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NXP Semiconductors MF3D4201DUD/01V
- Part No.:
- MF3D4201DUD/01V
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- -
- Datasheet:
-
MF3D4201DUD/01V.pdf
- Description:
- IC MIFARE DESFIRE EV2 FFC
- Quantity:
- Payment:
- Shipping:
Inventory:3,259
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Product details
Overview
MF3D4201DUD/01V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 4 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling concurrent public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3D4201DUD/01V datasheet, MF3D4201DUD/01V pinout, MF3D4201DUD/01V application, or MF3D4201DUD/01V equivalent, key selection considerations include its 4 KB NV memory capacity, EAL5+ hardware/software security certification, Transaction MAC file support, MIsmartApp delegated management capability, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3D4201DUD/01V implements a dual-layer security architecture: mutual three-pass authentication at PICC level and application-level cryptographic isolation using up to 14 keys per application. Its flexible file system supports six file types-including Transaction MAC-with automatic anti-tear protection across all backup-enabled files.
It operates at 13.56 MHz with RF data rates up to 848 kbit/s, configurable ATS supporting up to 128-byte frames (256 bytes for larger memory variants), and optional Random ID generation to prevent tracking. The IC integrates hardware accelerators for DES, 3DES, and AES-128, plus CMAC-based message authentication and encrypted channel communication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Capacity | 4 KB EEPROM with 25-year data retention and 500,000 write endurance cycles |
| RF Interface | ISO/IEC 14443A compliant; supports 106–848 kbit/s data rates and low Hmin for up to 100 mm operating distance |
| Cryptographic Engine | Hardware-accelerated AES-128 and 3DES (56/112/168-bit keys) with key versioning and CMAC integrity protection |
| Security Certification | Common Criteria EAL5+ for both hardware and software - same assurance level as banking cards and e-passports |
| Input Capacitance | 17 pF (MF3Dx2 variant), optimized for standard antenna designs in smart cards and wearables |
| File System | Unlimited applications; up to 32 files per application across six types including Transaction MAC and Value files with backup |
| Authentication | Mutual three-pass authentication; supports D40/EV1/EV2 secure messaging modes and optional Random UID for privacy |
Pinout & Package
MF3D4201DUD/01V is supplied in FFC (Film Frame Carrier) wafer format - 8-inch diameter, sawn die, 120 μm thickness - intended for embedding into smart card laminates or inlays. No discrete pinout applies: it is a monolithic contactless IC with integrated antenna coupling via coil interface; electrical connection occurs solely through electromagnetic induction during RF field exposure.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC File | Generates cryptographically signed transaction proofs on-card for backend verification - enables audit-trail integrity in fare collection and micro-payment systems |
| MIsmartApp Delegation | Allows third-party application owners to manage their own apps without PICC master key exposure - essential for multi-operator smart city deployments |
| Virtual Card Architecture | Enables privacy-preserving card selection by masking AID during discovery - prevents unauthorized profiling in multi-service environments |
| Proximity Check | Detects relay attacks by measuring RF signal propagation time - blocks man-in-the-middle fraud in physical access and transit use cases |
| Originality Check | Verifies genuine NXP silicon at runtime - prevents counterfeit ICs from compromising system security and revenue integrity |
Applications
| Public Transport Ticketing | Secure Campus Access |
|---|---|
|
Use Scenario: Contactless tap-in/tap-out for buses, trams, and metro systems with real-time balance updates and fare capping. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction engine handling value file updates and session authentication. Use Value: Enables offline transaction processing with guaranteed atomicity via anti-tear mechanism and Transaction MAC validation against central clearing systems. |
Use Scenario: Multi-door building access with role-based permissions, visitor pass issuance, and integration with HR identity lifecycle systems. IC Role / Device Role / Timing Role: Application-isolated credential container supporting separate access, printing, and visitor management apps on one card. Use Value: Eliminates need for multiple physical credentials while maintaining strict logical separation between departments and security domains. |
| City-Wide Loyalty Program | Event Ticketing & Entry Control |
|
Use Scenario: Unified loyalty card used across municipal services (parking, museums, bike sharing) with dynamic point accrual and redemption. IC Role / Device Role / Timing Role: Multi-application host with shared key sets enabling cross-service transactions under delegated management (MIsmartApp). Use Value: Allows independent service providers to issue and manage loyalty points without exposing core infrastructure keys or requiring PICC owner intervention. |
Use Scenario: High-throughput entry for stadiums, concerts, or conferences with anti-counterfeiting, timed validity, and re-entry support. IC Role / Device Role / Timing Role: Cryptographically sealed ticket container with time-bound AID activation and Originality Check enforcement. Use Value: Prevents duplication and replay attacks via Proximity Check and ensures only authentic NXP-manufactured tickets are accepted at gates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8201DUD/01 | 8 KB EEPROM (double capacity), same 17 pF input capacitance, identical FFC package and EV2 feature set | Suitable for deployments requiring larger application footprints - e.g., multi-agency transit + full citizen service suite | Select when future scalability or complex multi-VC architectures demand extended memory headroom beyond 4 KB |
| MF3DH4201DUD/01 | Same 4 KB EEPROM but 70 pF input capacitance - optimized for compact antennas in wearables or thin form factors | Better suited for NFC ring, wristband, or sticker inlays where antenna size constraints limit coupling efficiency | Choose for space-constrained designs needing higher capacitive tuning margin without changing memory or security capabilities |
Compared with MF3D4201DUD/01V, MF3D8201DUD/01 offers scalable memory for evolving service portfolios, while MF3DH4201DUD/01 trades fixed antenna design flexibility for physical miniaturization - neither is pin-compatible (no pins exist), but both share identical command set, security model, and application layer behavior.
