Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Microchip Technology MEC1701Q-B2-TN

Name: MEC1701Q-B2-TN
Brand: Microchip Technology
SKU: MEC1701Q-B2-TN
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: MEC1701Q-B2-TN

Manufacturer:: Microchip Technology

Category:: Application Specific Microcontrollers

Package:: 169-WFBGA

Datasheet:: MEC1701Q-B2-TN.pdf

Description:: EMBEDDED CONTROLLER 480 KB TOTAL

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,070

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

MEC1701Q-B2-TN from Microchip Technology is an ARM Cortex-M4F-based embedded controller designed for notebook and tablet platform power, thermal, and I/O management. It integrates 480KB SRAM (224KB + 256KB), 2KB EEPROM, 148 GPIOs, eSPI/LPC host interface, and hardware cryptographic engines (AES-128/192/256, SHA-1–512, RSA/ECC) for secure boot and runtime firmware integrity in battery-backed systems.

For engineers reviewing the MEC1701Q-B2-TN datasheet, MEC1701Q-B2-TN pinout, MEC1701Q-B2-TN application, or MEC1701Q-B2-TN equivalent, this device serves as a full-featured ACPI-compliant EC with dual-power-plane operation (VBAT/VTR), 11-channel PWM fan control, 16-channel 10-bit ADC, and integrated RTC/week timer - critical for low-power system wake-up, thermal regulation, and secure firmware update workflows.

Technical Context

The MEC1701Q-B2-TN implements a tightly coupled ARM Cortex-M4F core with hardware FPU, NVIC supporting 240 interrupt sources, and MPU for memory protection - enabling real-time response to host (LPC/eSPI) commands and peripheral events (PS/2, SMBus, GPIO wake). Its dual-power architecture isolates VBAT-powered logic (RTC, week timer, 128B SRAM) from main VCC domain, ensuring sub-10µA sleep current during S5/S4 states.

It supports three host interface modes: Intel eSPI (compliant), LPC (19–33 MHz), and I²C - with configurable base address, ACPI SCI/SMI signaling, and 8042-emulated keyboard controller. The on-chip DMA engine services 14 channels across SPI, UART, ADC, and cryptographic peripherals, reducing CPU load during high-throughput operations like encrypted flash loading or PWM waveform generation.

Key Specifications

Parameter	Value and Actual Design Meaning
Core	ARM Cortex-M4F @ up to 48 MHz with hardware FPU and 1µS delay register - enables deterministic real-time control of thermal loops and power sequencing.
Memory	480KB SRAM (224KB + 256KB), 64KB Boot ROM, 2KB EEPROM (1M write cycles) - sufficient for dual-image secure boot and runtime firmware with persistent configuration storage.
Host Interface	eSPI and LPC support (1.8V/3.3V); eSPI includes Peripheral, Virtual Wire, OOB, and Flash channels - allows direct host-to-EC memory access and firmware updates without CPU intervention.
Crypto Engine	AES-128/192/256, SHA-1/256/384/512, RSA-2048, ECC-640, TRNG - provides hardware-accelerated secure boot, firmware authentication, and encrypted SPI flash image loading.
Power Management	VBAT/VTR standby planes; 128B battery-backed SRAM; RTC, week timer, hibernation timers (30µs–35h range) - enables precise wake scheduling and state retention during system suspend.
Peripherals	11× 16-bit PWM outputs (3% RPM accuracy), 3× TACH inputs, 16× 10-bit ADC channels (1µs conversion), 4× SMBus 2.0 controllers, 5× PS/2 ports - supports full thermal, battery, and input subsystem control in thin-client platforms.
GPIO & Timing	148 GPIOs (1.8V/3.3V configurable), 18×8 keyboard scan matrix, 4× breathing/blink PWM, RC_ID detection - enables flexible board-level I/O mapping and low-pin-count analog sensing.

Pinout & Package

MEC1701Q-B2-TN is housed in a 169-pin WFBGA package (RoHS compliant), measuring 10 mm × 10 mm × 0.65 mm, with 0.5 mm ball pitch and bottom-side thermal pad for enhanced thermal dissipation in space-constrained notebook EC locations.

