NXP Semiconductors MF3DH2201DUD/01V

Overview

MF3DH2201DUD/01V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance for small-form-factor designs, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core in smart city mobility cards, public transport ticketing systems, and access control credentials.

For engineers reviewing the MF3DH2201DUD/01V datasheet, MF3DH2201DUD/01V pinout, MF3DH2201DUD/01V application, or MF3DH2201DUD/01V equivalent, key selection considerations include its 70 pF high-input-capacitance variant optimized for thin card and embedded tag layouts, EV2-specific Transaction MAC and MIsmartApp delegation features, and backward compatibility with MIFARE DESFire EV1 and D40 infrastructure.

Technical Context

The MF3DH2201DUD/01V implements a dedicated ISO/IEC 14443-4 RF interface with configurable FSCI supporting up to 128-byte frame size (256 bytes for larger memory variants), operates at 13.56 MHz, and integrates hardware-accelerated AES-128 and triple-DES cryptographic engines with key versioning. Its on-chip voltage regulator, TRNG, and active shielding sensors enable robust operation under electromagnetic stress.

It supports mutual three-pass authentication per ISO/IEC 7816-4, transaction-oriented anti-tear backup across all file types, and Virtual Card Architecture for privacy-preserving card selection. The device uses a flexible file system with up to 32 files per application across six file types-including Transaction MAC-and allows delegated application management via MIsmartApp.

Key Specifications

Pinout & Package

MF3DH2201DUD/01V is supplied in FFC (Film Frame Carrier) wafer format - 8-inch diameter, sawn die, 120 μm thickness - intended for embedding into contactless smart cards, inlays, or modules. It has no external pins; RF coupling occurs via integrated antenna coil connection points on the die surface. No discrete terminal mapping applies.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D2201DUD/01 and MF3DH4201DUD/01, the MF3DH2201DUD/01V provides optimal trade-off between compact form factor support (via 70 pF), cost efficiency (2 KB memory), and full MIFARE DESFire EV2 feature compliance - making it ideal for volume-constrained transit and ID card deployments where upgrade path to 4 KB exists without layout change.

Availability

MF3DH2201DUD/01V is available at Aetrix Electronics and suitable for public transport ticketing, secure physical access systems, and smart city mobility credentialing requiring stable component supply, long-term lifecycle assurance, and certified security compliance.

Supply support for MF3DH2201DUD/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and identification markets, with leadership in contactless ICs and NFC technology.

The MF3DH2201DUD/01V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-security, multi-application contactless smart cards used in transportation, access control, and digital identity ecosystems.

FAQ

What is the memory capacity and technology used in MF3DH2201DUD/01V?

The MF3DH2201DUD/01V integrates 2 KB of EEPROM non-volatile memory with 25-year data retention and typical 500,000 write endurance cycles. This memory is organized into a flexible file system supporting unlimited applications and up to 32 files per application - all managed securely by the MF3DH2201DUD/01V's on-chip operating system and cryptographic engine.

Does MF3DH2201DUD/01V support ISO/IEC 7816-4 commands?

Yes, MF3DH2201DUD/01V fully supports ISO/IEC 7816-4 APDU structure and file system commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). These commands operate natively within the MF3DH2201DUD/01V's secure environment and are interoperable with standard NFC readers.

How does the 70 pF input capacitance of MF3DH2201DUD/01V affect antenna design?

The 70 pF input capacitance of MF3DH2201DUD/01V reduces required external tuning capacitance in ultra-thin card and inlay designs, enabling smaller antenna footprints and improved coupling efficiency in mechanically constrained formats like 0.6 mm PVC cards or flexible PET tags. This specification directly impacts RF matching network design and is validated for use with standard 13.56 MHz loop antennas per ISO/IEC 14443A.

Is MF3DH2201DUD/01V backward compatible with older MIFARE DESFire systems?

Yes, MF3DH2201DUD/01V operates in default delivery configuration as a MIFARE DESFire EV1 device, ensuring functional backward compatibility with existing MIFARE DESFire EV1 and MF3ICD40 infrastructure. All legacy commands and security modes (D40 and EV1 secure messaging) remain fully supported, while new EV2 features like Transaction MAC and MIsmartApp require explicit activation via dedicated commands.

What security certifications apply to MF3DH2201DUD/01V?

MF3DH2201DUD/01V is certified to Common Criteria EAL5+ for both hardware and software components - the same assurance level required for electronic passports and banking-grade smart cards. This certification covers its cryptographic engines (AES-128, 3DES), secure messaging protocols, memory protection mechanisms, and physical countermeasures including glitch, light, and temperature sensors embedded in the MF3DH2201DUD/01V die.