PSI). If there is an issue with MCP16501TE-E/RMB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP16501TE-E/RMB part is unused and in its original packaging.
Return procedure for MCP16501TE-E/RMB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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