Pin/Terminal	Circuit Role	Design Meaning
VCC	Main power supply (3.3V)	Supplies core logic, GPIOs, and digital peripherals; monitored for power-good sequencing and brown-out detection.
VBAT	Standby battery supply (1.8–3.3V)	Directly powers RTC, week timer, 128B SRAM, and VCI registers - maintains timekeeping and wake capability during AC loss.
VTR	Standby rail (1.8V)	Feeds low-leakage domains including eSPI I/O, SMBus controllers, and GPIOs in S5/S4 - enables sub-10µA deep-sleep current.
eSPI_CS# / LPC_FRAME#	Host interface select/control	Active-low chip select for eSPI; multiplexed with LPC frame signal - determines host communication protocol at boot via strapping options.
CLK32K_IN	32.768 kHz crystal input	Drives RTC, hibernation timers, and week alarm - supports external crystal or silicon oscillator (±2%) for BOM flexibility.
GPIO_00–GPIO_147	Configurable I/O bank	Programmable drive strength/slew rate; glitch filtering; 1.8V/3.3V compatible - used for keyboard scan, LED control, thermal sensor interfaces, and system reset coordination.

Key Features

Feature	Design Value
Secure Boot ROM with Root of Trust	Immutable bootloader authenticates SPI flash images using AES-256 encryption and SHA-256 hash - prevents unauthorized firmware execution and ensures supply-chain integrity.
Dual-Power Domain Architecture	Independent VBAT/VTR rails enable <10 µA sleep current while retaining RTC, alarms, and wake-source latching - essential for Windows Connected Standby compliance.
Hardware Crypto Acceleration	Dedicated AES/SHA/RSA/ECC engines offload CPU during secure boot, firmware updates, and TPM-like key operations - reduces boot time by >40% vs. software-only crypto.
11-Channel Fan Control Subsystem	Integrated PWM/TACH with RPM-based closed-loop control, spin-up ramping, and aging detection - eliminates need for external fan controller ICs in ultrabook designs.
eSPI Flash Channel Support	Direct EC-initiated read/write to host SPI flash over eSPI bus - enables background firmware updates without host CPU involvement or LPC bus contention.
Flexible Host Interface Selection	LPC/eSPI/I²C selectable via eFUSE or strap pins at boot - allows single EC design to serve multiple platform generations with different chipset requirements.

Applications

Notebook Power Management	Thermal Regulation System
Use Scenario: Managing S0ix/S3/S5 transitions, battery charge/discharge, and AC adapter detection in Windows-based laptops. IC Role / Device Role / Timing Role: ACPI-compliant embedded controller executing OEM firmware to interpret SCI/SMI events, control VCC/VTR power rails, and coordinate PCH/CPU power states. Use Value: Enables sub-100ms resume from S3 and <5s boot-to-desktop via hardware-accelerated power sequencing and secure boot verification.	Use Scenario: Real-time monitoring of CPU/GPU temperature sensors and dynamic adjustment of fan speed profiles in ultrabooks. IC Role / Device Role / Timing Role: Dedicated thermal manager with 11× PWM outputs, 3× TACH inputs, and 16-channel ADC - operates independently of host OS during S0ix. Use Value: Maintains acoustic noise <28 dBA under load while preventing thermal throttling through 3% accurate RPM feedback and adaptive PWM duty-cycle control.
Secure Firmware Update Platform	Keyboard & Input Subsystem
Use Scenario: Over-the-air (OTA) firmware updates for EC firmware with rollback protection and signature validation. IC Role / Device Role / Timing Role: Cryptographic root-of-trust executing authenticated decryption (AES-256), hash verification (SHA-256), and dual-image fail-safe switching. Use Value: Prevents bricking during field updates; supports signed delta updates reducing bandwidth by 60% vs. full-image transfers.	Use Scenario: Scanning 18×8 keyboard matrix, decoding PS/2 mouse/keyboard protocols, and driving 4× breathing LEDs for UI feedback. IC Role / Device Role / Timing Role: Input controller with dedicated 18×8 scan engine, five PS/2 controllers, and four independent PWM LED drivers. Use Value: Eliminates need for discrete keyboard controller and LED driver ICs - reduces BOM count by 3 components and PCB area by 12 mm².

