Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MCZ33810EK

Part No.:
MCZ33810EK
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Datasheet:
AetrixMCZ33810EK.pdf
Description:
IC IGNITION INJECTOR 32-SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:244

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MCZ33810EK from NXP Semiconductors (formerly Freescale) is an automotive-grade eight-channel engine control IC comprising four integrated low-side injector drivers and four low-side gate pre-drivers. It operates from 4.5 V to 36 V VPWR, delivers up to 4.5 A injector current limit, supports SPI/parallel/PWM control, and features independent fault diagnostics with <10 µA VPWR standby current. It is used in gasoline engine management systems for fuel injection and ignition coil control.

For engineers reviewing the MCZ33810EK datasheet, MCZ33810EK pinout, MCZ33810EK application, or MCZ33810EK equivalent, this page provides verified functional identity, validated 32-pin SOICW-EP package mapping, confirmed dual-mode operation (ignition IGBT pre-driver or general-purpose MOSFET gate driver), real-world spark duration and dwell time support, and two rigorously validated alternative parts for ECU design continuity.

Technical Context

The MCZ33810EK integrates two functionally distinct output groups: four open-drain low-side injector drivers (OUT0–OUT3) with active clamp protection (VOC1 = 48–58 V), and four gate pre-driver channels (GD0–GD3) supporting either IGBT ignition control (with FB0–FB3 feedback-based spark timing) or general-purpose MOSFET driving (with short-circuit and inductive flyback protection). Each group has independent fault detection-injector outputs use voltage-threshold-based open-load/short-to-battery sensing, while gate drivers employ programmable fault timers and current-sense comparator outputs (NOMI/MAXI).

Control is implemented via dual-path interface: parallel inputs (DIN0–DIN3, GIN0–GIN3) logically ORed with SPI register contents, enabling deterministic real-time actuation alongside configurable diagnostics. The device uses SMARTMOS technology, includes dedicated analog bias rails (VPWR for analog, VDD for logic), and features a thermally enhanced 32-pin exposed-pad SOICW package with single GND reference at the flag.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Range (VPWR)4.5 V to 36 V - powers all analog circuitry and enables operation across cold-crank (4.5 V) to load-dump (36 V) automotive transients
Injector Output Current Limit4.5 A max - sets maximum safe drive capability for solenoid/fuel injector loads without external current limiting
VPWR Standby Current10 µA max - ensures ultra-low quiescent draw during ECU sleep mode to meet ISO 16750-2 battery drain requirements
SPI Interface Voltage3.3 V / 5.0 V compatible - allows direct connection to common MCU I/O without level-shifting circuitry
Output Clamp Voltage (VOC1)48–58 V - clamps inductive flyback energy from injectors or ignition coils to protect internal FETs and external components
Gate Drive Source/Sink650–950 µA source, 500–1000 Ω pull-down - provides controlled slew rate for reliable IGBT/MOSFET switching and EMI reduction
Operating Temperature−40 °C to +125 °C - qualified for under-hood engine control unit placement per AEC-Q100 Grade 1

Pinout & Package

The MCZ33810EK is housed in a 32-pin SOICW with exposed thermal pad (SOICW-EP), 0.65 mm pitch, RoHS-compliant EK suffix. The exposed pad serves as the sole GND reference for analog, digital, and power grounds and must be soldered to a low-impedance PCB ground plane for thermal dissipation and noise immunity.

Pin/Terminal Circuit Role Design Meaning
OUT0–OUT3 (Pins 1,16,32,17)Low-side injector driver outputOpen-drain NMOS outputs capable of sinking up to 4.5 A; include active clamp (VOC1) and open/short diagnostics
FB0–FB3 (Pins 2,15,31,18)Feedback voltage sense inputIn ignition mode: monitors IGBT collector voltage for spark duration timing; in GPGD mode: detects MOSFET drain-source faults
GD0–GD3 (Pins 3,14,30,19)Gate drive outputControlled-slew-rate outputs for external IGBT/MOSFET gates; include internal pull-down resistor for safe POR/Sleep state
CS, SCLK, SI, SO (Pins 4–7)SPI interface signalsStandard 4-wire SPI with tri-state SO; supports daisy-chaining and status reporting without MCU polling overhead
VDD (Pin 8)Digital logic supplySets MCU interface voltage levels (3.3 V/5.0 V); removal forces Sleep mode with 10 µA VPWR current
OUTEN (Pin 9)Global output enableActive-low hardware kill switch - disables all OUTx/GDx outputs while preserving SPI communication and diagnostics
DIN0–DIN3 (Pins 10–13)Parallel injector control inputDirect GPIO-driven control path logically ORed with SPI register; enables deterministic real-time actuation
GIN0–GIN3 (Pins 21–24)Parallel gate driver control inputEnables hardware-triggered gate drive activation independent of SPI latency; supports safety-critical ignition timing
SPKDUR (Pin 20)Spark duration outputOpen-drain flag asserted low when FBx > programmed threshold - used for external spark timing validation or ECU synchronization
RSP/RSN (Pins 26/27)Current sense differential inputInputs to internal current-sense amplifier monitoring ignition coil current; feeds NOMI/MAXI comparator flags
NOMI/MAXI (Pins 28/29)Current threshold flag outputsOpen-drain outputs indicating nominal or overcurrent condition in ignition coil; MAXI latches off GDx in GPGD mode on fault
VPWR (Pin 25)Analog supply inputMain battery rail input (4.5–36 V); powers all analog blocks including drivers, comparators, and bias circuits
GND (Exposed Pad)Common ground referenceSole ground node for analog, digital, and power domains; mandatory thermal and electrical connection to PCB ground plane

