NXP Semiconductors MF3D4200DA4/01J

Overview

MF3D4200DA4/01 from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 4 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure transaction core in smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3D4200DA4/01 datasheet, MF3D4200DA4/01 pinout, MF3D4200DA4/01 application, or MF3D4200DA4/01 equivalent, key selection considerations include its SOT500-2 MOA4 package, EV2-specific Transaction MAC capability, backward compatibility with DESFire EV1/D40, and mandatory use of mutual three-pass authentication for secure session establishment.

Technical Context

The MF3D4200DA4/01 implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (for 2/4/8 kB variants), operates at 13.56 MHz, and integrates hardware-accelerated AES-128 and 3DES cryptographic engines with key versioning. Its memory architecture supports unlimited applications, each with up to 32 files across six types-including Transaction MAC files-enabling true multi-tenant service isolation.

Security execution relies on mutual three-pass authentication, on-chip backup management, automatic anti-tear protection for all file types, and hardware exception sensors including voltage, temperature, light, and glitch detection. The device supports EV2 Secure Messaging (AES-based), MIsmartApp delegated management, Proximity Check against relay attacks, and Originality Check for genuine NXP product verification.

Key Specifications

Pinout & Package

MF3D4200DA4/01 is housed in a plastic leadless module carrier package (MOA4) conforming to SOT500-2 outline, designed for embedding into contactless smart cards or modules. The device has no external pins - it interfaces exclusively via its integrated coil antenna using inductive coupling at 13.56 MHz.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D4200DA4/01, MF3D4201DUD/01 requires additional packaging steps for card assembly, while MF3DH4200DA4/01 trades standard antenna compatibility for miniaturization flexibility - neither is pin-compatible (as both are contactless ICs with no pins), but both share identical command set and security architecture.

Availability

MF3D4200DA4/01 is available at Aetrix Electronics and suitable for secure public transport ticketing, micro-payment systems, and smart city mobility cards requiring stable component supply, long-term lifecycle assurance, and certified cryptographic functionality.

Supply support for MF3D4200DA4/01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.

The MF3D4200DA4/01 belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless systems in transportation, access control, and digital identity - emphasizing EAL5+ security, interoperability with legacy readers, and future-ready feature extensibility.

FAQ

What security certifications apply to the MF3D4200DA4/01?

The MF3D4200DA4/01 holds Common Criteria EAL5+ certification for both hardware and software components, validating its resistance to side-channel, fault injection, and logical attacks. This certification level matches that required for banking cards and e-passports. The MF3D4200DA4/01 also implements hardware-based exception sensors (voltage, temperature, light, glitch) and mutual three-pass authentication to enforce runtime integrity. All cryptographic operations occur within the secure boundary of the IC.

Does the MF3D4200DA4/01 support backward compatibility with older MIFARE DESFire systems?

Yes, the MF3D4200DA4/01 operates in default delivery configuration as a MIFARE DESFire EV1 device, supporting all EV1 commands and secure messaging modes (D40 Native, EV1). It maintains full interoperability with existing MIFARE readers and infrastructure. New EV2 features - such as Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via dedicated commands and do not affect legacy operation unless enabled.

What is the memory organization model used by the MF3D4200DA4/01?

The MF3D4200DA4/01 uses a hierarchical, application-centric file system: each application is identified by a 3-byte AID and contains up to 32 files of six types (Standard Data, Backup Data, Value, Linear Record, Cyclic Record, Transaction MAC). File sizes are defined at creation time (except Transaction MAC). Applications are logically isolated - one application cannot access another's files without explicit shared-key configuration. The PICC-level master key controls application creation/deletion only.

How does the Transaction MAC feature work in the MF3D4200DA4/01?

The MF3D4200DA4/01 implements Transaction MAC as a dedicated file type that cryptographically signs transaction data using a secret key stored on the IC. Each MAC covers the full transaction payload (e.g., value change, timestamp, counter) and is generated on-card during the transaction. This provides verifiable proof of origin and integrity to backend systems without requiring online verification. The MAC is bound to the specific application context and cannot be reused across sessions or applications.

What package and mounting options are available for the MF3D4200DA4/01?

The MF3D4200DA4/01 is supplied in a plastic leadless module carrier package (MOA4) conforming to SOT500-2 mechanical outline. It is designed for direct lamination into PVC or PET smart cards or embedding into contactless modules. Unlike wafer-die variants (e.g., MF3D4201DUD/01), the MF3D4200DA4/01 requires no wire bonding or antenna alignment - the RF interface is fully integrated and tuned for standard 13.56 MHz coil geometries.