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Microchip Technology MEC1609-PZP
- Part No.:
- MEC1609-PZP
- Manufacturer:
- Microchip Technology
- Category:
- Application Specific Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
MEC1609-PZP.pdf
- Description:
- IC EMBEDDED CTLR
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MEC1609-PZP from Microchip Technology is a 32-bit ARC625-based embedded controller (EC) for advanced I/O subsystems in x86 platforms, featuring 192 KB embedded Flash, 16 KB dual-ported SRAM, LPC interface compliance with ACPI, and integrated SMBus 2.0/PECI 2.0 support for system power management and thermal monitoring in notebook and ultrabook designs.
For engineers reviewing the MEC1609-PZP datasheet, MEC1609-PZP pinout, MEC1609-PZP application, or MEC1609-PZP equivalent, key selection considerations include LPC host interface timing, VBAT/VTR standby power architecture, BC-Link™/VLPC™ peripheral expansion capability, and EC-programmable base address configuration for legacy compatibility.
Technical Context
The MEC1609-PZP implements an ARC625D 32-bit RISC core with 2 KB instruction cache and AHB memory-mapped SPI Flash read controller, enabling direct execution from embedded Flash. It supports dual-mode LPC transactions-host-targeted I/O decoding and trusted cycle access-while maintaining full EC control over system reset, wake events, and ACPI-compliant power state transitions.
Its mixed-signal architecture integrates three independent SMBus 2.0 controllers (fully operational in standby), PECI 2.0 for CPU thermal telemetry, 115 GPIOs including 8-pin pass-through, and hardware-accelerated peripherals including four 16-bit auto-reloading timers, 10-bit 16-channel ADC, and eight PWM fan outputs-all synchronized to a 64.52 MHz ±2% internal clock derived from 32.768 kHz crystal input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARC625D 32-bit RISC microcontroller with 32×32×64 fast multiply, divide assist, and saturation arithmetic |
| Memory | 192 KB user Flash + 2 KB info block (35 ns access, 1K endurance cycles); 16 KB dual-ported SRAM; 2 KB instruction cache |
| LPC Interface | ACPI-compliant, supports LPC I/O and Trusted Cycles decoding; EC-programmable base address per ISA Plug-and-Play standard |
| Power Management | Dual suspend planes: VBAT (32.768 kHz RTC, 64-byte backup RAM, week alarm timer) and VTR (low-standby-current sleep mode) |
| Peripherals | Three SMBus 2.0 controllers (400 kHz, clock stretching, DMA-driven); PECI 2.0; 18×8 keyboard scan matrix; three PS/2 ports; 115 GPIOs |
| Package & Temp | 144-pin LFBGA (10×10×0.8 mm, RoHS); commercial temperature range (0°C to +70°C) |
| Clock Generation | Integrated 32.768 kHz oscillator; programmable 64.52 MHz ±2% main clock with power-aware distribution |
Pinout & Package
MEC1609-PZP is housed in a 144-pin LFBGA package (10 mm × 10 mm, 0.8 mm height, 0.5 mm pitch), RoHS compliant, with VTR and VBAT power domains physically isolated for low-power suspend operation. Pin functions are multiplexed across LPC, SMBus, PS/2, BC-Link™, VLPC™, and analog interfaces as defined in Microchip DS00001769A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LAD[3:0] | LPC Address/Data Bus | Time-multiplexed 4-bit bidirectional bus for LPC I/O and memory cycles; supports Fast GateA20 and CPU_RESET assertion |
| LFRAME#, LRESET#, PCI_CLK | LPC Control Signals | Frame initiation, reset synchronization, and clock input for LPC protocol timing compliance with Intel specifications |
| SMB0[7:0]_DATA*, SMB0[7:0]_CLK* | SMBus 0 Interface | Primary SMBus 2.0 master/slave port with hardware bus fairness, timeout handling, and 400 kHz operation |
| PS2_DAT[2:0]*, PS2_CLK[2:0]* | PS/2 Interface | Three independent hardware-driven PS/2 ports supporting keyboard/mouse; fully functional in main/suspend power states |
| VBAT, VTR, VCC | Power Planes | VBAT powers RTC, alarm, and 64-byte memory during battery-only mode; VTR enables low-standby-current sleep; VCC monitors runtime power |
| XTAL1/XTAL2 | 32.768 kHz Crystal Input | Drives hibernation timers, week alarm, and VBAT-powered clock generator; operates during suspend power |
Key Features
