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NXP Semiconductors MF3D2201DUF/01V
- Part No.:
- MF3D2201DUF/01V
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- -
- Datasheet:
-
MF3D2201DUF/01V.pdf
- Description:
- IC MIFARE DESFIRE EV2 MULTI APP
- Quantity:
- Payment:
- Shipping:
Inventory:1,006
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Product details
Overview
MF3D2201DUF/01V from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 17 pF input capacitance, and Common Criteria EAL5+ security certification. It implements hardware-accelerated 3DES and AES-128 cryptographic engines, supports up to 32 files per application, and enables secure public transport ticketing, micro-payment, and access management in compact wafer form (75 μm thickness).
For engineers reviewing the MF3D2201DUF/01V datasheet, MF3D2201DUF/01V pinout, MF3D2201DUF/01V application, or MF3D2201DUF/01V equivalent, key selection criteria include its 2 KB NV memory size, 17 pF input capacitance for standard antenna designs, EAL5+ security level, Transaction MAC file support, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3D2201DUF/01V implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (for 2/4/8 kB variants), operates at 13.56 MHz, and integrates on-chip TRNG, voltage/rail/light/glitch sensors, and active shielding. Its memory management unit (MMU) enforces strict application isolation using 3-byte AIDs and per-application key sets (up to 14 keys).
Security execution includes mutual three-pass authentication, EV2 Secure Messaging with AES-128 CMAC, optional Random ID generation, Proximity Check against relay attacks, and Originality Check for NXP product verification. File-level integrity is ensured via transaction-oriented anti-tear backup for Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC file types.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 2 KB EEPROM - sufficient for up to 28 applications with 32 files each, optimized for cost-sensitive transit and loyalty cards. |
| Input capacitance | 17 pF - matches standard antenna tuning for 13.56 MHz operation without custom matching networks. |
| Cryptographic engines | Hardware 3DES (56/112/168-bit) and AES-128 - enables EAL5+ certified secure messaging and fast session key derivation. |
| Security certification | Common Criteria EAL5+ (HW & SW) - validated for banking-grade and e-passport–level trust requirements. |
| Data retention | 25 years - ensures long-term reliability in embedded smart card deployments without refresh cycles. |
| Write endurance | 500,000 cycles - supports high-frequency transaction logging in parking, tolling, and event ticketing. |
| RF data rate | Up to 848 kbit/s - enables sub-100 ms balance updates and multi-application switching in real-time use. |
Pinout & Package
MF3D2201DUF/01V is supplied in FFC (Film Frame Carrier) package: 8-inch wafer, sawn, 75 μm thickness. As a contactless IC, it has no electrical pins; communication occurs via integrated coil coupling to an external antenna. Terminal mapping is defined by ISO/IEC 14443A RF interface signals: carrier modulation (ASK 100% depth), demodulated data input, and rectified power output.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_IN / RF_OUT | ISO/IEC 14443A antenna interface | Dual-role differential RF port enabling both energy harvesting (rectification) and bidirectional ASK-modulated data exchange at 13.56 MHz. |
| VDD (internal) | Rectified supply rail | On-chip voltage regulator derives stable core voltage from antenna-coupled RF energy; no external power required. |
| GND | Reference ground | Internal substrate reference tied to antenna ground plane; critical for EMI immunity and modulation fidelity. |
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card using AES-128, enabling backend auditability without exposing keys. |
| MIsmartApp delegation | Allows third-party application owners to manage their own AID space and keys without PICC-level privileges, enabling scalable multi-operator ecosystems. |
| Virtual Card Architecture | Supports privacy-preserving card selection across multiple logical VC instances, preventing cross-application tracking during field detection. |
| Proximity Check | Measures RF round-trip time to detect relay attacks, enforcing physical proximity before sensitive operations like key loading or value top-up. |
| Backward compatibility mode | Operates as MIFARE DESFire EV1 out-of-box; new features (e.g., Multiple Key Sets) require explicit activation via AuthenticateEV2First command. |
Applications
| Public Transport Ticketing | Secure Access Management |
|---|---|
Use Scenario: Tap-to-enter metro gates and validate fare zones across regional transit networks. IC Role / Device Role / Timing Role: Contactless IC storing encrypted trip history, balance, and zone entitlements; authenticates with reader using AES-128 session keys. Use Value: Enables offline balance validation and fast (<100 ms) transaction processing using on-card Transaction MAC for backend reconciliation. | Use Scenario: Multi-factor physical access control for corporate campuses with role-based door permissions. IC Role / Device Role / Timing Role: Secure credential IC holding biometric templates and dynamic access tokens; performs mutual authentication with reader before granting entry. Use Value: Prevents cloning via Originality Check and Proximity Check, while supporting delegated app management for HR-administered badge provisioning. |
| Micro-Payment & Loyalty | Student ID & Campus Services |
Use Scenario: Tap-to-pay at campus cafeterias, vending machines, and bookstore kiosks with real-time balance sync. IC Role / Device Role / Timing Role: Multi-application IC hosting separate Value files for cash-equivalent balance and loyalty points, each with independent access keys. Use Value: Supports concurrent file access during single tap (e.g., deduct meal credit + award loyalty points), enforced by transaction-oriented anti-tear backup. | Use Scenario: Integrated student ID enabling library access, lab equipment check-out, and dining hall payments. IC Role / Device Role / Timing Role: Secure multi-application platform with isolated applications for identity, access, and payment-each protected by unique key sets. Use Value: Eliminates need for separate cards via MIsmartApp delegation: library system manages its AID independently while sharing same physical card. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D4201DUF/01 | 4 KB EEPROM, identical 17 pF input capacitance, same FFC 75 μm package | Supports larger application footprints (e.g., multi-agency transit + full loyalty program + digital ID) | Select when >2 KB persistent storage is required for complex multi-service deployments. |
| MF3DH2201DUF/01 | 2 KB EEPROM, 70 pF input capacitance, same FFC 75 μm package | Optimized for small-form-factor antennas (e.g., wearable cards, thin wristbands) requiring higher capacitance tuning | Select for compact or flexible antenna layouts where 17 pF impedes impedance matching. |
Compared with MF3D4201DUF/01 and MF3DH2201DUF/01, the MF3D2201DUF/01V provides optimal cost-performance balance for mid-tier transit and access applications where 2 KB suffices and standard antenna geometry is used-avoiding unnecessary memory overhead or capacitance-driven layout constraints.