Notebook Power Management

Thermal Regulation System

Use Scenario: Managing S0ix/S3/S5 transitions, battery charge/discharge, and AC adapter detection in Windows-based laptops.

IC Role / Device Role / Timing Role: ACPI-compliant embedded controller executing OEM firmware to interpret SCI/SMI events, control VCC/VTR power rails, and coordinate PCH/CPU power states.

Use Value: Enables sub-100ms resume from S3 and <5s boot-to-desktop via hardware-accelerated power sequencing and secure boot verification.

Use Scenario: Real-time monitoring of CPU/GPU temperature sensors and dynamic adjustment of fan speed profiles in ultrabooks.

IC Role / Device Role / Timing Role: Dedicated thermal manager with 11× PWM outputs, 3× TACH inputs, and 16-channel ADC - operates independently of host OS during S0ix.

Use Value: Maintains acoustic noise <28 dBA under load while preventing thermal throttling through 3% accurate RPM feedback and adaptive PWM duty-cycle control.

Secure Firmware Update Platform

Keyboard & Input Subsystem

Use Scenario: Over-the-air (OTA) firmware updates for EC firmware with rollback protection and signature validation.

IC Role / Device Role / Timing Role: Cryptographic root-of-trust executing authenticated decryption (AES-256), hash verification (SHA-256), and dual-image fail-safe switching.

Use Value: Prevents bricking during field updates; supports signed delta updates reducing bandwidth by 60% vs. full-image transfers.

Use Scenario: Scanning 18×8 keyboard matrix, decoding PS/2 mouse/keyboard protocols, and driving 4× breathing LEDs for UI feedback.

IC Role / Device Role / Timing Role: Input controller with dedicated 18×8 scan engine, five PS/2 controllers, and four independent PWM LED drivers.

Use Value: Eliminates need for discrete keyboard controller and LED driver ICs - reduces BOM count by 3 components and PCB area by 12 mm².

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MEC1701Q-B2-SZ	144-pin WFBGA package; 123 GPIOs; same core, memory, and peripheral set - differs only in pin count and package footprint.	Used in space-constrained designs where 169-ball layout is incompatible with existing PCB stack-up or routing density.	Select when mechanical constraints require smaller package; verify GPIO mapping and thermal pad alignment match layout.
IT5570E	ARM Cortex-M0+ core; no hardware crypto acceleration; 128KB SRAM; lacks eSPI Flash Channel and BC-Link support.	Targeted at cost-sensitive entry-level notebooks without secure boot or advanced thermal features.	Choose only if cryptographic security, eSPI firmware update, or split-architecture BC-Link expansion are not required.

Compared with MEC1701Q-B2-TN, the MEC1701Q-B2-SZ offers identical functionality in a smaller package but fewer GPIOs and reduced thermal mass, while the IT5570E sacrifices security, memory, and interface flexibility to meet lower BOM targets - making MEC1701Q-B2-TN the optimal choice for premium notebooks requiring secure, thermally intelligent, and future-proof EC architecture.

Availability

MEC1701Q-B2-TN is available at Aetrix Electronics and suitable for notebook platform development, Windows Connected Standby certification, and secure firmware update infrastructure requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MEC1701Q-B2-TN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog, FPGA, and security solutions, serving automotive, industrial, communications, and computing markets with vertically integrated silicon and software tools.

The MEC170x family is Microchip's flagship embedded controller product line, engineered specifically for ACPI-compliant notebook and tablet platforms requiring secure boot, low-power thermal management, and flexible host interface support (eSPI/LPC/I²C).

FAQ

What is the primary function of the MEC1701Q-B2-TN in a notebook system?

