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NXP Semiconductors MF3DH8201DUD/01V
- Part No.:
- MF3DH8201DUD/01V
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- -
- Datasheet:
-
MF3DH8201DUD/01V.pdf
- Description:
- IC MIFARE DESFIRE EV2 FFC
- Quantity:
- Payment:
- Shipping:
Inventory:4,378
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Product details
Overview
MF3DH8201DUD/01V from NXP Semiconductors is a contactless multi-application smart card IC compliant with ISO/IEC 14443A, featuring 8 KB EEPROM, 70 pF input capacitance, Common Criteria EAL5+ security certification, and support for AES-128 and 3DES cryptographic engines. It enables secure public transport ticketing, micro-payment, and access management in compact form factor cards.
For engineers reviewing the MF3DH8201DUD/01V datasheet, MF3DH8201DUD/01V pinout, MF3DH8201DUD/01V application, or MF3DH8201DUD/01V equivalent, key selection considerations include its high-input-capacitance (70 pF) wafer format for thin card designs, Transaction MAC file support for backend-verified transactions, MIsmartApp delegation capability, Proximity Check against relay attacks, and backward compatibility with MIFARE DESFire EV1 and D40 systems.
Technical Context
The MF3DH8201DUD/01V implements a dual-layer security architecture: mutual three-pass authentication at PICC and application levels, with hardware-accelerated AES-128 and 3DES engines supporting key versioning and diversified key derivation. Its flexible file system allows unlimited applications, each with up to 32 files across six types-including Transaction MAC-enabling atomic multi-file updates via automatic anti-tear protection.
It operates at 13.56 MHz with configurable ATS supporting up to 128-byte frames (256 bytes for larger memory variants), full ISO/IEC 7816-4 APDU command support (SELECT, READ BINARY, UPDATE BINARY, etc.), and optional Random ID generation to prevent tracking. The 70 pF input capacitance variant is specifically optimized for small-form-factor or ultra-thin card constructions requiring enhanced coupling efficiency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 8 KB EEPROM - supports multiple large applications (e.g., transport + payment + loyalty) on one card without memory exhaustion. |
| Input capacitance | 70 pF (typ.) - enables reliable RF coupling in thin (<120 μm) or small-area antenna designs where standard 17 pF parts fail. |
| Security certification | Common Criteria EAL5+ (HW & SW) - meets banking-grade assurance requirements for e-passports and financial credentials. |
| Cryptographic engines | Hardware AES-128 and 3DES - enables fast, side-channel-resistant encryption and CMAC generation for secure messaging and transaction integrity. |
| Data retention | 25 years - ensures long-term validity of stored credentials and transaction history in deployed infrastructure. |
| Write endurance | 500,000 cycles - supports daily transit use over 10+ years without wear-out risk in high-frequency reload scenarios. |
| RF data rate | Up to 848 kbit/s - reduces transaction time below 100 ms for high-throughput fare gates and access points. |
Pinout & Package
MF3DH8201DUD/01V is supplied in FFC (Film Frame Carrier) wafer format - unsawn, 8-inch diameter, 120 μm thickness - intended for embedding into smart card laminates or inlays. As a contactless IC, it has no electrical pins; interface is exclusively via integrated antenna coil coupling to reader field. No terminal mapping applies.
Key Features
| Feature | Design Value |
|---|---|
| Transaction MAC file | Generates cryptographically signed transaction proofs on-card, enabling offline verification by backend systems without exposing keys. |
| MIsmartApp delegation | Allows third-party application providers to create and manage applications under controlled permissions - essential for multi-operator Smart City ecosystems. |
| Proximity Check | Detects relay attacks by measuring signal propagation delay - prevents unauthorized remote access to card functions. |
| Originality Check | Verifies genuine NXP silicon at runtime - blocks counterfeit ICs in high-security deployments like national ID or government services. |
| Virtual Card Architecture | Enables privacy-preserving card selection across multiple logical cards on one physical device - critical for citizen service consolidation. |
Applications
| Public Transport Ticketing | Secure Access Management |
|---|---|
Use Scenario: Contactless tap-in/tap-out at metro gates and bus validators using a single reusable card. IC Role / Device Role / Timing Role: Secure credential storage and real-time balance/value update with atomic transaction rollback. Use Value: Eliminates need for separate tickets per operator; supports dynamic fare calculation and cross-agency loyalty accrual. | Use Scenario: Physical access control for corporate campuses, universities, or government facilities with role-based entry rights. IC Role / Device Role / Timing Role: Stores encrypted access profiles, biometric templates (via external host), and time-based permissions per zone. Use Value: Enables centralized credential lifecycle management and instant revocation without card reissuance. |
| Micro-Payment & Loyalty | Student ID & Campus Services |
Use Scenario: Tap-to-pay at cafeterias, vending machines, and retail kiosks within closed-loop environments. IC Role / Device Role / Timing Role: Hosts value files with backup and performs offline balance updates with tamper-proof audit trail. Use Value: Reduces dependency on network connectivity; supports offline transaction logging and reconciliation. | Use Scenario: Integrated student ID used for library access, meal plan, printing credits, and event registration. IC Role / Device Role / Timing Role: Multi-application container with isolated file structures per service, enforced by application-level key isolation. Use Value: Single credential replaces 4–5 physical cards; simplifies issuance, reduces administrative overhead, and improves user adoption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar contactless multi-application IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MF3D8201DUD/01 | Same 8 KB memory and FFC package but 17 pF input capacitance - requires larger antenna area or higher reader field strength. | Better suited for standard-thickness cards (≥300 μm) with conventional antenna layouts. | Select when antenna design accommodates lower capacitance and cost sensitivity outweighs thin-card optimization. |
| MF3DH4201DUD/01 | Same 70 pF input capacitance and FFC package but reduced 4 KB EEPROM - limits number and size of concurrent applications. | Appropriate for single-purpose deployments (e.g., access-only or basic transit) where memory headroom is not required. | Choose when application scope is narrow and bill-of-materials cost reduction is prioritized over future extensibility. |
Compared with MF3D8201DUD/01 and MF3DH4201DUD/01, the MF3DH8201DUD/01V uniquely balances high memory capacity (8 KB) with high-input-capacitance (70 pF) for next-generation thin smart cards - making it the only option supporting both complex multi-service schemes and ultra-low-profile physical implementations.
