NXP Semiconductors MCZ33800EK
- Part No.:
- MCZ33800EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33800EK.pdf
- Description:
- IC ENGINE CTRL SW/DVR 54-SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,530
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCZ33800EK from NXP (formerly Freescale) is an automotive-grade engine control integrated circuit combining two programmable constant current drivers (CCD1/CCD2), an octal low-side serial switch (OSS), and six external MOSFET gate pre-drivers (GD1–GD6). It operates from 5–36 V VPWR, delivers up to 800 mA CCD1 output current, supports SPI/parallel control, and integrates open-load/short-circuit diagnostics for solenoid and injector drive in powertrain systems.
For engineers reviewing the MCZ33800EK datasheet, MCZ33800EK pinout, MCZ33800EK application, or MCZ33800EK equivalent, this page provides verified functional identity, validated 54-pin SOICW-EP package mapping, confirmed diagnostic timing (e.g., tONOPENTIMER = 6–24 ms), real-world HEGO sensor resistance measurement capability, and two field-validated alternative parts with documented parameter and application differences.
Technical Context
The MCZ33800EK implements dual independent constant-current regulation paths: CCD1 (775–823 mA, 0.7–1.2 Ω internal sense) for high-current solenoids, and CCD2 (166–180 mA, 3.5–5.0 Ω sense) for heated oxygen sensor (HEGO) biasing. Both support programmable dither (50–500 Hz, ±10% accuracy) and recirculation-based current sensing via differential CCDx_REC/CCDx_OUT inputs.
Its octal OSS outputs (OUT1–OUT8) feature per-channel overcurrent limiting (1.0–2.0 A), open-load detection (IOCO = 40–100 µA), and fault annunciation via SPI; six GD outputs provide PWM-controlled gate drive (programmable frequency/duty cycle) with short/open fault filtering (100–400 µs) and calibrated slew rate (1.7 V/µs).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VPWR Range | 5–36 V - Supports full automotive battery range including cold-crank (5 V) and load-dump (36 V) transients without external regulators. |
| CCD1 Output Current | 775–823 mA - Programmable solenoid drive current with ±3% DAC accuracy at 17C HEX setting, enabling precise fuel injector control. |
| OSS Continuous Current | 350 mA per channel - Sustained low-side switching capability for 8 parallel loads (e.g., valve actuators) with thermal derating to 150°C junction. |
| SPI Interface Speed | 4.0 MHz - Enables real-time fault reporting and configuration updates within <250 ns SO data valid window after SCLK fall. |
| Thermal Shutdown | 155–185°C TJ - Hysteresis of 5–15°C prevents oscillation during transient overheating in under-hood environments. |
| Sleep Mode Current | ≤10 µA - Achieved when VDD ≤ 0.8 V and EN ≤ 0.8 V, meeting OEM requirements for ECU standby power budgets. |
| Package | 54-pin SOICW-EP - Exposed pad improves thermal resistance (RθJC = 1.2 °C/W) for high-power dissipation in compact engine control modules. |
Pinout & Package
MCZ33800EK uses a 54-pin SOICW-EP (wide-body surface-mount) package with exposed thermal pad. Pin numbering follows standard SOICW layout (pin 1 top-left corner, counterclockwise); the exposed pad must be soldered to system ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDSNS1–VDSNS6 | Drain voltage sense input | Monitors external MOSFET drain voltage for GD1–GD6; enables short-circuit detection when VDS falls below programmable threshold (0.5–3.0 V). |
| GD1–GD6 | Gate driver output | Provides PWM-controlled gate drive to external N-channel MOSFETs; includes internal pull-down (65–300 kΩ) in sleep mode for safe turn-off. |
| OUT1–OUT8 | OSS low-side output | Direct-drive outputs for solenoids/valves; each has dedicated PGND (PGND1–PGND3) to minimize ground bounce in multi-channel operation. |
| CCD1_OUT / CCD1_REC | Constant current driver I/O pair | Differential sensing path: CCD1_OUT sources/sinks current; CCD1_REC provides recirculation return-enables accurate solenoid current measurement independent of supply ripple. |
| SI / SCLK / CS / SO | SPI interface | Full-duplex 4-wire SPI (3.3 V/5 V compatible) with tri-state SO; supports daisy-chaining via SO-to-SI connection across multiple MCZ33800EK devices. |
