NXP Semiconductors MF3D2201DUD/01V

Overview

MF3D2201DUD/01V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling public transport, micro-payment, and access control on a single credential.

For engineers reviewing the MF3D2201DUD/01V datasheet, MF3D2201DUD/01V pinout, MF3D2201DUD/01V application, or MF3D2201DUD/01V equivalent, key selection considerations include its 2 KB memory capacity, 17 pF input capacitance optimized for standard antenna designs, EAL5+ hardware/software security certification, and backward compatibility with MIFARE DESFire EV1 and D40 systems.

Technical Context

The MF3D2201DUD/01V implements a dedicated ISO/IEC 14443-4 RF interface supporting data rates up to 848 kbit/s and configurable frame size (FSCI) up to 128 bytes. Its on-chip cryptographic engine executes AES-128, 3TDEA, and 2TDEA operations in hardware with key versioning and CMAC-based message authentication.

It features a flexible file system supporting unlimited applications, up to 32 files per application across six file types-including Transaction MAC-and an automatic anti-tear mechanism ensuring atomic transaction integrity. Security architecture includes mutual three-pass authentication, Proximity Check against relay attacks, and Originality Check for genuine NXP product verification.

Key Specifications

Pinout & Package

MF3D2201DUD/01V is supplied in FFC (Film Frame Carrier) packaging - an 8-inch wafer format, sawn, with 120 μm thickness. This bare-die form factor is intended for embedding into smart card laminates or inlays and has no discrete pins or terminals. Electrical connection is made via bond pads compatible with standard flip-chip or wire-bond assembly processes used in contactless smart card manufacturing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D4201DUD/01 and MF3DH2201DUD/01, the MF3D2201DUD/01V provides optimal cost-performance balance for mid-tier smart city deployments requiring EAL5+ security and 2 KB of robust, field-proven memory - avoiding over-specification while maintaining full backward compatibility and feature parity except memory size and capacitance.

Availability

MF3D2201DUD/01V is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city cards, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3D2201DUD/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with deep expertise in contactless IC design and NFC ecosystem integration.

The MF3D2201DUD/01V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-service contactless credentialing in smart cities, transit, and secure access environments.

FAQ

What security certifications does the MF3D2201DUD/01V hold?

The MF3D2201DUD/01V is certified to Common Criteria EAL5+ for both hardware and software components - the same assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks. The MF3D2201DUD/01V implements mutual three-pass authentication, hardware AES-128 and 3DES engines, and on-chip Proximity Check to prevent relay attacks - all verified under the EAL5+ evaluation scope.

Is the MF3D2201DUD/01V pin-compatible with earlier MIFARE DESFire generations?

The MF3D2201DUD/01V is not a pin-compatible device in the traditional sense - it is a bare-die IC in FFC packaging with bond pads, not leaded pins. However, it is functionally backward compatible with MIFARE DESFire EV1 and D40 (MF3ICD40) at the command and protocol level. In default delivery configuration, the MF3D2201DUD/01V operates as an EV1 device; new EV2 features require explicit activation via specific commands.

What memory organization options does the MF3D2201DUD/01V support?

The MF3D2201DUD/01V supports a flexible, application-centric file system with no hard limit on total applications - constrained only by its 2 KB EEPROM capacity. Each application can contain up to 32 files across six types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. File sizes are defined at creation time (except Transaction MAC), and an automatic anti-tear mechanism ensures atomic updates across related records - critical for fare calculation or balance changes in the MF3D2201DUD/01V.

Does the MF3D2201DUD/01V support ISO/IEC 7816-4 commands?

Yes, the MF3D2201DUD/01V fully supports ISO/IEC 7816-4 APDU structure and file system semantics, including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). This enables interoperability with existing smart card infrastructure and simplifies integration into systems already using ISO-compliant middleware - a key advantage of the MF3D2201DUD/01V in hybrid credential deployments.

How does the MF3D2201DUD/01V handle transaction integrity during power loss or RF disconnect?

The MF3D2201DUD/01V implements a transaction-oriented automatic anti-tear mechanism that guarantees atomicity across all file types supporting backup - including Value, Linear Record, and Cyclic Record files. When a transaction is interrupted (e.g., by removal from field or power failure), the MF3D2201DUD/01V rolls back to the last consistent state using on-chip backup sectors, ensuring no partial writes corrupt financial or operational data. This behavior is hardware-enforced and requires no host-side intervention.