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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

Microchip Technology MEC1723N-B0-I/LJ-TR

Name: MEC1723N-B0-I/LJ-TR
Brand: Microchip Technology
SKU: MEC1723N-B0-I/LJ-TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MEC1723N-B0-I/LJ-TR

Manufacturer:: Microchip Technology

Category:: Application Specific Microcontrollers

Package:: 176-WFBGA

Datasheet:: MEC1723N-B0-I/LJ-TR.pdf

Description:: EMBEDDED CONTROLLER 416 KB TOTAL

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Product details

Overview

MEC1723N-B0-I/LJ-TR from Microchip Technology is a low-power, ARM® Cortex-M4F-based embedded controller designed for notebook PC and storage enclosure platforms. It integrates eSPI host interface, 416KB SRAM (352KB code + 64KB data), 128-byte battery-backed RAM, 2KB internal EEPROM, and hardware cryptographic accelerators (AES-256, ECDSA, SHA-512, RSA up to 4096-bit). It operates at 3.3 V / 1.8 V across dual I/O voltage banks and supports ACPI S0–S5 states in systems requiring secure boot and fan/thermal management.

For engineers reviewing the MEC1723N-B0-I/LJ-TR datasheet, MEC1723N-B0-I/LJ-TR pinout, MEC1723N-B0-I/LJ-TR application, or MEC1723N-B0-I/LJ-TR equivalent, this device is evaluated for eSPI-connected embedded controller roles in thin-client, ultrabook, and mobile workstation designs where secure firmware loading, real-time thermal monitoring, and low-power sleep state coordination are critical selection criteria.

Technical Context

The MEC1723N-B0-I/LJ-TR implements an Intel eSPI-compliant host interface with full support for Peripheral, Virtual Wires, OOB, and Run-time Flash Access channels - enabling direct BIOS/UEFI communication and Master/Slave Attached Flash Sharing (MAFS/SAFS) with region-based protection. Its ARM Cortex-M4F core runs at up to 48 MHz and executes from tightly coupled SRAM, with ROM-hosted secure boot loader and runtime APIs for cryptographic operations.

Power management includes two chip-level sleep modes (Light Sleep and Heavy Sleep), RTC and hibernation timers operating from VBAT, and wake event sources including GPIO, PS2, RTC alarm, week timer, and eSPI commands. The device uses separate 3.3 V (VTR1), 1.8 V (VTR3), and configurable 1.8/3.3 V (VTR2) I/O banks to interface with modern PCHs and legacy platforms simultaneously.

Key Specifications

Parameter	Value and Actual Design Meaning
Core	ARM Cortex-M4F, up to 48 MHz - enables deterministic real-time control of keyboard scan, fan PWM, and thermal algorithms without external MCU.
SRAM	416 KB total (352 KB code-optimized + 64 KB data-optimized) - sufficient for full EC firmware, driver stacks, and runtime variables in notebook power management.
eSPI Interface	Intel eSPI v1.0 compliant, up to 66 MHz - replaces LPC bus with reduced pin count, higher bandwidth, and built-in flash sharing security for BIOS/ME coexistence.
Cryptographic Accelerators	AES-256, ECDSA, SHA-256/512, RSA 1024–4096-bit, TRNG - offloads secure boot authentication and encrypted SPI flash image decryption from firmware.
Package	176-pin WFBGA (7.0 × 7.0 mm, 0.4 mm pitch) - matches footprint requirements for space-constrained notebook motherboard EC placement.
Operating Voltage	3.3 V (VTR1) and 1.8 V (VTR3/VTR2) supply domains - enables interoperability with both legacy 3.3 V and modern 1.8 V platform controller hubs.
Temperature Range	−40 °C to +85 °C - qualified for extended thermal operation in compact, fanless, or high-density notebook chassis environments.

