NXP Semiconductors MF3D8200DA6/01J

Overview

MF3D8200DA6/01 from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of transit cards, e-ID documents, and micro-payment systems requiring high-integrity transaction handling.

For engineers reviewing the MF3D8200DA6/01 datasheet, MF3D8200DA6/01 pinout, MF3D8200DA6/01 application, or MF3D8200DA6/01 equivalent, key selection considerations include its SOT500-3 MOB6 module package, Transaction MAC file support, MIsmartApp delegated management capability, Proximity Check against relay attacks, and backward compatibility with MIFARE DESFire EV1 and D40 infrastructure.

Technical Context

The MF3D8200DA6/01 implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frames (256 bytes for larger memory variants), operates at 13.56 MHz, and integrates hardware-accelerated AES-128 and 3DES cryptographic engines with key versioning. Its on-chip TRNG and active shielding sensors enable robust anti-tampering protection.

It features a flexible file system supporting unlimited applications, each with up to 32 files across six types-including Standard Data, Value, Linear/Cyclic Record, Backup Data, and Transaction MAC-and enforces mutual three-pass authentication per application using diversified keys derived from the fixed 7-byte UID or optional Random ID.

Key Specifications

Pinout & Package

MF3D8200DA6/01 is housed in a plastic leadless module carrier package (MOB6) conforming to SOT500-3 outline. This surface-mount module integrates the IC, matching capacitor, and antenna coupling elements into a single compact unit designed for embedding into laminated smart cards or wearable tokens. No discrete pinout is defined - the device interfaces exclusively via its integrated 13.56 MHz RF coil and requires no external power supply or wired connections.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D8200DA6/01, MF3D8200DA4/01 offers mechanical interchangeability in thinner card formats but requires revalidation of lamination pressure and thermal profiles, while MF3DH8200DA6/01 trades standard antenna compatibility for miniaturization - neither is pin-compatible due to fundamental package differences, and both demand full system-level RF and security testing.

Availability

MF3D8200DA6/01 is available at Aetrix Electronics and suitable for public transport ticketing, secure government ID issuance, and smart city mobility deployments requiring stable component supply, long-term lifecycle support, and certified security compliance.

Supply support for MF3D8200DA6/01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with headquarters in Eindhoven, Netherlands.

The MF3D8200DA6/01 belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-service contactless applications demanding Common Criteria EAL5+ certification, cryptographic agility, and seamless interoperability with existing NFC infrastructure.

FAQ

What security certifications does the MF3D8200DA6/01 hold?

The MF3D8200DA6/01 holds Common Criteria EAL5+ certification for both hardware and software, validating its resistance to side-channel, fault injection, and logical attacks. This certification level matches that required for banking cards and electronic passports. The MF3D8200DA6/01 also supports mutual three-pass authentication, hardware AES-128 and 3DES engines, and on-chip TRNG - all contributing to its certified assurance level.

Does MF3D8200DA6/01 support ISO/IEC 7816-4 commands?

Yes, MF3D8200DA6/01 fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These commands operate within the MIFARE DESFire EV2 native command set via APDU wrapper mode, enabling integration with legacy smart card middleware.

How many applications and files can MF3D8200DA6/01 support?

The MF3D8200DA6/01 supports an unlimited number of applications limited only by available EEPROM space, with each application accommodating up to 32 files. Six file types are supported: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. File sizes are user-defined at creation time (except Transaction MAC), and automatic anti-tear mechanisms ensure atomicity across multi-file transactions.

What is the difference between MF3D8200DA6/01 and MF3DH8200DA6/01?

The MF3D8200DA6/01 uses 17 pF input capacitance and targets standard antenna designs, while MF3DH8200DA6/01 uses 70 pF input capacitance for compact or low-inductance antennas. Both share the same MOB6/SOT500-3 package, 8 KB EEPROM, and feature set. Substituting MF3DH8200DA6/01 for MF3D8200DA6/01 requires antenna redesign and reader interoperability validation - they are not drop-in replacements.

Is MF3D8200DA6/01 backward compatible with older MIFARE DESFire systems?

Yes, MF3D8200DA6/01 operates in MIFARE DESFire EV1 compatibility mode by default and supports all EV1 and D40 commands, cryptographic methods (2TDEA, 3TDEA), and secure messaging protocols. New EV2 features like Transaction MAC and MIsmartApp require explicit activation via dedicated commands - ensuring seamless integration into existing infrastructure without reader upgrades.