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NXP Semiconductors MF3DH2201DUF/01V

Part No.:
MF3DH2201DUF/01V
Manufacturer:
NXP Semiconductors
Category:
Application Specific Microcontrollers
Package:
-
Datasheet:
AetrixMF3DH2201DUF/01V.pdf
Description:
IC MIFARE DESFIRE EV2 FFC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,259

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Product details

Overview

MF3DH2201DUF/01V from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 2 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3DH2201DUF/01V datasheet, MF3DH2201DUF/01V pinout, MF3DH2201DUF/01V application, or MF3DH2201DUF/01V equivalent, this page delivers verified technical context, real-world use-value mapping, and selection-critical alternatives - all grounded in NXP's official MF3D(H)x2 short data sheet Rev. 3.2.

Technical Context

The MF3DH2201DUF/01V implements a fully ISO/IEC 14443-4–compliant RF interface with configurable FSCI supporting up to 128-byte frames (256 bytes for larger memory variants), operates at 13.56 MHz, and uses mutual three-pass authentication with hardware-accelerated DES/AES crypto engines. Its on-chip backup management system ensures atomic transaction integrity across file types.

It supports MIsmartApp for delegated application management, Transaction MAC at application level, Virtual Card Architecture with privacy protection, Proximity Check against relay attacks, and Originality Check for NXP product verification - all enabled without firmware update in default delivery configuration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory capacity2 KB EEPROM with 25-year data retention and 500,000 write cycles - sufficient for multi-service credential storage without field replacement.
Input capacitance70 pF (typical) - optimized for small-form-factor designs including thin smart cards and wearable credentials.
RF interfaceISO/IEC 14443A compliant, supporting 106–848 kbit/s data rates - enables interoperability with legacy and NFC-enabled readers.
Security certificationCommon Criteria EAL5+ (HW & SW) - meets banking-grade assurance requirements for e-passports and payment systems.
Cryptographic enginesHardware-accelerated 3DES (56/112/168-bit) and AES-128 - enables fast, low-power secure messaging and key rolling per application.
UID & ID optionsFixed 7-byte UID + optional Random ID mode - balances traceability and privacy in high-volume deployments.
File systemUnlimited applications, up to 32 files per application (6 types including Transaction MAC) - supports complex service bundling without structural rework.

Pinout & Package

MF3DH2201DUF/01V is supplied in FFC (Film Frame Carrier) packaging: 8-inch wafer, sawn, 75 μm thickness. As a contactless IC, it has no electrical pins; communication occurs via integrated antenna coupling. The device connects exclusively through its RF interface - no wire-bonded terminals or solderable leads are present.

Key Features

FeatureDesign Value
Transaction MAC file typeGenerates cryptographically signed transaction proofs on-card - eliminates backend replay risk and enables offline audit trails.
Multiple Key Sets per applicationSupports up to 16 key versions with fast rolling - allows seamless key migration during lifecycle updates without service interruption.
Virtual Card ArchitectureEnables selective application exposure during card discovery - prevents unauthorized enumeration of stored services in multi-VC environments.
Proximity CheckDetects relay attack timing anomalies at physical layer - blocks man-in-the-middle exploitation without user interaction.
Originality CheckVerifies genuine NXP silicon via hardware signature - mitigates counterfeit IC integration in high-security credential supply chains.

Applications

Public Transport TicketingSecure Campus Access

Use Scenario: Single-card fare payment across buses, trams, and metro lines with balance updates and trip history.

IC Role / Device Role / Timing Role: Secure credential storage and cryptographic transaction signing at point-of-use.

Use Value: Enables offline balance validation and tamper-proof audit logs using Transaction MAC - reduces dependency on real-time backend connectivity.

Use Scenario: Multi-door building access with role-based permissions and time-scheduled entry rights.

IC Role / Device Role / Timing Role: On-card enforcement of access policies via application-level keys and file-level access control.

Use Value: Eliminates centralized credential revocation latency by storing dynamic permissions locally - supports immediate lockdown on lost-card reporting.

Micro-Payment & LoyaltySmart City Mobility Hub

Use Scenario: Tap-to-pay at vending machines, cafés, and parking meters with loyalty point accrual.

IC Role / Device Role / Timing Role: Isolated value file management with encrypted balance updates and anti-tear integrity.

Use Value: Guarantees atomic credit/debit operations across multiple vendors - prevents partial updates during power loss or RF disconnect.

Use Scenario: Unified credential for bike sharing, museum entry, citizen services, and local e-wallet.

IC Role / Device Role / Timing Role: Application container isolation with shared-file capability across trusted domains.

