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NXP Semiconductors MCZ33689DEW
- Part No.:
- MCZ33689DEW
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 32-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
MCZ33689DEW.pdf
- Description:
- IC SYSTEM BASIS CHIP LIN 32-SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,366
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Product details
Overview
MCZ33689DEW from NXP Semiconductors (formerly Freescale) is a SPI-controlled System Basis Chip (SBC) integrating a LIN 2.0 transceiver, 5.0 V/50 mA LDO regulator, three protected high-side switches (HS1/HS2: 150 mA PWM-capable; HS3: 50 mA), current-sense op-amp, and window watchdog - all in a single 32-pin SOICW package. It serves as the power, interface, and protection hub for automotive body electronics such as power windows, mirrors, and seats.
For engineers reviewing the MCZ33689DEW datasheet, MCZ33689DEW pinout, MCZ33689DEW application, or MCZ33689DEW equivalent, this device delivers integrated LIN communication, load switching with diagnostics, regulated MCU supply, and robust fault reporting via SPI - critical for space-constrained, safety-aware automotive slave-node designs.
Technical Context
The MCZ33689DEW implements a fully SPI-configurable SBC architecture with three operational modes: Normal (full functionality), Sleep (VDD off, wake-up via LIN bus or L1/L2 inputs), and Stop (VDD on, wake-up via MCU, LIN, or external inputs). Its LIN physical layer supports 100 kbps with programmable slew rate (normal/slow/fast) and ISO 7637-compliant transient protection.
Internal blocks include a 5.0 V LDO with undervoltage/overvoltage detection, thermal pre-warning (135°C) and shutdown (170°C), SPI-accessible diagnostic registers, and a current-sense op-amp (rail-to-rail input, ±15 mV offset, 1 MHz GBW) for real-time load monitoring. The watchdog timer uses an external resistor (10–100 kΩ) to set periods from ~10.6 ms to ~215 ms with ±15% accuracy.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LIN Data Rate | Up to 100 kbps; compliant with LIN 2.0 specification and ISO 17987-4 physical layer requirements. |
| 5.0 V Regulator Output | 4.75–5.25 V at 50 mA; dropout ≤ 0.2 V; includes overtemperature pre-warning (135°C) and thermal shutdown (170°C). |
| High-Side Switches | HS1/HS2: 150 mA rated, PWM-controllable via IN pin, RDS(ON) ≤ 4.5 Ω @ 125°C; HS3: 50 mA rated, RDS(ON) ≤ 14 Ω @ 125°C. |
| SPI Interface | Full-duplex, up to 4.0 MHz; supports diagnostics readback, mode control, and switch configuration with tVALID ≤ 50 ns. |
| Current Sense Op-Amp | Rail-to-rail input (–0.1 to VCC+0.1 V), ±15 mV offset, 1 MHz gain-bandwidth, 0.5 V/μs slew rate - enables accurate shunt-based load current monitoring. |
| Operating Temperature | –40°C to +125°C ambient; junction temperature range –40°C to +150°C with RθJA = 80°C/W. |
| Package | 32-pin SOICW (EW suffix), Pb-free, moisture sensitivity level 3, compatible with standard reflow profiles (peak 240°C). |
Pinout & Package
MCZ33689DEW is housed in a 32-pin SOICW (Small Outline Integrated Circuit, Wide-body) package with exposed thermal pad (TGND pins at positions 8, 9, 24, 25) for enhanced thermal dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 14 | NC | No internal connection; must remain unconnected per datasheet. |
| 2, 4 | L1, L2 | High-voltage wake-up inputs (–18 V to +40 V); detect switch closures or external wake events in Sleep/Stop modes. |
| 5–7 | HS3, HS2, HS1 | Protected high-side driver outputs; HS1/HS2 support PWM via IN pin; all feature overcurrent/overtemperature latch-off and clamp protection. |
| 10 | VS2 | Power supply input for HS1/HS2/HS3 drivers; accepts 5.5–27 V with transient tolerance to 40 V (load dump). |
| 11 | LIN | Bidirectional LIN bus interface; integrates pull-up (20–47 kΩ), waveshaping, and wake-up detection per ISO 17987-4. |
| 12 | GND | Primary digital ground reference for logic and SPI interface. |
| 13 | VS1 | Input for 5.0 V regulator, LIN PHY, and internal logic; same voltage range and transient rating as VS2. |
| 15 | VDD | Regulated 5.0 V output (4.75–5.25 V, 50 mA); powers MCU and digital circuitry; includes reset generation and fault reporting. |
| 16 | AGND | Analog ground for regulator feedback and current-sense op-amp; must be star-connected to minimize noise coupling. |
| 17 | VCC | 5.0 V supply input for current-sense op-amp; decoupled separately from VDD for precision analog operation. |
| 18–20 | OUT, E+, E– | Current-sense amplifier terminals; E+/E– accept differential shunt voltage; OUT provides buffered analog output (0.1–VCC–0.1 V). |
| 22 | RST | Active-low reset output; asserts when VDD drops below 4.7 V or thermal/fault conditions occur; drives MCU reset input. |
| 23 | IN | PWM control input for HS1/HS2; AND-gated with SPI command to enable pulse-width modulation of high-side loads. |