| Feature | Design Value |
|---|---|
| BC-Link™/VLPC™ Interconnect | Enables peer-to-peer and multi-drop communication with up to four companion components, extending EC functionality without host intervention |
| EC-Programmable Base Address | Allows dynamic assignment of LPC I/O space at boot, eliminating fixed address conflicts in complex platform configurations |
| Hardware Mailbox Interface | Provides two register-level command interfaces and 32 scratch registers for host-EC messaging without software polling or interrupt overhead |
| FAN PWM & Tachometer Support | Eight 16-bit PWM outputs with programmable on/off counters and four tach inputs enable closed-loop thermal control without CPU involvement |
| ADC with Low INL/DNL | 10-bit conversion in 10 μs with ±0.5 LSB integral and differential non-linearity ensures accurate voltage/current sensing for system health monitoring |
| RC_ID Single-Pin Detection | Replaces up to eight GPIOs by quantizing external RC circuit time constants into 8 discrete states-reducing BOM cost and PCB routing complexity |
Applications
| Ultrabook Power Management | Notebook Thermal Control |
|---|---|
|
Use Scenario: Real-time coordination of S0–S5 power states, battery charging, lid open/close detection, and instant-on resume in thin-and-light notebooks. IC Role / Device Role / Timing Role: Primary embedded controller managing ACPI-compliant SCI event generation, VBAT-backed RTC, and hibernation timer wake scheduling. Use Value: Enables sub-500 µA standby current via VTR/VBAT dual-plane isolation and hardware-accelerated wake event aggregation. |
Use Scenario: Fan speed regulation, CPU/GPU temperature telemetry, and thermal throttling response in high-performance mobile platforms. IC Role / Device Role / Timing Role: PECI 2.0 master interfacing with CPU die sensors; SMBus 2.0 master controlling thermal diodes and fan drivers. Use Value: Delivers 400 kHz SMBus throughput and hardware clock stretching support to maintain reliability under variable thermal load conditions. |
| Legacy Keyboard/Mouse Interface | Industrial Embedded Control Hub |
|
Use Scenario: Emulation of 8042 keyboard controller with Fast GATEA20 and CPU_RESET support for BIOS compatibility in modern x86 systems. IC Role / Device Role / Timing Role: Dual-role PS/2 port controller with edge-triggered wake capability and 18×8 keyboard scan matrix handling. Use Value: Eliminates need for discrete 8042 IC while preserving full legacy interrupt behavior and BIOS handshake timing. |
Use Scenario: Centralized I/O management in ruggedized embedded systems requiring long-term supply stability and extended temperature operation. IC Role / Device Role / Timing Role: Mixed-signal hub integrating 115 GPIOs, 16-channel ADC, LED breathing control, and resistor/capacitor ID detection. Use Value: Reduces external component count via RC_ID single-pin sensing and programmable 16-bit counter/timers with measurement mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MEC1618-PZP | Higher Flash (256 KB), industrial temp (−40°C to +85°C), added USB 2.0 device controller and enhanced security features | Required for extended temperature environments or when USB device interface is needed alongside LPC/PECI/SMBus | Select MEC1618-PZP only if industrial qualification or USB device functionality is mandatory; otherwise MEC1609-PZP offers optimal cost/performance for commercial notebooks |
| IT5570E-256QF | 8051-based EC with 256 KB Flash, QFP-256 package, no ARC core, no BC-Link™/VLPC™, limited SMBus/PECI feature set | Used in legacy desktop motherboards where QFP packaging and 8051 toolchain compatibility outweigh performance and interconnect flexibility | Choose IT5570E-256QF only for brownfield designs constrained by 8051 firmware reuse or QFP layout requirements; not suitable for new ARC-based architectures |
Compared with MEC1618-PZP, the MEC1609-PZP provides identical LPC/ACPI/SMBus/PECI functionality at lower cost and smaller LFBGA footprint but lacks industrial temp rating and USB support; versus IT5570E-256QF, it delivers superior real-time performance, advanced interconnect, and lower power-but requires ARC toolchain adoption and BGA assembly capability.
