NXP Semiconductors MFS8406AMBP4ESR2
- Part No.:
- MFS8406AMBP4ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8406AMBP4ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MFS8406AMBP4ESR2 from NXP Semiconductors is a functionally safe, ASIL B-compliant system basis chip (SBC) designed for automotive camera systems. It integrates a 3.3 V VPRE synchronous buck controller (10 A peak), 1.25 V BUCK1 core regulator (4.5 A peak), enabled BUCK3 (2.3 V, 4.5 A), BOOST (5.74 V), and dual LDOs (5.0 V/150 mA LDO1, 5.0 V/150 mA LDO2), all with fail-safe outputs and SPI control.
For engineers reviewing the MFS8406AMBP4ESR2 datasheet, MFS8406AMBP4ESR2 pinout, MFS8406AMBP4ESR2 application, or MFS8406AMBP4ESR2 equivalent, this device supports radar/vision domain power sequencing, EMC-optimized frequency synchronization, deep fail-safe auto-retry (x15), and OTP-configured safety monitoring for VCOREMON, VDDIOMON, and four VMON inputs.
Technical Context
The MFS8406AMBP4ESR2 implements two independent state machines: a main power management state machine handling wake-up, standby, and regulator sequencing, and a dedicated fail-safe state machine managing ABIST, FCCU-based MCU error detection, PGOOD/RSTB/FS0B assertion, and deep fail-safe recovery. Its safety architecture complies with ISO 26262 ASIL B and AEC-Q100 Grade 1.
It supports configurable power-up sequencing across eight slots, hardware-enforced voltage supervision (OV/UV thresholds with 25 µs/15 µs delays), and failsafe output behavior including automatic shutdown of BUCK1/BUCK3/LDOs during thermal fault (TSD) or undervoltage events, with no software intervention required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP: 4.9 V to 40 V - supports wide automotive battery range with UVLO hysteresis |
| VPRE Output | 3.3 V, 10 A peak - high-current pre-regulator for downstream SMPS, force-PWM mode |
| BUCK1 Output | 1.25 V, 4.5 A peak - dedicated MCU core supply with SVS capability and 2.22 MHz switching |
| BUCK3 Output | 2.3 V, 4.5 A peak - enabled low-voltage rail for vision sensor interfaces |
| LDO1 / LDO2 | 5.0 V / 5.0 V, 150 mA each - IO/ADC supplies with independent power sequencing slots |
| Safety Certification | ISO 26262 ASIL B, AEC-Q100 Grade 1 - qualified for safety-critical camera ECU applications |
| Interface | 32-bit SPI with CRC - secure configuration, monitoring, and fault reporting |
Pinout & Package
HVQFN48EP (SOT619-27), thermally enhanced wettable flanks package with exposed pad (EP) connected to GND; 48-pin layout optimized for automotive PCB layout and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP (Pin 44) | Main power input | 40 V max DC input; requires reverse-battery protection diode in series |
| VPRE-related pins (35–42) | VPRE controller interface | PRE_GHS/PRE_GLS drive external MOSFETs; PRE_FB provides feedback and current sensing |
| BUCK1_IN (30), BUCK1_SW (31), BUCK1_FB (33) | Core regulator path | Supports 1.25 V/4.5 A output with integrated gate drivers and soft-start (7.81 mV/µs) |
| BUCK3_IN (5), BUCK3_SW (6), BUCK3_FB (8) | Vision sensor rail | Configured for 2.3 V/4.5 A; uses quiet input (BUCK3_INQ, Pin 2) to reduce noise coupling |
| LDO1 (47), LDO2 (46) | Linear regulators | 5.0 V outputs with 150 mA rating; assigned to power sequence slots 1 and 1 respectively |
| VCOREMON (15), VMON1–VMON4 (10–14) | Voltage supervision inputs | Monitor BUCK1 output and up to four external rails; OV/UV thresholds programmable via OTP |
| FS0B (12), PGOOD (16), RSTB (17) | Fail-safe outputs | Open-drain, active-low signals with mandatory VDDIO pullup; FS0B asserts on critical faults |