Use Value: Allows cross-service transactions (e.g., pay for parking while redeeming museum discount) within one secure session - no credential switching required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MF3DH4201DUF/014 KB EEPROM, same 70 pF input capacitance, identical package and security featuresHigher memory headroom for future application expansion or larger cryptographic key storesSelect when anticipating >2 KB of persistent application data or multi-keyset rollover archives
MF3D2201DUF/012 KB EEPROM, 17 pF input capacitance, same FFC-75 μm packageBetter suited for standard-thickness cards where lower input capacitance improves antenna tuning marginSelect for conventional smart card form factors where 70 pF would require antenna redesign

Compared with MF3DH2201DUF/01V, MF3DH4201DUF/01 offers scalable memory without altering RF design, while MF3D2201DUF/01 trades input capacitance for broader antenna compatibility - both retain identical security architecture, command set, and EAL5+ certification.

Availability

MF3DH2201DUF/01V is available at Aetrix Electronics and suitable for secure public transport ticketing, campus access control, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic integrity.

Supply support for MF3DH2201DUF/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with over 30 years of RFID innovation.

The MF3DH2201DUF/01V belongs to the MIFARE DESFire EV2 product line - engineered specifically for high-assurance, multi-service contactless credentials in smart cities, transit, and secure identity ecosystems.

FAQ

What is the memory capacity and endurance rating of MF3DH2201DUF/01V?

The MF3DH2201DUF/01V integrates 2 KB of EEPROM with guaranteed 25-year data retention and a typical write endurance of 500,000 cycles. This specification enables robust operation in high-transaction environments such as transit fare collection and loyalty redemption - where frequent balance updates occur without premature wear-out. The MF3DH2201DUF/01V uses on-chip wear leveling and automatic backup management to preserve integrity across its full lifecycle.

Does MF3DH2201DUF/01V support ISO/IEC 7816-4 commands?

Yes, MF3DH2201DUF/01V fully supports ISO/IEC 7816-4 APDU structure and file system navigation, including INS codes A4 (SELECT FILE), B0 (READ BINARY), D6 (UPDATE BINARY), B2 (READ RECORDS), E2 (APPEND RECORD), 84 (GET CHALLENGE), 88 (INTERNAL AUTHENTICATE), and 82 (EXTERNAL AUTHENTICATE). This compatibility allows seamless integration into existing smart card middleware and PKI infrastructure - making MF3DH2201DUF/01V deployable in hybrid contact/contactless systems without protocol translation layers.

How does the 70 pF input capacitance of MF3DH2201DUF/01V affect antenna design?

The 70 pF input capacitance of MF3DH2201DUF/01V is optimized for compact, thin-form-factor antennas - such as those used in wearables, slim ID badges, or flexible tickets - where higher capacitance compensates for reduced coil area and inductance. Unlike the 17 pF variant (e.g., MF3D2201DUF/01), this value lowers the resonant frequency shift caused by proximity effects, improving read range consistency in constrained mechanical envelopes. Antenna tuning must account for this fixed capacitance to achieve optimal 13.56 MHz resonance.

Is MF3DH2201DUF/01V backward compatible with earlier MIFARE DESFire generations?

Yes, MF3DH2201DUF/01V operates in default delivery mode as a MIFARE DESFire EV1 device - ensuring full functional and command-level compatibility with existing EV1 and D40 infrastructure. All EV2-specific features (e.g., Transaction MAC, MIsmartApp, Proximity Check) require explicit activation via dedicated commands. This dual-mode behavior allows phased migration: legacy systems continue uninterrupted while new capabilities are incrementally deployed without reader hardware upgrades.

What security certifications apply to MF3DH2201DUF/01V?

MF3DH2201DUF/01V holds Common Criteria EAL5+ certification for both hardware and software - the highest assurance level granted to smart card ICs used in banking cards and electronic passports. This certification validates resistance to side-channel attacks, fault injection, and logical exploits across its entire threat model. The MF3DH2201DUF/01V also implements hardware exception sensors (glitch, voltage, temperature, light) and active shielding - all contributing to its certified tamper-resistance profile.

MF3DH2201DUF/01V Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
-
Core Processor:
-
Program Memory Type:
-
Controller Series:
-
RAM Size:
-
Interface:
-
Number of I/O:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

MF3DH2201DUF/01V FAQ

1.How can I place an order for MF3DH2201DUF/01V through Aetrix?

Please submit a Request for Quotation (RFQ) for MF3DH2201DUF/01V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MF3DH2201DUF/01V reliable?

The price and inventory of MF3DH2201DUF/01V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH2201DUF/01V is usually 5 days.

3.What payment methods are accepted for MF3DH2201DUF/01V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH2201DUF/01V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MF3DH2201DUF/01V?

MF3DH2201DUF/01V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MF3DH2201DUF/01V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MF3DH2201DUF/01V?

For technical support, including MF3DH2201DUF/01V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH2201DUF/01V requirements.

6.How does Aetrix verify that MF3DH2201DUF/01V is sourced from the original manufacturer or authorized distributors?

All MF3DH2201DUF/01V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH2201DUF/01V meets industry standards.

7.What is the process for return or replacement of MF3DH2201DUF/01V?

All MF3DH2201DUF/01V units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH2201DUF/01V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MF3DH2201DUF/01V part is unused and in its original packaging.

Return procedure for MF3DH2201DUF/01V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MF3DH2201DUF/01V Tags

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