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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MFS8416AMBP0ES

Name: MFS8416AMBP0ES
Brand: NXP Semiconductors
SKU: MFS8416AMBP0ES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MFS8416AMBP0ES

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 48-VFQFN Exposed Pad

Datasheet:: MFS8416AMBP0ES.pdf

Description:: SAFETY POWER MANAGEMENT IC, QFN4

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Product details

Overview

MFS8416AMBP0ES from NXP Semiconductors is a functionally safe, ASIL B-compliant system basis chip (SBC) for automotive radar and ADAS domain controllers. It integrates a 10 A peak VPRE synchronous buck controller, 4.5 A BUCK1 for MCU core supply, 4.5 A BUCK3, 5.74 V BOOST converter, two LDOs (up to 400 mA), and fail-safe outputs. It supports SPI-controlled power sequencing, external frequency synchronization, and operates across −40 °C to 125 °C.

For engineers reviewing the MFS8416AMBP0ES datasheet, MFS8416AMBP0ES pinout, MFS8416AMBP0ES application, or MFS8416AMBP0ES equivalent, key selection considerations include its QM/ASIL B safety qualification per ISO 26262, AEC-Q100 Grade 1 qualification, HVQFN48EP package with wettable flanks, OTP-programmable configuration, and integrated monitoring for VCORE, VDDIO, and four VMON inputs.

Technical Context

The MFS8416AMBP0ES implements dual independent state machines: a main power management state machine handling wake-up, standby, and regulator sequencing, and a fail-safe state machine managing ABIST, FCCU-based MCU error detection, deep fail-safe auto-retry (×15), and fault-triggered FS0B assertion. Its safety architecture includes configurable undervoltage/overvoltage monitoring with programmable thresholds (e.g., VCOREMON UVTH = 95%, OVTH = 110%) and 25 µs glitch filtering.

It features hardware-level EMC optimization via SMPS frequency synchronization (FIN/FOUT), spread spectrum, slew rate control on PRE_GHS/PRE_GLS drivers, and phase-shifting capability across regulators. The device uses OTP programming for fixed configuration (P0 = nonprogrammed base variant) and supports engineering-mode emulation via NXP GUI and socketed evaluation board-production OTP programming is performed only by NXP or authorized third parties.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	VSUP: 4.9 V to 40 V DC - supports 12 V automotive battery rail with reverse-battery protection diode required on VSUP.
VPRE Output	3.3 V @ 10 A peak - high-current pre-regulator for downstream converters; slope compensation = 140 mV/µs, forced PWM mode.
BUCK1 Output	1.25 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and 2.22 MHz switching frequency.
BOOST Output	5.74 V @ 1.5 A peak - integrated low-side switch for CAN PHY or sensor bias; 500 V/µs slew rate, 2.22 MHz operation.
LDO Outputs	LDO1 = 3.3 V / LDO2 = 5.0 V, each up to 150 mA - configurable for MCU I/O and ADC supply with independent power sequencing slots.
Safety Compliance	ISO 26262 ASIL B compliant; AEC-Q100 Grade 1 qualified; built-in ABIST/LBIST, FCCU monitoring, and fail-safe output FS0B.
Quiescent Current	10 µA typ in OFF mode - enables ultra-low-power battery-off state for always-on radar subsystems.

Pinout & Package

HVQFN48EP (SOT619-27): 7 mm × 7 mm, 0.4 mm pitch, thermally enhanced plastic quad flat no-lead package with wettable flanks and exposed thermal pad (EP) connected to GND.