Availability
MEC1609-PZP is available at Aetrix Electronics and suitable for ultrabook power management, notebook thermal control, legacy keyboard interface, and industrial embedded control hub applications requiring stable component supply and long-term lifecycle support.
Supply support for MEC1609-PZP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a U.S.-based semiconductor company specializing in microcontrollers, analog devices, and embedded control solutions, with ISO/TS-16949 certified manufacturing and global technical support infrastructure.
The MEC1609-PZP belongs to Microchip's Mixed-Signal Mobile Embedded Flash ARC EC family, designed specifically to replace legacy 8051-based ECs in x86 client platforms while delivering higher performance, lower power, and scalable peripheral interconnect via BC-Link™ and VLPC™.
FAQ
What is the operating voltage range for the MEC1609-PZP?
The MEC1609-PZP operates at 3.3 V nominal supply. Its dual-power architecture separates runtime (VCC), suspend (VTR), and battery-backup (VBAT) domains-enabling stable 3.3 V operation across active, sleep, and hibernate states without level-shifting. This design ensures reliable LPC interface signaling and low-standby-current performance down to 500 µA in S5.
Does the MEC1609-PZP support JTAG debugging and in-system programming?
Yes, the MEC1609-PZP includes full JTAG support with both master and slave capabilities, enabling boundary-scan testing, flash programming, and real-time debug of the ARC625D core. JTAG interfaces (TCK, TMS, TDI, TDO, TRST#) are accessible on dedicated pins and allow secure, EC-initiated programming of embedded Flash-including protected boot blocks and password-secured pages.
How many SMBus controllers does the MEC1609-PZP integrate, and what are their key capabilities?
The MEC1609-PZP integrates three independent SMBus 2.0 controllers (SMB0–SMB2), each capable of master or dual-slave operation. All remain fully functional during VTR-powered standby, support clock stretching, programmable bus speeds up to 400 kHz, hardware fairness arbitration, and DMA-driven data transfer-enabling concurrent thermal sensor polling and fan control without CPU intervention.
What is the purpose of the BC-Link™ and VLPC™ interfaces in the MEC1609-PZP?
BC-Link™ provides peer-to-peer communication between the MEC1609-PZP and up to four companion components using high-speed masters; VLPC™ is a multi-drop protocol connecting the MEC1609-PZP to up to three untrusted and one trusted peripheral-allowing LPC and ARC transactions to be forwarded transparently to off-die resources. Both extend the EC's reach beyond its silicon boundary without host involvement.
Can the MEC1609-PZP operate without an external crystal?
No-the MEC1609-PZP requires a 32.768 kHz external crystal connected to XTAL1/XTAL2 pins to drive its VBAT-powered clock generator, hibernation timers, and week alarm interface. While the 64.52 MHz main clock is internally generated, the 32.768 kHz reference is mandatory for all battery-backed functions and cannot be substituted with an RC oscillator due to accuracy and stability requirements.
MEC1609-PZP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 144-LFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- I/O Controller
- Core Processor:
- ARC-625D
- Program Memory Type:
- FLASH (192kB)
- Controller Series:
- -
- RAM Size:
- 16K x 8
- Interface:
- ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC
- Number of I/O:
- 115
- Voltage - Supply:
- 3.3V
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-LFBGA (10x10)
MEC1609-PZP FAQ
1.How can I place an order for MEC1609-PZP through Aetrix?
Please submit a Request for Quotation (RFQ) for MEC1609-PZP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MEC1609-PZP reliable?
The price and inventory of MEC1609-PZP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MEC1609-PZP is usually 5 days.
3.What payment methods are accepted for MEC1609-PZP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MEC1609-PZP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MEC1609-PZP?
MEC1609-PZP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MEC1609-PZP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MEC1609-PZP?
For technical support, including MEC1609-PZP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MEC1609-PZP requirements.
6.How does Aetrix verify that MEC1609-PZP is sourced from the original manufacturer or authorized distributors?
All MEC1609-PZP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MEC1609-PZP meets industry standards.
7.What is the process for return or replacement of MEC1609-PZP?
All MEC1609-PZP units undergo pre-shipment inspection (PSI). If there is an issue with MEC1609-PZP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MEC1609-PZP part is unused and in its original packaging.
Return procedure for MEC1609-PZP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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