NXP Semiconductors MF3D4200DA6/01J
- Part No.:
- MF3D4200DA6/01J
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- -
- Datasheet:
-
MF3D4200DA6/01J.pdf
- Description:
- IC MIFARE DESFIRE EV2 PLMCC
- Quantity:
- Payment:

- Shipping:

Inventory:1,196
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Product details
Overview
MF3D4200DA6/01J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 4 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure transaction core in smart city mobility cards, public transport ticketing systems, and access control infrastructure.
For engineers reviewing the MF3D4200DA6/01J datasheet, MF3D4200DA6/01J pinout, MF3D4200DA6/01J application, or MF3D4200DA6/01J equivalent, key selection considerations include its 4 KB memory capacity, MOB6 package with SOT500-3 footprint, EV2-specific Transaction MAC and MIsmartApp features, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3D4200DA6/01J implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (for 2/4/8 kB variants), operates at 13.56 MHz, and integrates hardware-accelerated AES-128 and 3DES cryptographic engines with key versioning. Its on-chip memory management supports dynamic file creation and automatic anti-tear protection across all file types.
It delivers mutual three-pass authentication per ISO/IEC 7816-4, supports optional Random ID for privacy, and includes Proximity Check and Originality Check sensors to counter relay attacks and verify genuine NXP silicon. The device enables shared file access across two applications within a single transaction and supports up to 14 keys per application with multiple key sets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 4 KB EEPROM with 25-year data retention and 500,000 write cycles |
| RF interface | ISO/IEC 14443 Type A compliant; supports 106–848 kbit/s data rates |
| Input capacitance | 17 pF - optimized for standard antenna designs without high-capacitance compensation |
| Cryptographic engines | Hardware AES-128 and 3DES (56/112/168-bit) with key versioning and CMAC integrity |
| Security certification | Common Criteria EAL5+ for both hardware and software - validated for banking-grade applications |
| File system | Unlimited applications; up to 32 files per application across 6 file types including Transaction MAC |
| Unique identifier | 7-byte fixed UID plus optional Random ID mode for enhanced privacy compliance |
Pinout & Package
MF3D4200DA6/01J is housed in a MOB6 plastic leadless module carrier package (SOT500-3 footprint), designed for embedding into contactless smart cards and tags. This surface-mount module integrates the IC die, matching capacitor, and antenna coupling interface in a single compact unit - no discrete external RF components required.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ANT1 / ANT2 | RF antenna interface | Differential 13.56 MHz input/output terminals; connect directly to printed loop antenna |
| VSS | Ground reference | Primary substrate return path for analog and digital circuitry; must be low-impedance |
| VDD | Power supply | Internally regulated supply derived from RF field; no external voltage source needed |
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file type | Generates cryptographically signed transaction proofs on-card for backend verification - eliminates need for server-side replay detection logic |
| MIsmartApp delegation | Enables third-party application owners to manage their own applications without PICC-level privileges - supports scalable multi-tenant service models |
| Virtual Card Architecture | Allows multiple logical card instances on one physical device with isolated selection and privacy-preserving AID resolution |
| Proximity Check | Hardware-based distance bounding prevents relay attacks by measuring signal round-trip time - no firmware dependency |
| Originality Check | Embedded sensor validates authentic NXP silicon during initialization - blocks counterfeit ICs at protocol level |
Applications
| Public Transport Ticketing | Smart City Mobility Card |
|---|---|
Use Scenario: Contactless fare validation at bus/tram gates and metro turnstiles using stored-value or time-based tickets. IC Role / Device Role / Timing Role: Secure transaction engine managing balance updates, session authentication, and offline audit logging. Use Value: Enables offline transaction processing with tamper-proof balance integrity via Transaction MAC and anti-tear file writes. | Use Scenario: Single credential enabling seamless access to transit, bike sharing, municipal services, and local loyalty programs. IC Role / Device Role / Timing Role: Multi-application container with isolated AID-based application partitioning and delegated management rights. Use Value: Eliminates need for separate cards per service through MIsmartApp and Virtual Card Architecture - reduces user friction and issuance cost. |
| Secure Physical Access | Micro-Payment & Loyalty |
Use Scenario: Employee badge granting tiered building access, time-based zone entry, and visitor pass generation. IC Role / Device Role / Timing Role: Cryptographic identity anchor performing mutual authentication with readers and enforcing granular access policies per application. Use Value: Enforces role-based access via application-level keys and supports audit trail recording in cyclic record files with backup. | Use Scenario: Tap-to-pay at vending machines, cafeterias, and retail kiosks with real-time balance sync and fraud-resistant transactions. IC Role / Device Role / Timing Role: Secure value storage and cryptographic transaction signing using AES-128 encrypted value files and CMAC integrity. Use Value: Supports offline micro-payment with guaranteed atomic updates via anti-tear mechanism - no network dependency for balance consistency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D4200DA4/01 | Same 4 KB EEPROM and 17 pF capacitance, but MOA4 package (SOT500-2) with different mechanical footprint and thermal profile | Requires PCB layout revision due to SOT500-2 vs SOT500-3 land pattern mismatch | Select when existing design uses SOT500-2 carrier or requires thinner module profile |
| MF3DH4200DA6/01 | Same MOB6/SOT500-3 package but 70 pF input capacitance - optimized for small-form-factor antennas with limited coil area | Enables integration into ultra-thin cards or wearables where 17 pF would cause impedance mismatch | Select when antenna geometry restricts usable capacitance range and 70 pF improves coupling efficiency |
Compared with MF3D4200DA4/01 and MF3DH4200DA6/01, the MF3D4200DA6/01 provides optimal RF performance in standard-size smart cards with conventional antenna layouts, avoids layout redesign, and maintains full feature parity without requiring antenna re-tuning.