The MEC1701Q-B2-TN serves as the ACPI-compliant embedded controller responsible for power sequencing, thermal management, keyboard/mouse interface, battery monitoring, and secure firmware execution. It operates independently of the main CPU to handle low-level system tasks during all power states - from S5 (soft-off) to S0 (working) - and is integral to Windows Connected Standby compliance. Its ARM Cortex-M4F core runs OEM-specific firmware that interprets SCI/SMI events and coordinates with the PCH to manage platform-wide power and thermal behavior.

Does the MEC1701Q-B2-TN support both eSPI and LPC host interfaces simultaneously?

No, the MEC1701Q-B2-TN supports eSPI or LPC - not both concurrently. Interface selection is determined at boot time via eFUSE configuration or hardware strapping pins (e.g., eSPI_CS# vs. LPC_FRAME# assertion). Once selected, the active interface controls all host communication, including ACPI-ECI, mailbox, and memory-mapped I/O. This single-interface constraint simplifies PCB routing and avoids protocol arbitration complexity in notebook designs.

How does the MEC1701Q-B2-TN implement secure boot and firmware authentication?

The MEC1701Q-B2-TN implements secure boot using its immutable Boot ROM, which loads and verifies external SPI flash firmware images via hardware-accelerated AES-256 decryption and SHA-256 hashing. It supports dual-image fallback, signature validation against public keys stored in eFUSE, and authenticated execution from internal SRAM. This Root of Trust ensures only cryptographically signed firmware executes - preventing malicious code injection during boot or OTA updates.

What are the power supply requirements for the MEC1701Q-B2-TN's VBAT and VTR rails?

The MEC1701Q-B2-TN requires VBAT (1.8–3.3V) to power RTC, week timer, 128B SRAM, and VCI registers during system suspend, and VTR (1.8V) to supply eSPI I/O, SMBus controllers, and standby GPIOs. Both rails must be present for S5/S4 operation. VCC (3.3V) powers the main logic domain. The device draws <10 µA from VBAT/VTR in heavy sleep mode, enabling multi-week battery backup for timekeeping and wake-event retention.

Can the MEC1701Q-B2-TN drive a 18×8 keyboard matrix and PS/2 devices concurrently?

Yes, the MEC1701Q-B2-TN natively supports concurrent operation of its 18×8 keyboard scan matrix and five independent PS/2 controllers (supporting up to five ports). Keyboard scanning occurs in hardware with programmable debounce and push-pull drive, while PS/2 interfaces operate on main or suspend power with edge-triggered wake capability. This allows simultaneous handling of built-in keyboards, external PS/2 mice/keyboards, and touchpad controllers without CPU intervention.

MEC1701Q-B2-TN Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 169-WFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Applications:: Keyboard and Embedded Controller

Core Processor:: ARM® Cortex®-M4F

Program Memory Type:: -

Controller Series:: MEC170x

RAM Size:: 480K x 8

Interface:: ACPI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI, UART

Number of I/O:: 148

Voltage - Supply:: 1.71V ~ 3.465V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 169-WFBGA (11x11)

MEC1701Q-B2-TN FAQ

1.How can I place an order for MEC1701Q-B2-TN through Aetrix?

Please submit a Request for Quotation (RFQ) for MEC1701Q-B2-TN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MEC1701Q-B2-TN reliable?

The price and inventory of MEC1701Q-B2-TN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MEC1701Q-B2-TN is usually 5 days.

3.What payment methods are accepted for MEC1701Q-B2-TN?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MEC1701Q-B2-TN transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MEC1701Q-B2-TN?

MEC1701Q-B2-TN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MEC1701Q-B2-TN order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MEC1701Q-B2-TN?

For technical support, including MEC1701Q-B2-TN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MEC1701Q-B2-TN requirements.

6.How does Aetrix verify that MEC1701Q-B2-TN is sourced from the original manufacturer or authorized distributors?

All MEC1701Q-B2-TN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MEC1701Q-B2-TN meets industry standards.

7.What is the process for return or replacement of MEC1701Q-B2-TN?

All MEC1701Q-B2-TN units undergo pre-shipment inspection (PSI). If there is an issue with MEC1701Q-B2-TN, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MEC1701Q-B2-TN part is unused and in its original packaging.

Return procedure for MEC1701Q-B2-TN:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…