Pinout & Package

MEC1723N-B0-I/LJ-TR is housed in a 176-pin Wafer-Level Fine-Pitch Ball Grid Array (WFBGA) package measuring 7.0 mm × 7.0 mm with 0.4 mm ball pitch and 0.25 mm ball diameter. The package supports lead-free reflow assembly and is rated for JEDEC J-STD-020 moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
eSPI_CS#	eSPI Chip Select Input	Active-low signal initiating eSPI transaction; asserted by host to select MEC1723N-B0-I/LJ-TR as eSPI slave.
eSPI_CLK	eSPI Clock Input	Provides synchronous timing reference up to 66 MHz; phase-aligned with eSPI data signals for reliable command decoding.
eSPI_IO0–IO3	eSPI Data I/O (Quad Mode)	Bidirectional data lines supporting single/dual/quad I/O modes; enable high-speed peripheral channel transfers and flash access.
VTR1	3.3 V I/O Power Supply	Supplies 3.3 V to dedicated I/O bank (e.g., PS2, UART, legacy GPIO); decoupled from VTR2/VTR3 for noise isolation.
VTR2	Configurable 1.8/3.3 V I/O Power	Selectable voltage domain for mixed-signal interfaces (e.g., ADC, comparators, RC_ID); supports flexible board-level voltage routing.
VTR3	1.8 V I/O Power Supply	Powers eSPI, I2C/SMBus, and other high-speed digital interfaces compatible with modern PCHs; reduces dynamic power vs. 3.3 V.
VBAT	Battery Backup Supply	Connects to coin cell or system battery; maintains RTC, hibernation timer, week timer, and 128-byte SRAM during main power loss.
VCI_IN0#	Embedded Reset Input	Active-low reset trigger; held low for programmable duration forces EC subsystem reset independent of host power sequencing.

Key Features

Feature	Design Value
Secure Boot ROM	Hardware root of trust authenticates AES-256-encrypted or ECDSA-signed SPI flash images before execution - prevents unauthorized firmware injection.
eSPI SAFS Bridge	Enables Slave Attached Flash Sharing with region-based locking - allows BIOS, ME, and EC firmware to share one SPI flash while enforcing access isolation.
Integrated Fan Control	Two RPM-based fan controllers with automatic tach feedback, spin-up routines, and 3% accuracy from 500–16k RPM - eliminates need for external fan ICs.
VBAT-Powered Peripherals	RTC, hibernation timer, week timer, and 128-byte SRAM remain active on battery only - supports instant-on resume and calendar alarms without host involvement.
Multi-Voltage GPIO Banks	Three independent I/O voltage domains (VTR1=3.3 V, VTR2=configurable, VTR3=1.8 V) - simplifies interface to mixed-voltage peripherals without level shifters.
PROCHOT Monitoring	Dual PROCHOT inputs with programmable thresholds and hysteresis - enables precise CPU throttling coordination and system-level thermal response.

Applications

Ultrabook Power Management	Notebook Thermal Control
Use Scenario: Managing S0ix connected standby, lid open/close detection, battery charging state, and keyboard backlight timing in sub-15 mm clamshell notebooks. IC Role / Device Role / Timing Role: Embedded controller executing ACPI EC firmware; handles eSPI virtual wire signaling, GPIO wake events, and RTC-based suspend/resume scheduling. Use Value: Reduces system wake latency to <10 ms via eSPI command-triggered wake and maintains accurate time-of-day during battery-only operation.	Use Scenario: Real-time monitoring of CPU/GPU die temperature via thermistor ADC inputs and dynamic adjustment of four fan PWM outputs in dual-heat-pipe designs. IC Role / Device Role / Timing Role: Thermal management unit with integrated 10/12-bit ADC, analog comparators, and dual RPM-based fan controllers - operates independently of host OS. Use Value: Achieves 3% RPM accuracy from 500–16k RPM and detects aging fans via automatic tach feedback deviation analysis.
Thin Client BIOS Coordination	Mobile Workstation Security Boot
Use Scenario: Enabling fast boot, secure display initialization, and hotkey processing (e.g., brightness, volume) in ARM/x86 hybrid thin clients with shared SPI flash. IC Role / Device Role / Timing Role: eSPI master/slave coordinator managing MAFS/SAFS flash access between BIOS, ME, and EC firmware partitions. Use Value: Eliminates LPC bus bottlenecks and enables concurrent flash reads/writes across multiple masters using hardware-enforced region locking.	Use Scenario: Authenticating and decrypting OEM firmware images stored in external SPI flash before loading into SRAM on Intel Core i7/i9 mobile workstations. IC Role / Device Role / Timing Role: Secure boot loader with hardware-accelerated AES-256 decryption and ECDSA signature verification - executed from ROM before any firmware runs. Use Value: Prevents persistent malware insertion by validating firmware integrity and origin using immutable ROM-based crypto engines.

Ultrabook Power Management

Notebook Thermal Control

Use Scenario: Managing S0ix connected standby, lid open/close detection, battery charging state, and keyboard backlight timing in sub-15 mm clamshell notebooks.