Availability
MF3D2201DUF/01V is available at Aetrix Electronics and suitable for secure public transport ticketing, micro-payment terminals, and physical access control systems requiring stable component supply across multi-year deployment cycles.
Supply support for MF3D2201DUF/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, IoT, and identification markets, with headquarters in Eindhoven, Netherlands.
The MF3D2201DUF/01V belongs to the MIFARE DESFire EV2 product line-designed specifically for high-assurance, multi-application contactless smart cards in transportation, government ID, and secure access environments.
FAQ
What security certifications does the MF3D2201DUF/01V hold?
The MF3D2201DUF/01V holds Common Criteria EAL5+ certification for both hardware and software, validating its suitability for high-security applications such as electronic passports and banking cards. This certification covers the full stack-including cryptographic engines, memory protection, anti-tamper sensors, and secure boot-and is explicitly documented in NXP's MF3Dx2 short data sheet Rev. 3.2. The MF3D2201DUF/01V inherits this certification as a member of the MIFARE DESFire EV2 family.
Does the MF3D2201DUF/01V support ISO/IEC 7816-4 commands?
Yes, the MF3D2201DUF/01V fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These commands operate over the ISO/IEC 14443-4 transport layer and enable interoperability with existing smart card infrastructure-confirmed in Section 2.1.6 of the official short data sheet.
How many applications and files can the MF3D2201DUF/01V support?
The MF3D2201DUF/01V supports unlimited applications in practice-limited only by available 2 KB EEPROM space-and up to 32 files per application. Supported file types include Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. Each file's size is defined at creation (except Transaction MAC), and the automatic anti-tear mechanism guarantees atomic updates across all file types-details confirmed in Sections 1.1 and 2.1.3 of the datasheet.
Is the MF3D2201DUF/01V pin-compatible with earlier MIFARE DESFire generations?
The MF3D2201DUF/01V is not a pin-compatible device in the traditional sense-it is a contactless IC with no physical pins-but it is functionally backward compatible with MIFARE DESFire EV1 and MF3ICD40. In default delivery configuration, it operates as an EV1 device; new EV2 features (e.g., Multiple Key Sets, Transaction MAC) require explicit activation via AuthenticateEV2First. This compatibility is guaranteed per Figure 1 and Section 1.2 of the official short data sheet.
What is the input capacitance of the MF3D2201DUF/01V and why does it matter?
The MF3D2201DUF/01V has a measured input capacitance of 17 pF (typical), specified under 13.56 MHz and 2 V RMS conditions. This value directly impacts antenna tuning: 17 pF aligns with standard PCB or inlay antenna designs used in ISO/IEC 14443A cards, eliminating the need for custom matching networks. Devices with 70 pF (e.g., MF3DHx2 variants) target ultra-thin or flexible form factors-this distinction is clearly tabulated in Table 2 and Ordering Information (Table 3) of the datasheet.
MF3D2201DUF/01V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- -
- Program Memory Type:
- -
- Controller Series:
- -
- RAM Size:
- -
- Interface:
- -
- Number of I/O:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MF3D2201DUF/01V FAQ
1.How can I place an order for MF3D2201DUF/01V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D2201DUF/01V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D2201DUF/01V reliable?
The price and inventory of MF3D2201DUF/01V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D2201DUF/01V is usually 5 days.
3.What payment methods are accepted for MF3D2201DUF/01V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D2201DUF/01V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D2201DUF/01V?
MF3D2201DUF/01V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D2201DUF/01V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D2201DUF/01V?
For technical support, including MF3D2201DUF/01V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D2201DUF/01V requirements.
6.How does Aetrix verify that MF3D2201DUF/01V is sourced from the original manufacturer or authorized distributors?
All MF3D2201DUF/01V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D2201DUF/01V meets industry standards.
7.What is the process for return or replacement of MF3D2201DUF/01V?
All MF3D2201DUF/01V units undergo pre-shipment inspection (PSI). If there is an issue with MF3D2201DUF/01V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D2201DUF/01V part is unused and in its original packaging.
Return procedure for MF3D2201DUF/01V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3D2201DUF/01V Tags
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