Pin/Terminal	Circuit Role	Design Meaning
VSUP (44)	Main power input	Primary 40 V-rated supply rail; requires external reverse-battery protection diode.
VPRE-related pins (35–42)	External buck controller interface	Pins PRE_GHS, PRE_GLS, PRE_SW, PRE_FB, PRE_COMP, PRE_CSP, PRE_BOOT enable external MOSFET control for 10 A VPRE stage.
BUCK1_IN (30), BUCK1_SW (31), BUCK1_FB (33)	Integrated synchronous buck	Supports 1.25 V/4.5 A core supply; FB pin connects to output for regulation; SW node requires external inductor and capacitor.
BUCK3_IN (5), BUCK3_SW (6), BUCK3_FB (8)	Secondary integrated buck	Configurable 2.3 V/4.5 A rail; INQ pin enables quiet-mode operation for noise-sensitive analog circuits.
VBOOST (45), BOOST_LS (4)	Integrated boost converter	VBOOST pin monitors output; BOOST_LS is internal low-side MOSFET drain - requires external inductor and diode/capacitor.
LDO1 (47), LDO2 (46), LDO1_IN (48)	Linear regulators	LDO1/LDO2 deliver 3.3 V/5.0 V up to 150 mA; LDO1_IN accepts regulated input (e.g., from BUCK1 or VBOOST).
VCOREMON (15), VMON1–4 (10–14)	Analog monitoring inputs	Five dedicated voltage supervision inputs with OTP-configurable OV/UV thresholds and 25 µs glitch rejection.
FS0B (12), PGOOD (16), RSTB (17)	Fail-safe outputs	Open-drain FS0B asserts on critical fault; PGOOD/RSTB are active-low reset/power-good signals requiring VDDIO pull-up.
SPI interface (22–25)	Digital control bus	MISO/MOSI/SCLK/CSB support 32-bit SPI with CRC for configuration, status readback, and dynamic control of regulators and sequencing.
WAKE1/WAKE2 (1, 43)	Wake-up inputs	Two independent wake sources with internal pulldown; require external series resistor if used as global wake pins.

Key Features

Feature	Design Value
OTP-based configuration	Nonprogrammed P0 variant allows full customization during engineering development using NXP GUI and socketed EVB; production programming restricted to NXP or authorized partners.
EMC-optimized switching	FIN/FOUT synchronization, 2.22 MHz fixed-frequency operation, and programmable phase shifting across BUCK1/BUCK3/BOOST reduce system-level radiated emissions.
Fail-safe state machine	Dual ABIST (ABIST1/ABIST2), FCCU-based MCU error detection, and deep fail-safe auto-retry (×15 attempts) ensure deterministic response to internal or external faults without MCU intervention.
Multi-rail power sequencing	Eight independent power sequencing slots allow precise start/stop timing for VPRE, BUCK1, BUCK3, BOOST, LDO1, LDO2, and monitoring rails - critical for radar SoC boot integrity.
Thermal robustness	RθJB = 10 °C/W on 2s6p PCB enables sustained 4.5 A BUCK1 and 4.5 A BUCK3 operation at 125 °C ambient without derating.

Applications

Radar Sensor Power Management	ADAS Domain Controller Supply
Use Scenario: Powers 77 GHz imaging radar SoC (e.g., NXP S32R274) with strict sequencing, low-noise core supply, and fail-safe monitoring. IC Role / Device Role / Timing Role: System basis chip providing VPRE (3.3 V), BUCK1 (1.25 V MCU core), BUCK3 (2.3 V RF bias), and LDOs (3.3 V/5.0 V I/O) with synchronized 2.22 MHz switching. Use Value: Enables single-chip power solution meeting ASIL B requirements while reducing board area and EMI through integrated frequency synchronization and phase shifting.	Use Scenario: Supplies multi-core ADAS domain controller (e.g., NXP S32G) requiring independent, monitored rails for CPU, GPU, memory, and communication peripherals. IC Role / Device Role / Timing Role: Centralized power manager delivering six regulated outputs with programmable sequencing slots, VCOREMON supervision, and FCCU-based MCU health monitoring. Use Value: Eliminates need for discrete supervisors and sequencers; built-in ABIST and deep fail-safe recovery reduce system-level validation effort for ISO 26262 compliance.
Vision Processing Unit (VPU) Power	Automotive Gateway Power Hub
Use Scenario: Powers stereo camera module with image signal processor (ISP), MIPI CSI-2 interface, and high-speed ADC requiring clean, sequenced supplies. IC Role / Device Role / Timing Role: Delivers low-noise BUCK1 (1.25 V core), quiet-mode BUCK3 (1.8 V ISP), LDO1 (3.3 V MIPI), and BOOST (5.0 V sensor bias) with VMON3/VMON4 monitoring. Use Value: BUCK3_INQ pin enables ultra-low ripple operation during image capture; integrated monitoring replaces external voltage supervisors.	Use Scenario: Serves as primary power hub in vehicle gateway integrating Ethernet, CAN FD, LIN, and wireless modules with diverse voltage and sequencing needs. IC Role / Device Role / Timing Role: Provides VPRE (3.3 V), BUCK1 (1.2 V), BUCK3 (2.5 V), LDO1 (3.3 V), LDO2 (5.0 V), and BOOST (5.0 V) with PSYNC support for synchronizing secondary PMICs. Use Value: PSYNC pin enables deterministic timing across multiple power ICs; fail-safe outputs (FS0B, RSTB) trigger system-level shutdown on critical rail failure.

