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NXP Semiconductors MF3D4201DUF/01V
- Part No.:
- MF3D4201DUF/01V
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- -
- Datasheet:
-
MF3D4201DUF/01V.pdf
- Description:
- IC MIFARE DESFIRE EV2 FFC
- Quantity:
- Payment:
- Shipping:
Inventory:2,883
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Product details
Overview
MF3D4201DUF/01V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 4 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling concurrent public transport, e-payment, and access control on a single credential.
For engineers reviewing the MF3D4201DUF/01V datasheet, MF3D4201DUF/01V pinout, MF3D4201DUF/01V application, or MF3D4201DUF/01V equivalent, key selection considerations include its 70 mm operational range, Transaction MAC file support, MIsmartApp delegated management capability, backward compatibility with MIFARE DESFire EV1/D40, and FFC wafer format (75 μm thickness) optimized for thin card and inlay embedding.
Technical Context
The MF3D4201DUF/01V implements a dedicated ISO/IEC 14443-4 protocol stack with configurable ATS supporting up to 128-byte frame size (256 bytes for larger memory variants), and integrates hardware-accelerated AES-128 and triple-DES cryptographic engines with key versioning. Its on-chip TRNG, voltage/rail/light/glitch sensors, and active shielding enforce tamper resistance required for EAL5+ certification.
It supports mutual three-pass authentication per ISO/IEC 7816-4, enables application-level secure messaging (EV2 mode), and provides transaction-oriented anti-tear protection across all six file types-including the dedicated Transaction MAC file-ensuring atomic updates during power loss or field interruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 4 KB EEPROM with 25-year data retention and 500,000 write cycles - sufficient for ≥28 applications with 32 files each. |
| RF interface | ISO/IEC 14443A compliant; supports 106–848 kbit/s data rates and low Hmin for up to 100 mm read range. |
| Cryptographic engine | Hardware AES-128 and 3DES (56/112/168-bit keys) with CMAC integrity protection - enables EAL5+ certified secure messaging. |
| Security certification | Common Criteria EAL5+ (HW & SW) - validated for banking-grade and e-passport–level trust requirements. |
| Input capacitance | 17 pF - optimized for standard antenna designs in thin-form-factor cards and inlays (75 μm wafer thickness). |
| File system | 6 file types (Standard Data, Backup Data, Value, Linear/Cyclic Record, Transaction MAC); unlimited applications; up to 32 files per application. |
| Unique identifier | 7-byte fixed UID + optional Random ID mode - prevents tracking and supports privacy-preserving card selection. |
Pinout & Package
MF3D4201DUF/01V is supplied in FFC (Film Frame Carrier) wafer format - an unpackaged die on tape-and-reel, intended for direct bonding into smart card laminates or inlays. It has no discrete pins; electrical connection is made via two RF coupling pads (ANT1/ANT2) for coil integration. No leadframe or solderable terminals are present.
Key Features
| Feature | Design Value |
|---|---|
| MIsmartApp (Delegated Application Management) | Enables third-party application creation and lifecycle control without exposing PICC master key - critical for multi-operator smart city deployments. |
| Transaction MAC file | Generates cryptographically signed transaction proofs on-card using secret keys - provides verifiable audit trail for backend reconciliation in e-payment systems. |
| Proximity Check & Originality Check | Detects relay attacks and authenticates genuine NXP silicon - mitigates cloning and man-in-the-middle threats in high-security transit and access environments. |
| Virtual Card Architecture (VCA) | Supports multiple logical cards on one physical device with privacy-preserving selection - allows citizen services, transport, and loyalty to coexist without cross-application visibility. |
| Backward compatibility mode | Operates as MIFARE DESFire EV1 or D40 upon reset - enables phased infrastructure upgrades without replacing existing readers or middleware. |
Applications
| Public Transport Ticketing | Secure Access Control |
|---|---|
Use Scenario: Contactless fare validation at bus gates and metro turnstiles with offline balance checking and session-based transaction logging. IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction execution - performs mutual authentication, value file updates, and Transaction MAC generation within <150 ms. Use Value: Enables offline operation with guaranteed data integrity via anti-tear mechanism and AES-secured communication - eliminates dependency on real-time backend connectivity. |
Use Scenario: Multi-site corporate access using a single card across office buildings, labs, and parking garages with role-based permissions. IC Role / Device Role / Timing Role: Application-isolated credential manager - stores separate access profiles per facility, each with independent key sets and file structures. Use Value: Eliminates need for multiple physical credentials; supports dynamic permission updates via delegated management (MIsmartApp) without reissuing cards. |
| Micro-Payment & Loyalty | Smart City Mobility Hub |
Use Scenario: Tap-to-pay at vending machines, cafés, and bike-sharing kiosks with instant balance deduction and receipt generation. IC Role / Device Role / Timing Role: Secure value file processor with encrypted transaction logging - executes authenticated value decrements and appends records to cyclic files. Use Value: Supports closed-loop payment schemes with zero reliance on network connectivity; Transaction MAC ensures irrefutable proof of each transaction for dispute resolution. |
