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NXP Semiconductors MFS8406AMBP4ES
- Part No.:
- MFS8406AMBP4ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8406AMBP4ES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN4
- Quantity:
- Payment:
- Shipping:
Inventory:1,001
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Product details
Overview
MFS8406AMBP4ES from NXP Semiconductors is a functionally safe, ASIL B-compliant system basis chip (SBC) designed for automotive camera applications. It integrates a 3.3 V VPRE synchronous buck controller (10 A peak), 1.25 V BUCK1 core regulator (4.5 A peak), enabled BUCK3 (2.3 V, 4.5 A), dual LDOs (LDO1 = 5.0 V/150 mA, LDO2 = 5.0 V/150 mA), and a 5.74 V BOOST converter. It supports fail-safe outputs, SPI control with CRC, and operates across −40 °C to 125 °C.
For engineers reviewing the MFS8406AMBP4ES datasheet, MFS8406AMBP4ES pinout, MFS8406AMBP4ES application, or MFS8406AMBP4ES equivalent, key selection considerations include its OTP-configured camera-optimized power sequencing (BUCK1 in Slot 1, LDO1/LDO2 in Slots 1 & 2), 2.22 MHz switching frequency, deep fail-safe auto-retry (×15), and dedicated VCOREMON/VMON monitoring for vision sensor SoCs.
Technical Context
The MFS8406AMBP4ES implements two independent state machines: a main power management engine handling wake-up, standby, and regulator sequencing, and a fail-safe state machine managing voltage supervision (VCOREMON, VMON1–4), MCU error monitoring (FCCU1/FCCU2), ABIST, and fail-safe output assertion (FS0B). Its safety architecture complies with ISO 26262 ASIL B and AEC-Q100 Grade 1.
It features configurable 2.22 MHz SMPS operation with phase-shifting delay 0, slope compensation (VPRE: 60 mV/µs; BOOST: 160 mV/µs), and thermal shutdown behavior per regulator (BUCK1/BUCK3/LDOs shut down individually). Power-up sequencing is fixed by OTP: BUCK1 starts/stops in Slot 1; LDO1 and LDO2 start/stop in Slots 1 and 1 respectively; BUCK3 is enabled and starts in Slot 0 only via SPI command.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP: 4.9 V to 40 V - supports wide automotive battery range with undervoltage lockout at 4.9 V. |
| VPRE Output | 3.3 V / 10 A peak - high-current pre-regulator for downstream converters; configured as Force PWM mode. |
| BUCK1 Output | 1.25 V / 4.5 A peak - dedicated MCU core supply with SVS capability and soft-start ramp of 7.81 mV/µs. |
| BOOST Output | 5.74 V / 1.5 A peak - supplies external CAN PHY or sensors; fixed 2.22 MHz switching with 500 V/µs slew rate. |
| LDO1/LDO2 Outputs | 5.0 V / 150 mA each - low-noise IO/ADC supplies; independently sequenced in Slot 1. |
| Safety Compliance | ISO 26262 ASIL B, AEC-Q100 Grade 1 - qualified for camera ECU safety partitioning with ABIST, FCCU, and fail-safe outputs. |
| Quiescent Current | 10 µA typ in OFF mode - enables ultra-low-power parking-mode operation for camera systems. |
Pinout & Package
HVQFN48, plastic thermally enhanced thin quad flat package, no lead, wettable flanks (SOT619-27); exposed pad (EP) connected to GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB | Voltage feedback input | Closes regulation loop for 1.25 V BUCK1; requires external resistor divider for precise output setting. |
| VCOREMON | Core voltage monitor input | Direct connection to BUCK1 output for SVS and fail-safe detection of core rail collapse. |
| FS0B | Fail-safe output (active-low open drain) | Asserted during fault conditions (e.g., UV/OV, TSD, ABIST failure); drives external safety relay or MCU FS input. |
| PGOOD | Power good indicator (active-low push-pull) | Signals stable operation of all enabled regulators; requires external pull-up to VDDIO. |
| RSTB | Reset output (active-low push-pull) | Resets connected MCU on startup or fault; monitored for external reset injection and fault propagation. |