IC Role / Device Role / Timing Role: Embedded controller executing ACPI EC firmware; handles eSPI virtual wire signaling, GPIO wake events, and RTC-based suspend/resume scheduling.

Use Value: Reduces system wake latency to <10 ms via eSPI command-triggered wake and maintains accurate time-of-day during battery-only operation.

Use Scenario: Real-time monitoring of CPU/GPU die temperature via thermistor ADC inputs and dynamic adjustment of four fan PWM outputs in dual-heat-pipe designs.

IC Role / Device Role / Timing Role: Thermal management unit with integrated 10/12-bit ADC, analog comparators, and dual RPM-based fan controllers - operates independently of host OS.

Use Value: Achieves 3% RPM accuracy from 500–16k RPM and detects aging fans via automatic tach feedback deviation analysis.

Thin Client BIOS Coordination

Mobile Workstation Security Boot

Use Scenario: Enabling fast boot, secure display initialization, and hotkey processing (e.g., brightness, volume) in ARM/x86 hybrid thin clients with shared SPI flash.

IC Role / Device Role / Timing Role: eSPI master/slave coordinator managing MAFS/SAFS flash access between BIOS, ME, and EC firmware partitions.

Use Value: Eliminates LPC bus bottlenecks and enables concurrent flash reads/writes across multiple masters using hardware-enforced region locking.

Use Scenario: Authenticating and decrypting OEM firmware images stored in external SPI flash before loading into SRAM on Intel Core i7/i9 mobile workstations.

IC Role / Device Role / Timing Role: Secure boot loader with hardware-accelerated AES-256 decryption and ECDSA signature verification - executed from ROM before any firmware runs.

Use Value: Prevents persistent malware insertion by validating firmware integrity and origin using immutable ROM-based crypto engines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded controller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MEC1724N-B0-I/LJ	Same 176-pin WFBGA package and eSPI interface, but includes 8KB EEPROM (vs. 2KB) and no internal SPI flash - higher nonvolatile storage capacity for larger firmware images.	Preferred where field-upgradable EC firmware exceeds 2KB and requires robust wear-leveling; not suitable if in-chip SPI flash is required.	Select MEC1724N-B0-I/LJ when firmware size demands >2KB EEPROM and internal SPI flash is unnecessary.
IT5570E-124FN	8051-based EC with LPC interface, no eSPI or ARM core - lacks cryptographic accelerators, RTOS timer, and multi-voltage GPIO banks.	Legacy platform replacement where LPC bus remains; unsuitable for new eSPI-based designs or secure boot requirements.	Choose IT5570E-124FN only for cost-sensitive LPC-based notebooks without security or low-power sleep requirements.

Compared with MEC1723N-B0-I/LJ-TR, MEC1724N-B0-I/LJ offers greater EEPROM capacity for firmware expansion but omits internal SPI flash, while IT5570E-124FN provides basic EC functionality on LPC at lower cost but lacks eSPI, ARM performance, and hardware security - making MEC1723N-B0-I/LJ-TR optimal for new secure, low-power notebook platforms.

Availability

MEC1723N-B0-I/LJ-TR is available at Aetrix Electronics and suitable for notebook PC power management, ultrabook thermal control, thin client BIOS coordination, and mobile workstation secure boot applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MEC1723N-B0-I/LJ-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, FPGAs, and security solutions, serving automotive, industrial, communications, and computing markets with vertically integrated silicon and software tools.

The MEC172x family is part of Microchip's Embedded Controller product line, designed specifically for secure, low-power, ACPI-compliant system management in modern x86 notebook and mobile workstation platforms - integrating eSPI, cryptography, and thermal control in a single ARM-based SoC.

FAQ

What is the primary function of the MEC1723N-B0-I/LJ-TR in a notebook system?

The MEC1723N-B0-I/LJ-TR serves as the embedded controller (EC) responsible for low-level system management tasks including keyboard/mouse scanning, fan speed control, thermal monitoring, ACPI power state transitions (S0–S5), and secure boot coordination via eSPI. Its ARM Cortex-M4F core executes firmware that manages real-time interactions between the host CPU and platform peripherals - all while maintaining ultra-low power consumption in Light/Heavy Sleep modes. The MEC1723N-B0-I/LJ-TR is integral to achieving instant-on responsiveness and battery-efficient connected standby in modern notebooks.

Does the MEC1723N-B0-I/LJ-TR support Intel eSPI specification compliance?