Availability
MF3DH8201DUD/01V is available at Aetrix Electronics and suitable for secure public transport ticketing, micro-payment infrastructure, and multi-application smart city credentialing requiring stable component supply across long-lifecycle deployments.
Supply support for MF3DH8201DUD/01V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and identification markets, with deep expertise in contactless IC design and Common Criteria evaluation.
The MF3DH8201DUD/01V belongs to the MIFARE DESFire EV2 product line - engineered for high-assurance, multi-application contactless systems in Smart City, transit, and secure access environments where interoperability, scalability, and certified security are mandatory.
FAQ
What is the primary function of MF3DH8201DUD/01V in a contactless system?
The MF3DH8201DUD/01V serves as a secure, multi-application contactless smart card IC that stores and manages credentials, balances, and transaction logs for applications such as transit ticketing and access control. Its hardware cryptographic engines, EAL5+ certification, and 70 pF input capacitance make MF3DH8201DUD/01V ideal for thin-card deployments requiring robust security and reliable RF coupling.
Does MF3DH8201DUD/01V support ISO/IEC 7816-4 commands?
Yes, MF3DH8201DUD/01V fully supports ISO/IEC 7816-4 APDU structure and commands including SELECT FILE (INS A4), READ BINARY (B0), UPDATE BINARY (D6), READ RECORDS (B2), APPEND RECORD (E2), GET CHALLENGE (84), INTERNAL AUTHENTICATE (88), and EXTERNAL AUTHENTICATE (82). This enables seamless integration with existing PKI and smart card middleware stacks - a core capability of MF3DH8201DUD/01V.
How does the 70 pF input capacitance of MF3DH8201DUD/01V affect antenna design?
The 70 pF input capacitance of MF3DH8201DUD/01V lowers the resonant frequency of the antenna circuit, allowing efficient operation with smaller or thinner antennas - especially critical in <120 μm laminates or wearable form factors. Designers must tune antenna inductance downward versus 17 pF variants; MF3DH8201DUD/01V eliminates need for external capacitors in most compact inlay layouts.
Is MF3DH8201DUD/01V backward compatible with older MIFARE DESFire systems?
Yes, MF3DH8201DUD/01V operates in default delivery mode as a MIFARE DESFire EV1 device, supporting all EV1 and D40 commands and secure messaging protocols. New EV2 features - including Transaction MAC, MIsmartApp, and Proximity Check - require explicit activation via dedicated commands, ensuring zero-infrastructure-change migration for MF3DH8201DUD/01V deployments.
What security certifications apply to MF3DH8201DUD/01V?
MF3DH8201DUD/01V holds Common Criteria EAL5+ certification for both hardware and software - the highest assurance level granted to smart card ICs used in banking cards and electronic passports. It also implements hardware exception sensors (glitch, voltage, temperature), self-securing file system, and Originality Check to verify genuine NXP silicon - all rigorously validated features of MF3DH8201DUD/01V.
MF3DH8201DUD/01V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- -
- Program Memory Type:
- -
- Controller Series:
- -
- RAM Size:
- -
- Interface:
- -
- Number of I/O:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MF3DH8201DUD/01V FAQ
1.How can I place an order for MF3DH8201DUD/01V through Aetrix?
Please submit a Request for Quotation (RFQ) for MF3DH8201DUD/01V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MF3DH8201DUD/01V reliable?
The price and inventory of MF3DH8201DUD/01V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MF3DH8201DUD/01V is usually 5 days.
3.What payment methods are accepted for MF3DH8201DUD/01V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MF3DH8201DUD/01V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MF3DH8201DUD/01V?
MF3DH8201DUD/01V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MF3DH8201DUD/01V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MF3DH8201DUD/01V?
For technical support, including MF3DH8201DUD/01V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MF3DH8201DUD/01V requirements.
6.How does Aetrix verify that MF3DH8201DUD/01V is sourced from the original manufacturer or authorized distributors?
All MF3DH8201DUD/01V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MF3DH8201DUD/01V meets industry standards.
7.What is the process for return or replacement of MF3DH8201DUD/01V?
All MF3DH8201DUD/01V units undergo pre-shipment inspection (PSI). If there is an issue with MF3DH8201DUD/01V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MF3DH8201DUD/01V part is unused and in its original packaging.
Return procedure for MF3DH8201DUD/01V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MF3DH8201DUD/01V Tags
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