Availability
MF3D4201DUD/01V is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility credentialing, and multi-service access control systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic integrity.
Supply support for MF3D4201DUD/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, IoT, and identification markets, with headquarters in Eindhoven, Netherlands.
The MF3D4201DUD/01V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-application contactless systems in transportation, government ID, and secure access environments.
FAQ
What security certifications does the MF3D4201DUD/01V hold?
The MF3D4201DUD/01V is certified to Common Criteria EAL5+ for both hardware and software components - the highest publicly available assurance level for smart card ICs, matching requirements for banking cards and electronic passports. This certification covers its cryptographic engines, memory protection, anti-tampering sensors, and secure messaging protocols. MF3D4201DUD/01V achieves this through hardware-enforced isolation, mutual authentication, and on-chip exception detection mechanisms validated under CC evaluation.
Does the MF3D4201DUD/01V support backward compatibility with legacy MIFARE systems?
Yes, the MF3D4201DUD/01V operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring seamless integration with existing readers and infrastructure. It supports D40 Native and EV1 secure messaging modes alongside its native EV2 protocol, allowing phased migration. MF3D4201DUD/01V maintains full command-level compatibility with MF3ICD40 and MF3Dx1 products while enabling new features like Transaction MAC only upon explicit activation.
How does the Transaction MAC feature work in the MF3D4201DUD/01V?
The MF3D4201DUD/01V implements a dedicated Transaction MAC file type that generates cryptographically signed transaction proofs using a secret key stored on the IC. Each transaction - such as a fare deduction or loyalty point update - produces a unique MAC value verifiable by backend systems. This ensures non-repudiation and tamper evidence without requiring online connectivity during the tap event, making MF3D4201DUD/01V ideal for offline-first transit and payment deployments.
What is the difference between MF3D4201DUD/01V and MF3DH4201DUD/01?
The MF3D4201DUD/01V uses 17 pF input capacitance optimized for standard smart card antenna geometries, while MF3DH4201DUD/01 uses 70 pF for compact or low-inductance antennas found in wearables and stickers. Both share identical 4 KB EEPROM, EV2 firmware, security features, and command set. MF3D4201DUD/01V is selected for traditional card formats; MF3DH4201DUD/01 is chosen when mechanical constraints require higher capacitive tuning range - no changes to firmware or application logic are needed.
Can the MF3D4201DUD/01V be used in mobile NFC environments?
Yes, the MF3D4201DUD/01V fully complies with ISO/IEC 14443A and supports standard APDU wrappers for ISO/IEC 7816-4 commands, enabling interoperability with NFC smartphones acting as PCDs. Its support for Random ID, Proximity Check, and Virtual Card Architecture enhances privacy and security in mobile-centric use cases like smartphone-linked transit passes or digital employee IDs. MF3D4201DUD/01V has been validated for coexistence with host-card emulation (HCE) and secure element (SE) environments.
MF3D4201DUD/01V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- -
- Program Memory Type:
- -
- Controller Series:
- -
- RAM Size:
- -
- Interface:
- -
- Number of I/O:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MF3D4201DUD/01V FAQ
1.How can I place an order for MF3D4201DUD/01V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D4201DUD/01V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D4201DUD/01V reliable?
The price and inventory of MF3D4201DUD/01V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D4201DUD/01V is usually 5 days.
3.What payment methods are accepted for MF3D4201DUD/01V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D4201DUD/01V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D4201DUD/01V?
MF3D4201DUD/01V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D4201DUD/01V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D4201DUD/01V?
For technical support, including MF3D4201DUD/01V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D4201DUD/01V requirements.
6.How does Aetrix verify that MF3D4201DUD/01V is sourced from the original manufacturer or authorized distributors?
All MF3D4201DUD/01V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D4201DUD/01V meets industry standards.
7.What is the process for return or replacement of MF3D4201DUD/01V?
All MF3D4201DUD/01V units undergo pre-shipment inspection (PSI). If there is an issue with MF3D4201DUD/01V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D4201DUD/01V part is unused and in its original packaging.
Return procedure for MF3D4201DUD/01V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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