Use Scenario: Unified citizen card integrating public transport, library access, municipal service payments, and event ticketing across city departments. IC Role / Device Role / Timing Role: Multi-application platform with Virtual Card Architecture - isolates departmental applications while enabling shared authentication context and cross-service loyalty accrual. Use Value: Reduces citizen credential fragmentation; Proximity Check and Originality Check prevent cloning in high-volume urban deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D4201DUD/01 | Same 4 KB EEPROM and 17 pF capacitance, but 120 μm wafer thickness - less suitable for ultra-thin cards or flexible inlays. | Targeted at standard PVC card lamination where mechanical robustness outweighs form-factor constraints. | Select MF3D4201DUD/01 when card thickness > 0.8 mm and antenna coupling stability is prioritized over minimal profile. |
| MF3DH4201DUF/01 | Same 4 KB EEPROM and 75 μm wafer thickness, but 70 pF input capacitance - optimized for small-diameter antennas and compact reader coils. | Preferred for wearable tokens, wristbands, and embedded inlays where antenna area is limited. | Choose MF3DH4201DUF/01 when designing for miniaturized form factors requiring higher capacitive coupling efficiency. |
Compared with MF3D4201DUF/01V, MF3D4201DUD/01 trades thinner profile for greater mechanical rigidity, while MF3DH4201DUF/01 shifts impedance matching toward compact antenna geometries - both retain identical security architecture, command set, and application flexibility.
Availability
MF3D4201DUF/01V is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city mobility hubs, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.
Supply support for MF3D4201DUF/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.
The MF3D4201DUF/01V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-application contactless systems in smart cities, transit, and secure access, where EAL5+ certification and cryptographic agility are mandatory.
FAQ
What is the memory configuration of the MF3D4201DUF/01V?
The MF3D4201DUF/01V contains 4 KB of EEPROM organized as a flexible file system supporting unlimited applications, up to 32 files per application, and six file types including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC. Each file size is user-defined at creation, and data retention is rated for 25 years with 500,000 write cycles.
Does the MF3D4201DUF/01V support AES encryption?
Yes, the MF3D4201DUF/01V includes a hardware-accelerated AES-128 cryptographic engine compliant with ISO/IEC 7816-4, enabling EV2 secure messaging with CMAC integrity protection. It also supports 3DES (56/112/168-bit keys) and maintains backward compatibility with D40/EV1 secure messaging modes for legacy system integration.
How does the MF3D4201DUF/01V ensure transaction integrity during power loss?
The MF3D4201DUF/01V implements a transaction-oriented automatic anti-tear mechanism across all file types with backup capability. When a transaction spans multiple files - such as updating a value file and appending a record - the IC guarantees atomic execution: either all changes commit or none do, preserving data consistency even during unexpected field removal or power interruption.
What is the significance of the 'DUF' suffix in MF3D4201DUF/01V?
The 'DUF' suffix in MF3D4201DUF/01V denotes the package variant: 'D' = MIFARE DESFire EV2, 'U' = 4 KB memory, 'F' = 75 μm wafer thickness in Film Frame Carrier (FFC) format. This distinguishes it from 'DUD' (120 μm) and 'DH' variants (70 pF input capacitance), confirming its suitability for ultra-thin card and inlay embedding.
Is the MF3D4201DUF/01V compatible with existing MIFARE DESFire EV1 infrastructure?
Yes, the MF3D4201DUF/01V operates in default delivery configuration as a MIFARE DESFire EV1 device, supporting identical commands, file structures, and cryptographic modes (2TDEA, 3TDEA). New EV2 features - including Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via dedicated commands, ensuring seamless integration into legacy reader ecosystems.
MF3D4201DUF/01V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- -
- Program Memory Type:
- -
- Controller Series:
- -
- RAM Size:
- -
- Interface:
- -
- Number of I/O:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MF3D4201DUF/01V FAQ
1.How can I place an order for MF3D4201DUF/01V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3D4201DUF/01V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3D4201DUF/01V reliable?
The price and inventory of MF3D4201DUF/01V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D4201DUF/01V is usually 5 days.
3.What payment methods are accepted for MF3D4201DUF/01V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D4201DUF/01V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3D4201DUF/01V?
MF3D4201DUF/01V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3D4201DUF/01V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3D4201DUF/01V?
For technical support, including MF3D4201DUF/01V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D4201DUF/01V requirements.
6.How does Aetrix verify that MF3D4201DUF/01V is sourced from the original manufacturer or authorized distributors?
All MF3D4201DUF/01V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D4201DUF/01V meets industry standards.
7.What is the process for return or replacement of MF3D4201DUF/01V?
All MF3D4201DUF/01V units undergo pre-shipment inspection (PSI). If there is an issue with MF3D4201DUF/01V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3D4201DUF/01V part is unused and in its original packaging.
Return procedure for MF3D4201DUF/01V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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