Availability
MF3D4200DA6/01J is available at Aetrix Electronics and suitable for public transport ticketing, smart city mobility credentials, and secure physical access systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.
Supply support for MF3D4200DA6/01J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless IC technology since the introduction of MIFARE.
The MF3D4200DA6/01J belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless systems requiring Common Criteria EAL5+ certification and interoperability with legacy MIFARE infrastructure.
FAQ
What security certifications does the MF3D4200DA6/01J hold?
The MF3D4200DA6/01J holds Common Criteria EAL5+ certification for both hardware and software, meeting the same security assurance level required for banking cards and electronic passports. This certification covers its cryptographic engines, memory protection mechanisms, and secure messaging protocols - all verified under independent evaluation. The MF3D4200DA6/01J implements mutual three-pass authentication, hardware AES-128, and on-chip exception sensors to fulfill EAL5+ requirements.
Does the MF3D4200DA6/01J support backward compatibility with older MIFARE systems?
Yes, the MF3D4200DA6/01J operates in default delivery configuration as a MIFARE DESFire EV1 device and maintains functional backward compatibility with both MIFARE DESFire EV1 and MF3ICD40 (D40) systems. It supports D40-native and EV1 secure messaging modes alongside its native EV2 secure messaging. All legacy commands, file structures, and authentication flows remain operational without modification to existing reader firmware or infrastructure.
What is the purpose of the Transaction MAC file type in the MF3D4200DA6/01J?
The Transaction MAC file type in the MF3D4200DA6/01J generates cryptographically signed transaction proofs on-card using a secret key, providing verifiable evidence of completed operations to backend systems. Unlike generic MACs, this file type binds transaction data, timestamps, and application context into a single tamper-evident signature - enabling offline audit trails, dispute resolution, and replay attack prevention without requiring continuous network connectivity during transaction execution.
How does the MIsmartApp feature work on the MF3D4200DA6/01J?
MIsmartApp on the MF3D4200DA6/01J enables delegated application management by allowing third-party service providers to create, configure, and manage their own applications on the same card without PICC-level privileges. This is achieved through dedicated key hierarchies and isolated AID namespaces - ensuring application autonomy while preserving overall card security. The MF3D4200DA6/01J enforces strict access control so that one application cannot interfere with another's keys or data.
What package type and footprint does the MF3D4200DA6/01J use?
The MF3D4200DA6/01J uses the MOB6 plastic leadless module carrier package with SOT500-3 footprint, integrating the IC die, internal matching network, and RF interface into a single surface-mount unit. This package requires no external capacitors or tuning components and is mechanically compatible with standard smart card lamination processes. Its 17 pF input capacitance is optimized for conventional antenna geometries used in ISO/IEC 7816-1/2/3-compliant cards.
MF3D4200DA6/01J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- -
- Program Memory Type:
- -
- Controller Series:
- -
- RAM Size:
- -
- Interface:
- -
- Number of I/O:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MF3D4200DA6/01J FAQ
1.How can I place an order for MF3D4200DA6/01J through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D4200DA6/01J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D4200DA6/01J reliable?
The price and inventory of MF3D4200DA6/01J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D4200DA6/01J is usually 5 days.
3.What payment methods are accepted for MF3D4200DA6/01J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D4200DA6/01J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D4200DA6/01J?
MF3D4200DA6/01J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D4200DA6/01J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D4200DA6/01J?
For technical support, including MF3D4200DA6/01J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D4200DA6/01J requirements.
6.How does Aetrix verify that MF3D4200DA6/01J is sourced from the original manufacturer or authorized distributors?
All MF3D4200DA6/01J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D4200DA6/01J meets industry standards.
7.What is the process for return or replacement of MF3D4200DA6/01J?
All MF3D4200DA6/01J units undergo pre-shipment inspection (PSI). If there is an issue with MF3D4200DA6/01J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D4200DA6/01J part is unused and in its original packaging.
Return procedure for MF3D4200DA6/01J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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