| SPI interface (22–25) | Digital control bus | MISO/MOSI/SCLK/CSB support 32-bit command frames with CRC for robust configuration |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine with ABIST | Self-test coverage for analog monitors, regulators, and safety logic; x15 auto-retry on deep fail-safe entry |
| EMC-optimized switching | 2.22 MHz fixed-frequency operation with phase-shifting delay 0 and spread-spectrum disabled - reduces radiated emissions in camera modules |
| Configurable power sequencing | Eight independent slots enable precise startup/shutdown order for MCU, sensors, and PHYs without external timing components |
| OTP-programmable supervision | Per-rail OV/UV thresholds (e.g., VCOREMON: 112%/88%, VDDIOMON: 110%/90%) with 25 µs/15 µs glitch filtering |
| Thermal fault response | Automatic BUCK1/BUCK3/LDO shutdown on TSD; BOOST remains active until thermal recovery |
Applications
| Automotive Camera Power Management | Radar Sensor Domain Controller |
|---|---|
Use Scenario: Powering mono/stereo camera ECUs with image sensor, ISP, and MCU requiring tightly regulated, sequenced, and monitored rails. IC Role / Device Role / Timing Role: Primary SBC providing VPRE (3.3 V), BUCK1 (1.25 V), BUCK3 (2.3 V), LDO1/LDO2 (5.0 V), and fail-safe signaling. Use Value: Enables ASIL B compliance for vision systems via integrated voltage supervision, ABIST, and deep fail-safe recovery without external watchdog ICs. | Use Scenario: Supplying corner/imaging radar modules with RF SoC, DSP, and CAN PHY requiring low-noise, synchronized power rails. IC Role / Device Role / Timing Role: System basis chip delivering VPRE, BOOST (5.74 V), and BUCK1 while synchronizing switching frequencies to minimize radar band interference. Use Value: Reduces system-level EMC risk through FIN/FOUT synchronization and slew-rate-controlled gate drivers. |
| ADAS Domain Controller Power Hub | Infotainment Head Unit Power Subsystem |
Use Scenario: Consolidating power delivery for multi-core ADAS processors, Ethernet switches, and safety co-processors in zonal architectures. IC Role / Device Role / Timing Role: Centralized PMIC managing up to seven regulated outputs with fail-safe outputs (FS0B, RSTB, PGOOD) tied to functional safety manager. Use Value: Eliminates discrete supervisor ICs by integrating VCOREMON, VDDIOMON, and four VMON inputs with configurable thresholds. | Use Scenario: Powering display controllers, audio codecs, and touch controllers in head units where thermal performance and EMI are critical. IC Role / Device Role / Timing Role: High-efficiency SBC supplying 1.25 V core, 2.3 V I/O, and dual 5.0 V LDOs with thermal-aware shutdown and OFF-mode quiescent current (10 µA). Use Value: Extends battery runtime in accessory mode via ultra-low ISUP_OFF1 and supports hot-plug wake-up via WAKE1/WAKE2 inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8416AMBP3ESR2 | Same HVQFN48EP package; includes enabled BUCK3 (2.3 V), LDO2 (5.0 V), PSYNC, and PLL; higher VPRE current limit (120 mV vs. 150 mV) | Targeted for radar applications; supports dual-device synchronization and higher-resolution monitoring (VMON3/VMON4 enabled) | Select when needing PSYNC for multi-SBC coordination or enhanced analog monitoring coverage |
| MFS8412AMBP7ESR2 | Same package; includes BUCK3 (2.3 V), LDO2 (5.0 V), PSYNC, and FLT_RECOVERY; different BUCK1 soft-start slope (7.81 vs. 10.41 mV/µs) | Optimized for radar with S32R274 MCU; adds fault recovery logic and phase-shifted BUCK3 timing (delay 0) | Select when integrating with NXP S32R274 and requiring hardware-based fault recovery beyond auto-retry |
Compared with MFS8406AMBP4ESR2, MFS8416AMBP3ESR2 offers broader monitoring and synchronization features for radar clusters, while MFS8412AMBP7ESR2 adds fault recovery logic for S32R274-based radar - both retain identical pinout and core regulator specs but differ in OTP-configured safety and sequencing behavior.
