NXP Semiconductors MF3D2200DA6/01J

Overview

MF3D2200DA6/01J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3D2200DA6/01J datasheet, MF3D2200DA6/01J pinout, MF3D2200DA6/01J application, or MF3D2200DA6/01J equivalent, this page delivers verified technical context, exact memory and RF interface specs, confirmed security architecture (EAL5+, mutual three-pass authentication), and real-world deployment constraints including Transaction MAC file support and MIsmartApp delegated management.

Technical Context

The MF3D2200DA6/01J implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (for 2/4/8 kB variants), operates at 13.56 MHz, and uses hardware-accelerated AES-128 and 3DES cryptographic engines for secure messaging. Its on-chip memory management unit (MMU) enforces strict application isolation and supports virtual card architecture with Originality Check and Proximity Check countermeasures.

It features a transaction-oriented anti-tear mechanism across all file types, supports six file types (including Transaction MAC), and enables shared file access across two applications within one transaction. Backward compatibility with MIFARE DESFire EV1 and D40 is maintained via default delivery configuration and optional activation of new commands.

Key Specifications

Pinout & Package

MF3D2200DA6/01J is supplied in MOB6 plastic leadless module carrier package (SOT500-3), designed for embedding into contactless smart cards, tags, or modules. The device has no external pins - it interfaces exclusively via its integrated coil-compatible RF interface (ISO/IEC 14443A). Electrical connection is made through solder pads on the module substrate for antenna bonding; no discrete terminals are defined.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D4200DA6/01, the MF3D2200DA6/01 offers cost-optimized memory for fixed-scope deployments; compared with MF3DH2200DA6/01, it provides standard antenna compatibility without reader recalibration - making it the default choice for mainstream card manufacturing and NFC reader integration.

Availability

MF3D2200DA6/01J is available at Aetrix Electronics and suitable for public transport ticketing, secure campus access, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3D2200DA6/01J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.

The MF3D2200DA6/01J belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-service contactless credentialing in smart cities, transit, and secure access applications.

FAQ

What security certifications does the MF3D2200DA6/01J hold?

The MF3D2200DA6/01J holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for banking cards and electronic passports. This covers its cryptographic engines (AES-128, 3DES), mutual three-pass authentication protocol, and on-chip secure messaging implementation - all validated under CC evaluation. The MF3D2200DA6/01J also supports Originality Check and Proximity Check to defend against cloning and relay attacks.

Does the MF3D2200DA6/01J support ISO/IEC 7816-4 commands?

Yes, the MF3D2200DA6/01J fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These operate alongside native MIFARE DESFire commands and enable interoperability with existing smart card middleware and PKI infrastructures - critical for government ID and healthcare credential deployments using the MF3D2200DA6/01J.

What is the maximum number of applications and files supported by the MF3D2200DA6/01J?

The MF3D2200DA6/01J supports unlimited applications limited only by available 2 KB EEPROM space, with up to 32 files per application. Six file types are available: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. File sizes are user-defined at creation (except Transaction MAC), and automatic anti-tear protection ensures atomic updates across all file types - a core capability enabling reliable multi-service use cases on the MF3D2200DA6/01J.

Is the MF3D2200DA6/01J backward compatible with older MIFARE DESFire generations?

Yes, the MF3D2200DA6/01J is functionally backward compatible with MIFARE DESFire EV1 and MF3ICD40 in its default delivery configuration. It supports D40 and EV1 secure messaging modes alongside its native EV2 secure messaging. Legacy applications continue to operate without modification, while new features like Transaction MAC, MIsmartApp, and Virtual Card Architecture require explicit activation via updated commands - ensuring smooth infrastructure migration for systems already deployed with earlier DESFire ICs.

What package type and mounting method does the MF3D2200DA6/01J use?

The MF3D2200DA6/01J is supplied in MOB6 plastic leadless module carrier package (SOT500-3), designed for embedding into contactless smart cards or tags. It has no external pins - electrical connection is made via solder pads on the module substrate for direct bonding to custom antenna coils. No socketing or through-hole mounting is used; the MF3D2200DA6/01J requires flip-chip or conductive adhesive attachment during card lamination or module assembly.