| SPI (MOSI/MISO/SCLK/CSB) | 32-bit serial interface with CRC | Enables runtime configuration, status readback, and dynamic power sequencing control (e.g., BUCK3 enable). |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured camera-optimized sequencing | Fixed slot assignment: BUCK1 (Slot 1), LDO1/LDO2 (Slot 1), BUCK3 (SPI-enabled only) - eliminates external timing components for vision ECUs. |
| Deep fail-safe auto-retry | ×15 retry attempts before entering permanent fail-safe state - sustains operation through transient faults common in automotive camera environments. |
| Dual independent monitoring paths | VCOREMON + four VMON inputs (VMON1–4) - enables simultaneous supervision of MCU core, IO, ADC, and external IC rails with programmable OV/UV thresholds. |
| EMC-optimized SMPS | 2.22 MHz fixed-frequency operation with spread spectrum disabled but manual tuning supported - reduces radiated emissions in compact camera modules. |
| Thermally robust HVQFN48EP | RθJA = 23 °C/W (2s6p board) - sustains full 4.5 A BUCK1 load at 125 °C ambient without derating in typical camera housing layouts. |
Applications
| Monocular Camera ECU | Stereo Vision Processing Unit |
|---|---|
Use Scenario: Single-lens ADAS camera powering image sensor, ISP, and microcontroller in compact front-facing module. IC Role / Device Role / Timing Role: Primary power manager delivering regulated 1.25 V (core), 5.0 V (IO/ADC), and 5.74 V (sensor bias) with fail-safe monitoring. Use Value: Enables single-chip power solution eliminating discrete LDOs and sequencing ICs; OTP sequencing matches typical vision SoC boot order. |
Use Scenario: Dual-camera system requiring synchronized power-up and independent rail monitoring for left/right sensor chains. IC Role / Device Role / Timing Role: Centralized SBC providing matched BUCK1/LDO outputs and shared FS0B assertion for both channels. Use Value: Reduces BOM count by consolidating two independent power trees; deep fail-safe ensures continued operation during single-sensor fault. |
| Night Vision Thermal Camera Module | Driver Monitoring System (DMS) Camera |
Use Scenario: Low-light thermal imaging camera operating in extreme ambient temperatures (−40 °C to 105 °C). IC Role / Device Role / Timing Role: High-reliability power source with extended temperature qualification (Grade 1), TSD protection per regulator, and 10 µA OFF-mode current. Use Value: Maintains functional safety during cold cranking and hot soak; ultra-low quiescent current extends battery life in always-on monitoring modes. |
Use Scenario: In-cabin DMS camera requiring rapid wake-from-standby and deterministic power sequencing for driver attention analysis. IC Role / Device Role / Timing Role: Fast wake-up via WAKE1/WAKE2 pins, SPI-controlled BUCK3 enable, and PGOOD/RSTB coordination with host SoC. Use Value: Achieves <100 ms system wake-up latency; fail-safe outputs prevent erroneous driver alerts during power transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8416AMBP3ES | Superset variant: includes BUCK3 enabled by default (not SPI-gated), adds VMON3/VMON4 monitoring, and PGOOD/RSTB outputs. | Targeted for radar modules requiring higher integration density and additional voltage supervision channels. | Select when full BUCK3 autonomy and expanded monitoring (e.g., for RF front-end bias) are required; not pin-compatible due to different OTP sequencing logic. |
| MFS8412AMBP7ES | Optimized for S32R274 radar MCU: BUCK1 = 1.25 V, BUCK3 = 2.3 V, LDO1 = 3.3 V, and PLL enabled; PSYNC active. | Designed for NXP S32R274-based radar processing units with synchronized multi-device clocking. | Choose for radar domain controllers needing PSYNC support and PLL-based timing; differs in LDO1 voltage (3.3 V vs. 5.0 V) and safety feature set (FCCU enabled). |
Compared with MFS8406AMBP4ES, MFS8416AMBP3ES offers broader monitoring and autonomous BUCK3 but lacks camera-specific sequencing; MFS8412AMBP7ES provides radar-optimized timing and PSYNC but omits the 5.0 V LDO pair critical for camera sensor interfaces.