| VCAL | Precision reference input | 2.5 V ±8 mV/–20 mV over temperature; requires 1–10 nF decoupling capacitor to stabilize internal bandgap and oscillator calibration. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable CCD dither | 50–500 Hz frequency and 0–350 mA amplitude (CCD1) or 0–90 mA (CCD2) - Reduces electromagnetic interference and mechanical resonance in solenoid actuators. |
| OSS paralleling capability | Outputs 1&2, 3&4, 5&6, or 7&8 can be paralleled via SPI configuration - Doubles current capacity (to 700 mA) for high-power valves without external hardware changes. |
| HEGO sensor diagnostics | Measures load resistance via LRFDBK pin using REXT and RI_REF - Enables real-time monitoring of oxygen sensor heater integrity and aging without additional ADC resources. |
| Multi-level fault annunciation | Per-output open-load, short-circuit, and overtemperature faults reported via SPI status register - Allows software-defined response (e.g., disable channel, log error, trigger limp-home mode). |
| Calibrated internal oscillator | ±10% accuracy after SPI calibration command - Eliminates need for external crystal while maintaining timing precision for PWM, dither, and fault timers. |
Applications
| Fuel Injector Driver | HEGO Sensor Bias & Diagnostics |
|---|---|
|
Use Scenario: Driving high-impedance (12–16 Ω) gasoline direct injection solenoids in modern GDI engines. IC Role / Device Role / Timing Role: MCZ33800EK acts as the primary solenoid driver IC, delivering precisely regulated current (CCD1) with dither to control needle lift timing and duration. Use Value: Enables sub-millisecond current rise/fall times (2–4 V/µs) and on-state short detection (<90 µs) for closed-loop injector control and misfire prevention. |
Use Scenario: Providing bias current and health monitoring for heated exhaust gas oxygen sensors in OBD-II compliant powertrains. IC Role / Device Role / Timing Role: MCZ33800EK serves as HEGO heater controller and diagnostic engine, using CCD2 for current regulation and LRFDBK for resistance measurement. Use Value: Delivers stable 166–180 mA heater current with ±4% accuracy and detects open/short heater faults within 24 ms-meeting SAE J1930 diagnostic response time requirements. |
| Variable Valve Actuator Control | Transmission Solenoid Management |
|
Use Scenario: Controlling electro-hydraulic variable valve timing (VVT) actuators requiring precise current ramping and hold profiles. IC Role / Device Role / Timing Role: MCZ33800EK functions as a programmable current source (CCD1) with dither-enabled current shaping to reduce mechanical noise and wear in cam phasers. Use Value: Supports 50–500 Hz dither modulation and 775–823 mA output to achieve smooth actuator positioning with <1% current ripple, improving fuel economy and NVH performance. |
Use Scenario: Managing pressure control and shift solenoids in 6-speed automatic transmissions with real-time fault recovery. IC Role / Device Role / Timing Role: MCZ33800EK operates as an octal low-side driver (OUT1–OUT8), providing independent control and diagnostics for multiple transmission solenoids. Use Value: Delivers 350 mA continuous per channel with per-output open-load detection (40–100 µA sensitivity) and fault reporting via SPI-enabling adaptive shift scheduling and fail-safe limp-in operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar engine control driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33810 | Single CCD + octal OSS only (no GD pre-drivers); lacks HEGO diagnostics and CCD2 channel. | Targeted at simpler fuel injector-only systems; cannot replace MCZ33800EK in designs requiring external MOSFET gate drive or dual CCD functionality. | Select MC33810 only when gate pre-driver and HEGO biasing are handled externally or omitted. |
| MC33972 | Includes 10-channel low-side drivers + 2 CCDs but no GD pre-drivers; adds LIN physical layer and watchdog timer. | Designed for body control modules (BCM) and non-powertrain applications; lacks automotive-grade VPWR tolerance (max 28 V vs. 36 V) and calibrated oscillator. | Choose MC33972 for non-engine applications needing higher channel count and LIN interface-but not for under-hood engine control where 36 V VPWR and thermal robustness are mandatory. |
Compared with MC33810 and MC33972, the MCZ33800EK uniquely integrates dual CCDs, six GD pre-drivers, and HEGO diagnostics in a single 54-pin SOICW-EP package-making it irreplaceable in compact, high-integration powertrain ECUs requiring both solenoid and MOSFET-based actuation with comprehensive fault coverage.
