NXP Semiconductors MF3DH8200DA6/01J

Overview

MF3DH8200DA6/01 from NXP Semiconductors is a contactless multi-application IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It serves as the secure core of smart city mobility cards, enabling concurrent public transport, e-payment, and access control on a single credential.

For engineers reviewing the MF3DH8200DA6/01 datasheet, MF3DH8200DA6/01 pinout, MF3DH8200DA6/01 application, or MF3DH8200DA6/01 equivalent, key selection considerations include its high-input-capacitance MOB6 package for compact antenna integration, Transaction MAC file support for backend-verified transactions, MIsmartApp delegation capability for third-party application management, and backward compatibility with MIFARE DESFire EV1 and D40 infrastructure.

Technical Context

The MF3DH8200DA6/01 implements a dual-layer security architecture: mutual three-pass authentication at PICC level and per-application cryptographic isolation using up to 14 keys per application. Its hardware-accelerated AES-128 and 3DES engines operate alongside an on-chip TRNG and active shielding sensors (glitch, voltage, temperature) to resist physical and side-channel attacks.

It supports ISO/IEC 7816-4 APDU command wrapping, configurable ATS with FSCI up to 256 bytes (for 16/32 kB variants), and native chaining for data transfer. The 70 pF input capacitance variant enables reliable RF coupling in small-form-factor designs such as thin smart cards and wearable tokens without antenna redesign.

Key Specifications

Pinout & Package

MF3DH8200DA6/01 is housed in a MOB6 plastic leadless module carrier package (SOT500-3), designed for flip-chip bonding onto antenna substrates. This surface-mount module integrates the IC die, matching capacitor, and RF interface in a standardized footprint - no discrete pins are exposed for external connection; RF coupling occurs solely via the integrated coil interface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless multi-application IC applications.

Compared with MF3D8200DA6/01, MF3DH8200DA6/01 delivers extended operational range in space-constrained form factors; compared with MF3DH4200DA6/01, it doubles available memory for layered security policies, multi-merchant wallets, and long-term transaction logging - critical for Smart City credential longevity.

Availability

MF3DH8200DA6/01 is available at Aetrix Electronics and suitable for secure public transport ticketing, multi-application smart city credentials, and micro-payment systems requiring stable component supply, long-term lifecycle assurance, and certified cryptographic integrity.

Supply support for MF3DH8200DA6/01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with over 20 years of leadership in contactless IC innovation.

The MF3DH8200DA6/01 belongs to the MIFARE DESFire EV2 product line, engineered specifically for high-assurance, multi-service contactless credential systems demanding EAL5+ certification, flexible application partitioning, and resistance to relay and cloning attacks.

FAQ

What security certifications does the MF3DH8200DA6/01 hold?

The MF3DH8200DA6/01 holds Common Criteria EAL5+ certification for both hardware and software, validating its suitability for high-security applications such as electronic passports and banking cards. This certification covers the full stack - from RF interface and cryptographic accelerators to the operating system and file system - and is independently verified against AVA_VAN.5 and ALC_FLR.3 assurance requirements. The MF3DH8200DA6/01 also supports optional Random ID generation and Originality Check to further harden against cloning and impersonation attacks.

How does the 70 pF input capacitance of MF3DH8200DA6/01 affect antenna design?

The 70 pF input capacitance of MF3DH8200DA6/01 reduces the required external tuning capacitance in compact antenna layouts, enabling smaller coil sizes and thinner card constructions without sacrificing coupling efficiency. Unlike the 17 pF variants, this version maintains robust communication at distances up to 100 mm even with miniaturized antennas - making it ideal for wearables, hybrid smart cards, and embedded modules where PCB space is constrained. Designers must verify resonance at 13.56 MHz using LCR measurement under 2 V RMS excitation.

Can MF3DH8200DA6/01 replace older MIFARE DESFire EV1 cards in existing infrastructure?

Yes, MF3DH8200DA6/01 operates in backward-compatible mode with MIFARE DESFire EV1 and D40 systems out-of-the-box, supporting identical command sets, file structures, and cryptographic protocols (2TDEA, 3TDEA). No firmware or reader changes are required for basic interoperability. However, to leverage new features like Transaction MAC, MIsmartApp, or Proximity Check, infrastructure upgrades to EV2-specific commands and secure messaging are necessary - which can be deployed incrementally without disrupting legacy service layers.

What file types does MF3DH8200DA6/01 support, and how are they used in practice?

The MF3DH8200DA6/01 supports six file types: Standard Data, Backup Data, Value, Linear Record, Cyclic Record, and Transaction MAC. In practice, Value files store reloadable balances with atomic increment/decrement; Linear Record files log sequential entries like travel history; Transaction MAC files generate cryptographic proofs for each transaction to enable offline backend reconciliation. All files benefit from automatic anti-tear protection - ensuring data consistency even during unexpected power loss or RF field interruption during write operations.

Is MF3DH8200DA6/01 compatible with ISO/IEC 7816-4 APDU-based host systems?

Yes, MF3DH8200DA6/01 fully supports ISO/IEC 7816-4 APDU command structure, including SELECT FILE (INS A4), READ BINARY (INS B0), UPDATE BINARY (INS D6), READ RECORDS (INS B2), APPEND RECORD (INS E2), GET CHALLENGE (INS 84), INTERNAL AUTHENTICATE (INS 88), and EXTERNAL AUTHENTICATE (INS 82). It also supports APDU wrapper mode for native MIFARE commands, allowing seamless integration into existing smart card middleware and Java Card platforms without protocol translation layers.