| 26–29 | SCLK, MOSI, MISO, CS | Standard SPI interface signals; support full-duplex communication up to 4 MHz with diagnostic register access and configuration. |
| 30 | INT | Active-low interrupt output; reports faults (overtemp, overcurrent, UV/OV, watchdog timeout) to MCU via SPI-readable status bits. |
| 31–32 | RXD, TXD | LIN receiver output and transmitter input; RXD reflects bus state; TXD controls dominant/recessive bus transitions via internal driver. |
Key Features
| Feature | Design Value |
|---|---|
| LIN 2.0 Transceiver with Programmable Slew Rate | Supports normal (50 μs), slow (100 μs), and fast (13 V/μs) slew modes - enabling optimization for EMI vs. speed in automotive networks. |
| Three Independent High-Side Switches | HS1/HS2 (150 mA, PWM-capable) and HS3 (50 mA) each feature independent SPI control, current limiting, thermal shutdown, and inductive-clamp protection - eliminating need for external flyback diodes. |
| Fully SPI-Accessible Diagnostics | All fault flags (VDD UV/OV, HS overcurrent, thermal pre-warning/shutdown, LIN bus errors) are readable via dedicated SPI registers - enabling real-time system health monitoring without additional sensors. |
| Window Watchdog Timer | Externally configurable (10–100 kΩ resistor) with ±15% timing accuracy; detects MCU lockup and forces safe state recovery via reset or mode transition. |
| Integrated Current-Sense Amplifier | Low-offset (±15 mV), rail-to-rail input op-amp with 1 MHz bandwidth - allows direct measurement of load current through low-value shunts for closed-loop control or fault detection. |
| Multi-Mode Power Management | Normal/Sleep/Stop modes with distinct current consumption (5–8 mA / 35–45 μA / 60–75 μA) and wake-up sources (LIN bus, L1/L2, MCU) - optimizing energy use in battery-sensitive applications. |
Applications
| Power Window Control | Mirror Adjustment Module |
|---|---|
Use Scenario: Driving bidirectional DC motors for window lift/drop with position sensing and stall detection. IC Role / Device Role / Timing Role: MCZ33689DEW provides regulated 5.0 V supply to MCU, controls H-bridge direction via HS1/HS2, monitors motor current via E+/E–/OUT, and communicates status over LIN bus. Use Value: Eliminates discrete regulators, switches, and current-sense circuits; reduces BOM count by ≥7 components while enabling precise stall detection and LIN-based diagnostics. |
Use Scenario: Controlling dual-axis mirror actuators (vertical/horizontal) and heating elements in automotive side-view mirrors. IC Role / Device Role / Timing Role: MCZ33689DEW supplies MCU power via VDD, drives mirror motors using HS1/HS2, activates heater via HS3, and reports faults (overcurrent, thermal) over LIN. Use Value: Single-chip integration reduces PCB area by >40% versus discrete solutions; built-in thermal shutdown prevents heater-related overheating risks. |
| Driver Seat Position Memory | Roof Sunshade Actuation |
Use Scenario: Managing multi-motor seat adjustment (fore/aft, recline, lumbar) with memory recall and pinch detection. IC Role / Device Role / Timing Role: MCZ33689DEW powers seat MCU, switches motor power via HS1–HS3, senses current for pinch detection using its op-amp, and interfaces with body controller via LIN. Use Value: Real-time current monitoring enables <50 mA pinch threshold detection; SPI diagnostics allow predictive maintenance alerts before mechanical failure. |
Use Scenario: Driving sunshade motor and position sensor in panoramic roof systems requiring smooth, quiet actuation. IC Role / Device Role / Timing Role: MCZ33689DEW supplies 5.0 V to sunshade MCU, controls motor direction via HS1/HS2, monitors current for end-stop detection, and reports status over LIN. Use Value: PWM capability on HS1/HS2 enables variable-speed motor control for noise reduction; integrated LIN transceiver eliminates need for separate LIN PHY IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip with LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33883GEWR2 | Higher current HS drivers (2 A), integrated CAN FD transceiver instead of LIN, no current-sense op-amp; requires external 5 V regulator. | Targeted at higher-power chassis modules (e.g., suspension control) requiring CAN FD, not LIN-based body nodes. | Select only if CAN FD interface and >500 mA load drive are required; not drop-in for LIN-only designs. |
| TLIN1029DR | Dedicated LIN transceiver only (no regulator, no switches, no diagnostics); 100 kbps, ±40 V bus protection, 3.3 V/5 V I/O compatible. | Used alongside discrete power management and microcontrollers; lacks integrated SBC functionality of MCZ33689DEW. | Choose when modular design is preferred or when existing power/switching architecture cannot be replaced. |
Compared with MCZ33689DEW, MC33883GEWR2 trades LIN integration and current sensing for CAN FD and higher drive strength - suitable for chassis networks but over-specified for body electronics. TLIN1029DR offers superior LIN PHY robustness but requires full external SBC implementation, increasing BOM cost and board area.
