NXP Semiconductors MF3DH2200DA6/01J

Overview

MF3DH2200DA6/01J from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3DH2200DA6/01J datasheet, MF3DH2200DA6/01J pinout, MF3DH2200DA6/01J application, or MF3DH2200DA6/01J equivalent, key selection considerations include its high-input-capacitance MOB6 package for compact antenna integration, Transaction MAC file support for backend-verified transactions, MIsmartApp delegation capability, and backward compatibility with MIFARE DESFire EV1 and D40 systems.

Technical Context

The MF3DH2200DA6/01J implements a dual-mode RF interface compliant with ISO/IEC 14443-4 at data rates up to 848 kbit/s and supports configurable ATS with FSCI up to 128 bytes (256 bytes for larger memory variants). Its on-chip cryptographic engine executes hardware-accelerated AES-128, 3TDEA, and 2TDEA operations with key versioning and mutual three-pass authentication.

It features a flexible file system supporting unlimited applications, up to 32 files per application across six file types-including Transaction MAC-and includes Proximity Check and Originality Check hardware sensors to counter relay attacks and verify genuine NXP silicon. The device operates without battery power via inductive coupling at 13.56 MHz.

Key Specifications

Pinout & Package

MF3DH2200DA6/01J is housed in an MOB6 plastic leadless module carrier package (SOT500-3), designed for embedding into contactless smart cards or modules. It has no external pins; electrical connection is made via two integrated antenna pads (RF_IN and RF_OUT) for inductive coupling to an external coil.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D2200DA6/01J, MF3DH2200DA6/01J delivers superior near-field coupling in space-constrained designs, while MF3DH4200DA6/01J extends functional headroom without altering antenna design or layout - making MF3DH2200DA6/01J the optimal balance of miniaturization readiness and memory sufficiency for mid-tier smart city credentials.

Availability

MF3DH2200DA6/01J is available at Aetrix Electronics and suitable for secure public transport ticketing, smart city access control, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and CC EAL5+-certified silicon.

Supply support for MF3DH2200DA6/01J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in contactless technology and trusted execution environments.

The MF3DH2200DA6/01J belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-service contactless credentials in smart cities, transportation, and digital identity ecosystems.

FAQ

What is the primary security certification level of the MF3DH2200DA6/01J?

The MF3DH2200DA6/01J holds Common Criteria EAL5+ certification for both hardware and software, matching the assurance level required for banking cards and electronic passports. This certification validates its resistance to side-channel, fault injection, and logical attacks - a requirement explicitly confirmed in the NXP Product Short Data Sheet Rev. 3.2. MF3DH2200DA6/01J achieves this through on-die sensors, secure boot, and hardware-enforced access controls.

Does the MF3DH2200DA6/01J support AES-128 encryption?

Yes, the MF3DH2200DA6/01J integrates a dedicated hardware AES-128 cryptographic engine supporting key versioning and EV2 Secure Messaging. It also supports 2TDEA and 3TDEA for backward compatibility. All cryptographic operations execute in tamper-resistant logic, and AES-128 is the recommended cipher for new deployments per NXP's documentation. MF3DH2200DA6/01J uses AES-128 for AuthenticateEV2First and AuthenticateEV2NonFirst commands.

How does the 70 pF input capacitance of the MF3DH2200DA6/01J affect antenna design?

The 70 pF input capacitance of the MF3DH2200DA6/01J allows robust operation with smaller, lower-inductance antenna coils - ideal for slim cards, wearables, or embedded modules where space is constrained. It reduces the need for external tuning capacitors and improves coupling efficiency at short range. This parameter is measured at 13.56 MHz and 2 V RMS, and is a defining feature distinguishing MF3DHx2 from MF3Dx2 variants. MF3DH2200DA6/01J leverages this to enable reliable read/write at ≤50 mm with compact antennas.

Can the MF3DH2200DA6/01J be used in systems originally designed for MIFARE DESFire EV1?

Yes, the MF3DH2200DA6/01J is functionally backward compatible with MIFARE DESFire EV1 and D40 in its default delivery configuration. It supports all EV1 APDU commands, file structures, and cryptographic modes (including D40 Native and EV1 Secure Messaging). New EV2 features like Transaction MAC or MIsmartApp require explicit activation. MF3DH2200DA6/01J maintains identical command set compatibility while adding enhanced capabilities without infrastructure changes.

What file types does the MF3DH2200DA6/01J support, and why is Transaction MAC significant?

The MF3DH2200DA6/01J supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. The Transaction MAC file generates a cryptographically signed log of each transaction, binding data, time, and context to a secret key stored on the IC. This provides irrefutable proof of card-initiated actions for backend reconciliation - a capability not present in earlier DESFire generations. MF3DH2200DA6/01J implements this at application level with hardware acceleration.