Availability
MFS8406AMBP4ES is available at Aetrix Electronics and suitable for monocular camera ECUs, stereo vision processing units, night vision thermal modules, and driver monitoring system (DMS) cameras requiring stable component supply, ASIL B compliance, and automotive-grade longevity.
Supply support for MFS8406AMBP4ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive power management.
The FS84 QFN48EP product line delivers integrated, fail-safe power management for ADAS and automated driving domains, specifically engineered to reduce system complexity and accelerate time-to-market for camera, radar, and domain controller designs.
FAQ
What is the primary application target for the MFS8406AMBP4ES?
The MFS8406AMBP4ES is specifically optimized for automotive camera applications, as indicated by its ordering information designation "Camera" in Table 2. Its OTP configuration-featuring BUCK1 in Slot 1, dual 5.0 V LDOs sequenced in Slot 1, and SPI-gated BUCK3-matches the power-up requirements of vision SoCs used in monocular, stereo, and DMS camera modules.
Does the MFS8406AMBP4ES support pin-to-pin compatibility with other FS84 QFN48EP variants?
All FS84 QFN48EP devices, including the MFS8406AMBP4ES, are pin-to-pin and software compatible per the General Description. However, OTP programming defines functional differences: BUCK3 is disabled by default and requires SPI enablement in MFS8406AMBP4ES, whereas it is active by default in MFS8416AMBP3ES. Hardware layout remains identical across the family.
What safety features does the MFS8406AMBP4ES provide for camera ECU designs?
The MFS8406AMBP4ES delivers ASIL B compliance via integrated safety mechanisms: VCOREMON and four VMON inputs for rail supervision, ABIST for analog self-test, simple watchdog (WD), fail-safe output FS0B, and deep fail-safe auto-retry (×15). It also supports FCCU monitoring for MCU-level error detection-critical for vision system functional safety partitioning.
How is power sequencing controlled in the MFS8406AMBP4ES?
Power sequencing in the MFS8406AMBP4ES is fixed by OTP: BUCK1 starts/stops in Slot 1; LDO1 and LDO2 start/stop in Slot 1; BUCK3 is disabled at power-up and must be enabled via SPI command. This camera-optimized sequence ensures core voltage stabilizes before IO/ADC rails, preventing SoC latch-up during boot.
What are the thermal performance characteristics of the MFS8406AMBP4ES package?
The MFS8406AMBP4ES uses an HVQFN48EP package with RθJA = 23 °C/W on a 2s6p PCB. This enables sustained operation at full 4.5 A BUCK1 load up to 125 °C ambient temperature. The exposed pad (EP) must be soldered to a solid GND plane to achieve specified thermal resistance and ensure reliable performance in enclosed camera housings.
MFS8406AMBP4ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8406AMBP4ES FAQ
1.How can I place an order for MFS8406AMBP4ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8406AMBP4ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8406AMBP4ES reliable?
The price and inventory of MFS8406AMBP4ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8406AMBP4ES is usually 5 days.
3.What payment methods are accepted for MFS8406AMBP4ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MFS8406AMBP4ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MFS8406AMBP4ES?
MFS8406AMBP4ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8406AMBP4ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8406AMBP4ES?
For technical support, including MFS8406AMBP4ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8406AMBP4ES requirements.
6.How does Aetrix verify that MFS8406AMBP4ES is sourced from the original manufacturer or authorized distributors?
All MFS8406AMBP4ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8406AMBP4ES meets industry standards.
7.What is the process for return or replacement of MFS8406AMBP4ES?
All MFS8406AMBP4ES units undergo pre-shipment inspection (PSI). If there is an issue with MFS8406AMBP4ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8406AMBP4ES part is unused and in its original packaging.
Return procedure for MFS8406AMBP4ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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