Yes, the MEC1723N-B0-I/LJ-TR fully complies with Intel eSPI Specification v1.0 (Document #327432-004, Rev. 1.0) and eSPI Compatibility Specification v0.6 (Document #562633). It supports all four eSPI channels - Peripheral, Virtual Wires, OOB Tunneled Message, and Run-time Flash Access - and implements hardware features such as Master Attached Flash Sharing (MAFS) and Slave Attached Flash Sharing (SAFS) with region-based protection. This ensures seamless integration into Intel-based platforms requiring LPC replacement and secure shared-flash architectures.

What cryptographic capabilities does the MEC1723N-B0-I/LJ-TR provide for secure boot?

The MEC1723N-B0-I/LJ-TR includes dedicated hardware accelerators for AES-256 encryption/decryption, ECDSA and EC_KCDSA digital signatures, SHA-1/SHA-256/SHA-512 hashing, RSA key generation and verification (1024–4096 bits), and a True Random Number Generator (TRNG). These are used by the ROM-based secure boot loader to authenticate and optionally decrypt the OEM firmware image stored in external SPI flash before loading into SRAM. The MEC1723N-B0-I/LJ-TR also provides lockable OTP memory for storing private keys and device IDs - establishing a hardware root of trust.

How does the MEC1723N-B0-I/LJ-TR manage power in connected standby (S0ix) mode?

The MEC1723N-B0-I/LJ-TR is engineered to operate continuously in its lowest power state during normal operation and supports both Light Sleep and Heavy Sleep modes for ACPI S0ix and deeper S3–S5 states. In Light Sleep, it maintains eSPI responsiveness, RTC operation, and GPIO wake detection with sub-10 µA current draw. Any eSPI command, PS2 activity, RTC alarm, or configured GPIO edge automatically wakes the device within microseconds. The MEC1723N-B0-I/LJ-TR sustains VBAT-powered peripherals - including RTC, hibernation timer, and 128-byte SRAM - ensuring timekeeping and state retention without host intervention.

What is the package type and pin count of the MEC1723N-B0-I/LJ-TR?

The MEC1723N-B0-I/LJ-TR is packaged in a 176-ball Wafer-Level Fine-Pitch Ball Grid Array (WFBGA) with dimensions of 7.0 mm × 7.0 mm and a 0.4 mm ball pitch. This package is identical to that used by MEC1724N-B0-I/LJ and MEC1727N-B0-I/LJ variants, enabling layout reuse across the MEC172x family. The 176-pin WFBGA supports high-density routing on notebook motherboards and is qualified for lead-free reflow per JEDEC J-STD-020 MSL-3 standards.

MEC1723N-B0-I/LJ-TR Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 176-WFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Applications:: Keyboard and Embedded Controller

Core Processor:: ARM® Cortex®-M4F

Program Memory Type:: OTP (512kB)

Controller Series:: MEC172x

RAM Size:: 416K x 8

Interface:: ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI, UART

Number of I/O:: 155

Voltage - Supply:: 1.17V ~ 1.89V, 3.135V ~ 3.465V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 176-WFBGA (10x10)

MEC1723N-B0-I/LJ-TR FAQ

1.How can I place an order for MEC1723N-B0-I/LJ-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MEC1723N-B0-I/LJ-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MEC1723N-B0-I/LJ-TR reliable?

The price and inventory of MEC1723N-B0-I/LJ-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MEC1723N-B0-I/LJ-TR is usually 5 days.

3.What payment methods are accepted for MEC1723N-B0-I/LJ-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MEC1723N-B0-I/LJ-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MEC1723N-B0-I/LJ-TR?

MEC1723N-B0-I/LJ-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MEC1723N-B0-I/LJ-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MEC1723N-B0-I/LJ-TR?

For technical support, including MEC1723N-B0-I/LJ-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MEC1723N-B0-I/LJ-TR requirements.

6.How does Aetrix verify that MEC1723N-B0-I/LJ-TR is sourced from the original manufacturer or authorized distributors?

All MEC1723N-B0-I/LJ-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MEC1723N-B0-I/LJ-TR meets industry standards.

7.What is the process for return or replacement of MEC1723N-B0-I/LJ-TR?

All MEC1723N-B0-I/LJ-TR units undergo pre-shipment inspection (PSI). If there is an issue with MEC1723N-B0-I/LJ-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MEC1723N-B0-I/LJ-TR part is unused and in its original packaging.

Return procedure for MEC1723N-B0-I/LJ-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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