Availability
MCZ33689DEW is available at Aetrix Electronics and suitable for automotive body control modules, power window systems, and seat/mirror actuation requiring stable component supply, AEC-Q100 qualification, and long-term industrial availability.
Supply support for MCZ33689DEW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in automotive-grade mixed-signal ICs.
The MCZ33689DEW belongs to NXP's System Basis Chip portfolio, designed specifically for automotive body electronics slave nodes requiring integrated power regulation, LIN communication, protected load switching, and diagnostics - reducing system complexity and improving functional safety compliance.
FAQ
What is the maximum continuous supply voltage for MCZ33689DEW at VS1 and VS2 pins?
The MCZ33689DEW supports a continuous supply voltage range of –0.3 V to 27 V at both VS1 and VS2 pins. It also withstands transient load-dump conditions up to +40 V, meeting ISO 7637-2 Pulse 5a requirements for automotive 12 V systems - ensuring reliable operation during alternator load dump events.
Does MCZ33689DEW support PWM control of its high-side switches, and which ones?
Yes, MCZ33689DEW supports PWM control of HS1 and HS2 via the IN pin, which acts as an AND gate with their respective SPI control bits. HS3 is not PWM-capable. This enables variable-speed motor control and soft-start functionality for inductive loads without external PWM circuitry - a key feature for noise-sensitive automotive applications.
How does the current-sense operational amplifier in MCZ33689DEW function, and what are its key specs?
The MCZ33689DEW integrates a precision current-sense op-amp with E+ and E– differential inputs and OUT output. It features ±15 mV input offset voltage, rail-to-rail input range (–0.1 V to VCC+0.1 V), 1 MHz gain-bandwidth, and 0.5 V/μs slew rate - enabling accurate, low-noise shunt-based current measurement for load monitoring and fault detection in real time.
What LIN physical layer standards does MCZ33689DEW comply with?
MCZ33689DEW complies with LIN 2.0 specification (ISO 17987-4) and supports data rates up to 100 kbps. Its LIN transceiver includes ISO 7637-2 transient protection (±150 V), bus wake-up detection, programmable slew rate (normal/slow/fast), and integrated 20–47 kΩ pull-up - meeting full automotive LIN slave node requirements without external components.
What are the operating modes of MCZ33689DEW, and how do they differ in power consumption?
MCZ33689DEW operates in three modes: Normal (5–8 mA supply current), Sleep (35–45 μA, VDD off), and Stop (60–75 μA, VDD on). Wake-up sources include LIN bus activity, external L1/L2 inputs, or MCU commands. This multi-mode architecture enables ultra-low quiescent current in parked vehicle states while maintaining fast wake-up response (<30 μs from LIN edge).
MCZ33689DEW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- -
- Current - Supply:
- 5mA
- Voltage - Supply:
- 5.5V ~ 18V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
MCZ33689DEW FAQ
1.How can I place an order for MCZ33689DEW through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33689DEW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33689DEW reliable?
The price and inventory of MCZ33689DEW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33689DEW is usually 5 days.
3.What payment methods are accepted for MCZ33689DEW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33689DEW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33689DEW?
MCZ33689DEW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33689DEW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33689DEW?
For technical support, including MCZ33689DEW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33689DEW requirements.
6.How does Aetrix verify that MCZ33689DEW is sourced from the original manufacturer or authorized distributors?
All MCZ33689DEW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33689DEW meets industry standards.
7.What is the process for return or replacement of MCZ33689DEW?
All MCZ33689DEW units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33689DEW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33689DEW part is unused and in its original packaging.
Return procedure for MCZ33689DEW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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