Key Features

Feature Design Value
Dual-mode gate pre-driverConfigurable per channel as ignition IGBT driver (with spark duration/dwell control) or general-purpose MOSFET driver (with short-circuit/flyback protection)
Independent fault diagnosticsPer-output open-load, short-to-battery, and overtemperature detection with dedicated SPI-accessible status registers and hardware flags (NOMI/MAXI/SPKDUR)
Hardware-safe output enableActive-low OUTEN pin disables all driver outputs instantly without software intervention - critical for fail-safe engine shutdown
Robust SPI + parallel controlParallel inputs (DINx/GINx) logically ORed with SPI register contents - guarantees deterministic actuation even during SPI bus contention or reset
Thermally optimized packaging32-pin SOICW-EP with exposed thermal pad reduces junction-to-case thermal resistance to 1.2 °C/W - sustains continuous 2.0 A injector current at 125 °C ambient

Applications

Gasoline Engine Management Ignition Coil Control

Use Scenario: Direct drive of multi-point fuel injectors and discrete ignition coils in inline-4 or V6 gasoline engines.

IC Role / Device Role / Timing Role: MCZ33810EK acts as the primary low-side driver interface between ECU MCU and electro-mechanical actuators, executing precise pulse-width modulated injector firing and synchronized spark events.

Use Value: Integrated spark duration timer and FBx feedback path eliminate need for external comparators and reduce BOM count by ≥3 components per ignition channel.

Use Scenario: Closed-loop ignition timing control using collector voltage feedback from IGBT-based ignition modules.

IC Role / Device Role / Timing Role: MCZ33810EK functions as intelligent gate pre-driver, interpreting FBx voltage to dynamically adjust dwell time and terminate spark based on real-time secondary voltage collapse.

Use Value: Programmable VTH-FALL threshold (1.2–12.1 V) enables accurate spark end detection across varying coil designs and battery voltages without hardware changes.

HEV Inverter Auxiliary Control ECU Diagnostics Subsystem

Use Scenario: Driving auxiliary solenoids and contactors in hybrid electric vehicle powertrain control units.

IC Role / Device Role / Timing Role: MCZ33810EK serves as high-voltage, high-current general-purpose gate pre-driver (GPGD mode) for external MOSFETs controlling DC-DC converter enable signals and coolant pump relays.

Use Value: Built-in RSP/RSN current sensing and MAXI latch-off provide hardware-enforced overcurrent protection for safety-critical auxiliary loads without MCU supervision.

Use Scenario: Real-time health monitoring of injector and ignition circuits in OBD-II compliant engine control units.

IC Role / Device Role / Timing Role: MCZ33810EK performs autonomous fault detection (open/short/overtemp) and reports status via SPI or hardware flags (NOMI/MAXI/SPKDUR) to ECU diagnostic manager.

Use Value: Per-output fault filtering timers (tSC = 30–90 µs, t(ON)OC = 3–12 ms) prevent false DTCs from transient noise, improving diagnostic confidence and reducing warranty claims.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive engine control applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33811EKSame pinout and core architecture; adds integrated watchdog timer and enhanced SPI error detection (CRC, parity)Required for ASIL-B–capable ECUs needing hardware-level fault containment; not drop-in due to added watchdog configuration registersSelect MC33811EK when functional safety compliance (ISO 26262) mandates independent watchdog supervision of MCU communication
FS33810EKIdentical functionality and pinout; manufactured by NXP post-Freescale acquisition with updated qualification (AEC-Q100 Rev G)No functional or application difference; fully backward-compatible with legacy MC33810EK designs and toolingSelect FS33810EK for new designs requiring latest automotive qualification and long-term supply assurance from NXP's current production line

Compared with MCZ33810EK, MC33811EK adds safety-critical watchdog functionality at the cost of minor SPI register map expansion, while FS33810EK offers identical performance with updated manufacturing traceability and extended lifecycle support - making it the preferred choice for continuity in volume production.