Availability
MCZ33800EK is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and emissions system controllers requiring stable component supply across automotive production lifecycles.
Supply support for MCZ33800EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive semiconductors, specializing in high-reliability, AEC-Q100 qualified ICs for powertrain, safety, and connectivity systems.
The MCZ33800EK belongs to NXP's legacy Freescale engine control IC family, designed specifically for cost-sensitive, thermally demanding powertrain applications requiring integrated solenoid drive, MOSFET pre-driving, and sensor diagnostics in a single package.
FAQ
What is the maximum VPWR voltage the MCZ33800EK can withstand?
The MCZ33800EK supports a VPWR supply range of 5–36 V under normal operation, with absolute maximum rating of 45 V. Its over-voltage shutdown triggers at 36.5–44 V (with 0.5–3.0 V hysteresis), protecting internal circuits during load-dump events common in 12 V automotive systems. This ensures reliable operation without external TVS clamping in most OEM designs.
Does the MCZ33800EK require an external crystal or oscillator?
No, the MCZ33800EK includes an internal oscillator that achieves ±10% accuracy after SPI calibration-eliminating need for external crystal. The VCAL pin (2.5 V reference) must be decoupled with 1–10 nF capacitor to stabilize calibration. Uncalibrated accuracy is ±80%, so SPI calibration is mandatory for timing-critical functions like dither and fault timers.
How does the MCZ33800EK perform open-load detection on its CCD outputs?
The MCZ33800EK performs open-load detection on CCD1 and CCD2 by monitoring the voltage at CCDx_OUT while the driver is enabled. If the sensed voltage exceeds 2.0–3.0 V (VOUT(FLTTH)), the device flags an open-load fault. Detection timing is configurable: on-state detection occurs after 6–24 ms (tONOPENTIMER), ensuring reliable identification even with inductive kickback delays.
Can the MCZ33800EK drive external MOSFETs directly, or does it require gate resistors?
The MCZ33800EK's GD1–GD6 outputs provide direct gate drive to external N-channel MOSFETs, with 2–5 mA sink/source capability and 1.7 V/µs slew rate into 1 nF load. While gate resistors are not required for basic operation, they are recommended to damp ringing and limit peak current-especially with high-Ciss MOSFETs or long PCB traces-to prevent false short-fault triggering.
What is the purpose of the REXT and RI_REF pins on the MCZ33800EK?
REXT and RI_REF set the reference current for the CCD1 and CCD2 constant-current regulators. A 39.2 kΩ resistor from RI_REF to ground configures CCD1 for 1075 mA and CCD2 for 232 mA at full-scale DAC code. REXT provides feedback for load resistance measurement via LRFDBK, enabling HEGO heater diagnostics without external op-amps or ADC channels.
MCZ33800EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- 10mA
- Voltage - Supply:
- 5V ~ 36V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-SOIC-EP
MCZ33800EK FAQ
1.How can I place an order for MCZ33800EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33800EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33800EK reliable?
The price and inventory of MCZ33800EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33800EK is usually 5 days.
3.What payment methods are accepted for MCZ33800EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33800EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33800EK?
MCZ33800EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33800EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33800EK?
For technical support, including MCZ33800EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33800EK requirements.
6.How does Aetrix verify that MCZ33800EK is sourced from the original manufacturer or authorized distributors?
All MCZ33800EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33800EK meets industry standards.
7.What is the process for return or replacement of MCZ33800EK?
All MCZ33800EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33800EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33800EK part is unused and in its original packaging.
Return procedure for MCZ33800EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCZ33800EK Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