Availability
MFS8406AMBP4ESR2 is available at Aetrix Electronics and suitable for automotive camera modules, ADAS domain controllers, and infotainment head units requiring stable component supply, ASIL B qualification, and long-term automotive lifecycle support.
Supply support for MFS8406AMBP4ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS84 QFN48EP product line delivers integrated, fail-safe power solutions for radar, vision, and domain controller applications - designed to replace discrete PMIC + supervisor combinations with single-chip ASIL B compliance.
FAQ
What is the primary application target for the MFS8406AMBP4ESR2?
The MFS8406AMBP4ESR2 is specifically configured for automotive camera systems, as indicated by its ordering information (Table 2: "Camera" application target). It delivers optimized power rails - including 3.3 V VPRE, 1.25 V BUCK1, 2.3 V BUCK3, and dual 5.0 V LDOs - with fail-safe monitoring tailored for mono/stereo camera ECUs per ISO 26262 ASIL B requirements.
Does the MFS8406AMBP4ESR2 support frequency synchronization with external devices?
Yes, the MFS8406AMBP4ESR2 supports frequency synchronization via its FIN (Pin 18) and FOUT (Pin 21) pins. Although PSYNC is disabled in this OTP variant (Table 3), the device can still synchronize its internal SMPS clocks to an external source using FIN, and generate a synchronized output on FOUT to coordinate timing with other ICs - critical for reducing EMI in camera modules.
What safety monitoring functions are enabled in the MFS8406AMBP4ESR2?
The MFS8406AMBP4ESR2 enables VCOREMON (Pin 15), VDDIOMON (Pin 14), and VMON1 (Pin 14) monitoring with OTP-configured thresholds (e.g., VCOREMON OVTH = 112%, UVTH = 88%). VMON2–VMON4 are disabled per Table 4. All enabled monitors use 25 µs OV and 15 µs UV glitch filtering, and trigger fail-safe responses including PGOOD deassertion and FS0B assertion.
How does the MFS8406AMBP4ESR2 handle thermal faults?
On thermal shutdown (TSD), the MFS8406AMBP4ESR2 automatically disables BUCK1, BUCK3, LDO1, and LDO2 while keeping VPRE and BOOST active. BUCK1 enters "shutdown + DFS" mode (Table 3), initiating deep fail-safe recovery with x15 auto-retry. This behavior ensures continued pre-regulation and bias supply during thermal events while isolating affected rails - preserving system integrity in camera ECUs.
Is the MFS8406AMBP4ESR2 pin-compatible with other FS84 QFN48EP family members?
Yes, all FS84 QFN48EP devices - including MFS8406AMBP4ESR2 - are pin-to-pin compatible and software compatible per the General Description. This allows hardware reuse across radar, camera, and gateway variants, with differentiation solely in OTP configuration (e.g., enabled/disabled regulators, supervision settings, sequencing slots), enabling scalable platform design.
MFS8406AMBP4ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8406AMBP4ESR2 FAQ
1.How can I place an order for MFS8406AMBP4ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8406AMBP4ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8406AMBP4ESR2 reliable?
The price and inventory of MFS8406AMBP4ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8406AMBP4ESR2 is usually 5 days.
3.What payment methods are accepted for MFS8406AMBP4ESR2?
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4.How is shipping managed for MFS8406AMBP4ESR2?
MFS8406AMBP4ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8406AMBP4ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8406AMBP4ESR2?
For technical support, including MFS8406AMBP4ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8406AMBP4ESR2 requirements.
6.How does Aetrix verify that MFS8406AMBP4ESR2 is sourced from the original manufacturer or authorized distributors?
All MFS8406AMBP4ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8406AMBP4ESR2 meets industry standards.
7.What is the process for return or replacement of MFS8406AMBP4ESR2?
All MFS8406AMBP4ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MFS8406AMBP4ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8406AMBP4ESR2 part is unused and in its original packaging.
Return procedure for MFS8406AMBP4ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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