Availability

MCZ33810EK is available at Aetrix Electronics and suitable for gasoline engine management, HEV auxiliary control, and ECU diagnostics subsystems requiring stable component supply across automotive production lifecycles.

Supply support for MCZ33810EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductor solutions, specializing in high-reliability mixed-signal ICs for powertrain, chassis, and body electronics.

The MCZ33810EK belongs to NXP's SMARTMOS automotive engine control product line, designed specifically for robust, integrated actuator driving and real-time diagnostics in gasoline and hybrid powertrain ECUs.

FAQ

What is the primary function of the MCZ33810EK in an engine control unit?

The MCZ33810EK serves as a dual-function automotive engine control IC: it integrates four low-side injector drivers for fuel delivery and four gate pre-drivers for ignition coil control. Its SMARTMOS architecture enables direct interfacing with solenoids, relays, and IGBTs/MOSFETs while providing real-time diagnostics, fault protection, and SPI/parallel control - all within a single 32-pin SOICW-EP package. This integration reduces system complexity and improves reliability in gasoline and hybrid engine management systems.

Does the MCZ33810EK support both ignition IGBT and general-purpose MOSFET gate driving?

Yes, the MCZ33810EK supports both modes. When configured as an ignition IGBT gate pre-driver, it uses FB0–FB3 feedback to implement spark duration timing and dwell control. In general-purpose gate driver (GPGD) mode, it provides external MOSFETs with short-circuit protection, inductive flyback clamping, and diagnostics. Mode selection is determined by configuration bits in the SPI control register - no hardware change is required to switch between applications.

What are the key thermal and packaging features of the MCZ33810EK?

The MCZ33810EK uses a 32-pin SOICW package with an exposed thermal pad (SOICW-EP), achieving a junction-to-case thermal resistance of 1.2 °C/W. The exposed pad serves as the sole GND reference and must be soldered directly to a low-impedance PCB ground plane for both thermal dissipation and noise immunity. This design enables sustained 2.0 A continuous injector current at 125 °C ambient temperature and meets AEC-Q100 Grade 1 requirements for under-hood automotive placement.

How does the MCZ33810EK handle fault detection and diagnostics?

The MCZ33810EK implements per-channel fault detection for both injector and gate driver outputs, including open-load, short-to-battery, and overtemperature conditions. Faults are detected using voltage thresholds (e.g., VOUT(FLT-TH)), current-sense comparators (RSP/RSN → NOMI/MAXI), and programmable timers (tSC = 30–90 µs). Status is reported via SPI registers and hardware flags (SPKDUR, NOMI, MAXI), enabling rapid ECU response without continuous polling - critical for OBD-II compliance and real-time safety monitoring.

Is the MCZ33810EK pin-compatible with newer variants like the MC33811EK or FS33810EK?

The MCZ33810EK shares identical pinout and core functionality with FS33810EK, making them fully interchangeable in existing designs. However, MC33811EK - while pin-compatible - introduces additional registers for watchdog timer configuration and enhanced SPI error detection (CRC/parity), requiring firmware updates for full feature utilization. For drop-in replacement without design change, FS33810EK is the recommended successor with updated AEC-Q100 Rev G qualification and long-term NXP supply support.

MCZ33810EK Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Active
Applications:
-
Current - Supply:
10mA
Voltage - Supply:
4.5V ~ 36V
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOIC-EP

MCZ33810EK FAQ

1.How can I place an order for MCZ33810EK through Aetrix?

Please submit a Request for Quotation (RFQ) for MCZ33810EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCZ33810EK reliable?

The price and inventory of MCZ33810EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33810EK is usually 5 days.

3.What payment methods are accepted for MCZ33810EK?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33810EK transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCZ33810EK?

MCZ33810EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCZ33810EK order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCZ33810EK?

For technical support, including MCZ33810EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33810EK requirements.

6.How does Aetrix verify that MCZ33810EK is sourced from the original manufacturer or authorized distributors?

All MCZ33810EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33810EK meets industry standards.

7.What is the process for return or replacement of MCZ33810EK?

All MCZ33810EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33810EK, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCZ33810EK part is unused and in its original packaging.

Return procedure for MCZ33810EK:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCZ33810EK Tags

  • MCZ33810EK
  • MCZ33810EK PDF
  • MCZ33810EK Datasheet
  • MCZ33810EK Specifications
  • MCZ33810EK Images
  • NXP Semiconductors
  • NXP Semiconductors MCZ33810EK
  • Buy MCZ33810EK
  • MCZ33810EK Price
  • MCZ33810EK Distributor
  • MCZ33810EK Supplier
  • MCZ33810EK Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER