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NXP Semiconductors MF3D8201DUD/01V

Part No.:
MF3D8201DUD/01V
Manufacturer:
NXP Semiconductors
Category:
Application Specific Microcontrollers
Package:
-
Datasheet:
AetrixMF3D8201DUD/01V.pdf
Description:
IC MIFARE DESFIRE EV2 FFC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,534

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Product details

Overview

MF3D8201DUD/01V from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 17 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of transit cards, e-ID documents, and micro-payment systems requiring high-integrity transaction handling.

For engineers reviewing the MF3D8201DUD/01V datasheet, MF3D8201DUD/01V pinout, MF3D8201DUD/01V application, or MF3D8201DUD/01V equivalent, key selection considerations include its 8 KB NV memory capacity, EAL5+ hardware/software security rating, Transaction MAC file support, MIsmartApp delegated management capability, and backward compatibility with MIFARE DESFire EV1 and D40 infrastructure.

Technical Context

The MF3D8201DUD/01V implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (256 bytes for larger memory variants), operates at 13.56 MHz, and integrates on-chip TRNG, voltage/rail/light/glitch sensors, and active shielding for side-channel attack resistance. Its CPU executes a certified secure operating system enabling application-level authentication and encrypted data transfer.

It supports three secure messaging protocols-D40-native, EV1-compatible, and EV2-native-with AES-128-based EV2 Secure Messaging as the recommended mode for new designs. File-level access control uses up to 14 keys per application, with multiple key sets and rolling mechanisms enabled for dynamic credential lifecycle management.

Key Specifications

ParameterValue and Actual Design Meaning
Memory capacity8 KB EEPROM with 25-year data retention and 500,000 write endurance cycles
RF interfaceISO/IEC 14443A compliant; supports 106–848 kbit/s data rates and Random UID option
Cryptographic engineHardware-accelerated AES-128 and 3DES (56/112/168-bit) with key versioning
Security certificationCommon Criteria EAL5+ for both hardware and software components
Input capacitance17 pF - optimized for standard antenna geometries in 8-inch wafer form factor
File systemUnlimited applications; up to 32 files per application across 6 file types including Transaction MAC
Anti-tear mechanismTransaction-oriented automatic backup ensuring atomic updates across multiple files

Pinout & Package

MF3D8201DUD/01V is supplied in FFC (Film Frame Carrier) packaging - an 8-inch sawn wafer format with 120 μm thickness, intended for embedding into laminated smart cards or modules. No discrete pins or terminals are present; electrical interface is exclusively via integrated coil coupling under ISO/IEC 14443A.

Key Features

FeatureDesign Value
MIsmartApp Delegated ManagementEnables third-party application creation and lifecycle control without exposing PICC master keys
Transaction MAC fileGenerates cryptographically signed transaction proofs verifiable by backend systems
Virtual Card ArchitectureSupports privacy-preserving card/application selection on multi-VC devices
Proximity CheckDetects and blocks relay attacks by measuring RF signal propagation time
Originality CheckVerifies genuine NXP silicon using embedded hardware signature, preventing counterfeit use

Applications

Public Transport TicketingSecure Access Control

Use Scenario: Contactless fare validation at metro gates and bus readers with offline balance updates.

IC Role / Device Role / Timing Role: Secure storage and cryptographic processing of transport credentials, trip history, and value files.

Use Value: Enables fast (<100 ms) tap-and-go transactions with tamper-proof audit logs via Transaction MAC.

Use Scenario: Multi-site physical access using a single credential across office buildings, labs, and parking facilities.

IC Role / Device Role / Timing Role: Hosts independent applications per facility with segregated key sets and access policies.

Use Value: Eliminates credential proliferation while enforcing role-based access via application-level authentication.

Micro-Payment & LoyaltyStudent ID & Campus Services

Use Scenario: Tap-to-pay at cafeterias, vending machines, and retail kiosks with closed-loop e-wallet functionality.

IC Role / Device Role / Timing Role: Stores encrypted value files, performs offline balance checks, and signs transaction receipts.

Use Value: Supports offline operation with guaranteed integrity through CMAC-protected data and anti-tear file updates.

Use Scenario: Integrated campus ID enabling library access, meal plan usage, printing credits, and event registration.

IC Role / Device Role / Timing Role: Manages logically isolated applications with shared keys for cross-service authentication.

Use Value: Reduces administrative overhead via delegated application management (MIsmartApp) and centralized key rollover.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MF3D4201DUD/014 KB EEPROM, same 17 pF input capacitance and FFC packageLower memory footprint suitable for single-application or low-complexity deploymentsSelect when application count and file depth requirements are constrained to ≤28 apps and ≤16 files/app
MF3DH8201DUD/018 KB EEPROM with 70 pF input capacitance for compact antenna integrationOptimized for small-form-factor cards or wearables where antenna area is limitedChoose for space-constrained designs requiring higher coupling efficiency at reduced antenna size

Compared with MF3D4201DUD/01 and MF3DH8201DUD/01, the MF3D8201DUD/01V provides full 8 KB memory headroom and standard 17 pF impedance matching for mainstream card manufacturing, making it optimal for complex multi-service deployments where future application expansion and interoperability with legacy readers are required.

Availability

MF3D8201DUD/01V is available at Aetrix Electronics and suitable for public transport ticketing, secure access control, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3D8201DUD/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with deep expertise in contactless IC design and Common Criteria evaluation.

The MF3D8201DUD/01V belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-application contactless systems in smart cities, transit, and identity applications demanding EAL5+ certification and field-upgradable security.

FAQ

What security certifications does the MF3D8201DUD/01V hold?

The MF3D8201DUD/01V holds Common Criteria EAL5+ certification for both hardware and software components - the same assurance level required for banking cards and electronic passports. This certification validates its resistance to physical, fault injection, and side-channel attacks, and confirms secure boot, key management, and cryptographic execution integrity. The MF3D8201DUD/01V achieves this through on-die sensors, active shielding, and a certified secure operating system.

Does the MF3D8201DUD/01V support backward compatibility with older MIFARE DESFire systems?

Yes, the MF3D8201DUD/01V operates in default delivery configuration as a MIFARE DESFire EV1 device, supporting all EV1 commands and D40-native secure messaging. It maintains full interoperability with existing MIFARE DESFire EV1 and MF3ICD40 reader infrastructure. New EV2 features - such as Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via configuration commands and do not affect legacy operation.

What is the difference between MF3D8201DUD/01V and MF3DH8201DUD/01?

The MF3D8201DUD/01V uses 17 pF input capacitance and is optimized for standard antenna layouts in conventional smart cards, whereas MF3DH8201DUD/01 uses 70 pF input capacitance for enhanced coupling in miniaturized or flexible form factors. Both share identical 8 KB EEPROM, cryptographic capabilities, and command set. The "H" suffix denotes high-capacitance tuning - critical when antenna size is constrained, but unnecessary for standard ISO/IEC 7816-1 ID-1 card designs.

Can the MF3D8201DUD/01V store more than one application, and how is isolation enforced?

Yes, the MF3D8201DUD/01V supports unlimited applications, each with up to 32 files and independent key sets (up to 14 keys per application). Isolation is enforced at the hardware level: applications are logically separated by Application Identifiers (AIDs), and file access requires explicit authentication using application-specific keys. The MMU prevents cross-application memory access, and the secure OS enforces strict privilege boundaries - even the PICC master key cannot read application file contents without knowledge of the application's own keys.

What file types does the MF3D8201DUD/01V support, and what is the purpose of the Transaction MAC file?

The MF3D8201DUD/01V supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. The Transaction MAC file generates a cryptographically signed digest of transaction data - including timestamps, amounts, and counters - using a secret key stored on the chip. This provides non-repudiable proof of transaction occurrence and integrity, enabling backend reconciliation without requiring online connectivity during the tap event. The MF3D8201DUD/01V computes and stores this MAC autonomously during each transaction.

MF3D8201DUD/01V Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
-
Core Processor:
-
Program Memory Type:
-
Controller Series:
-
RAM Size:
-
Interface:
-
Number of I/O:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

MF3D8201DUD/01V FAQ

1.How can I place an order for MF3D8201DUD/01V through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3D8201DUD/01V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3D8201DUD/01V reliable?

The price and inventory of MF3D8201DUD/01V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3D8201DUD/01V is usually 5 days.

3.What payment methods are accepted for MF3D8201DUD/01V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3D8201DUD/01V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3D8201DUD/01V?

MF3D8201DUD/01V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3D8201DUD/01V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3D8201DUD/01V?

For technical support, including MF3D8201DUD/01V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3D8201DUD/01V requirements.

6.How does Aetrix verify that MF3D8201DUD/01V is sourced from the original manufacturer or authorized distributors?

All MF3D8201DUD/01V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3D8201DUD/01V meets industry standards.

7.What is the process for return or replacement of MF3D8201DUD/01V?

All MF3D8201DUD/01V units undergo pre-shipment inspection (PSI). If there is an issue with MF3D8201DUD/01V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3D8201DUD/01V part is unused and in its original packaging.

Return procedure for MF3D8201DUD/01V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF3D8201DUD/01V Tags

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