Radar Sensor Power Management

ADAS Domain Controller Supply

Use Scenario: Powers 77 GHz imaging radar SoC (e.g., NXP S32R274) with strict sequencing, low-noise core supply, and fail-safe monitoring.

IC Role / Device Role / Timing Role: System basis chip providing VPRE (3.3 V), BUCK1 (1.25 V MCU core), BUCK3 (2.3 V RF bias), and LDOs (3.3 V/5.0 V I/O) with synchronized 2.22 MHz switching.

Use Value: Enables single-chip power solution meeting ASIL B requirements while reducing board area and EMI through integrated frequency synchronization and phase shifting.

Use Scenario: Supplies multi-core ADAS domain controller (e.g., NXP S32G) requiring independent, monitored rails for CPU, GPU, memory, and communication peripherals.

IC Role / Device Role / Timing Role: Centralized power manager delivering six regulated outputs with programmable sequencing slots, VCOREMON supervision, and FCCU-based MCU health monitoring.

Use Value: Eliminates need for discrete supervisors and sequencers; built-in ABIST and deep fail-safe recovery reduce system-level validation effort for ISO 26262 compliance.

Vision Processing Unit (VPU) Power

Automotive Gateway Power Hub

Use Scenario: Powers stereo camera module with image signal processor (ISP), MIPI CSI-2 interface, and high-speed ADC requiring clean, sequenced supplies.

IC Role / Device Role / Timing Role: Delivers low-noise BUCK1 (1.25 V core), quiet-mode BUCK3 (1.8 V ISP), LDO1 (3.3 V MIPI), and BOOST (5.0 V sensor bias) with VMON3/VMON4 monitoring.

Use Value: BUCK3_INQ pin enables ultra-low ripple operation during image capture; integrated monitoring replaces external voltage supervisors.

Use Scenario: Serves as primary power hub in vehicle gateway integrating Ethernet, CAN FD, LIN, and wireless modules with diverse voltage and sequencing needs.

IC Role / Device Role / Timing Role: Provides VPRE (3.3 V), BUCK1 (1.2 V), BUCK3 (2.5 V), LDO1 (3.3 V), LDO2 (5.0 V), and BOOST (5.0 V) with PSYNC support for synchronizing secondary PMICs.

Use Value: PSYNC pin enables deterministic timing across multiple power ICs; fail-safe outputs (FS0B, RSTB) trigger system-level shutdown on critical rail failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar system basis chip applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NCP81239MNTXG	Single 40 V input, 3-output PMIC (2 buck + 1 LDO); no ASIL B certification, no fail-safe outputs or ABIST.	Targeted at non-safety-critical infotainment or body electronics; lacks radar-grade EMC features and monitoring depth.	Select when functional safety is not required and cost/size constraints outweigh diagnostic coverage needs.
TPS65381A-Q1	ASIL B-compliant SBC with 1 buck + 3 LDOs; no BOOST, no BUCK3, max 2.5 A BUCK current; SPI interface but no PSYNC or multi-VMON inputs.	Designed for MCU-centric applications (e.g., body control modules); insufficient current and rail count for radar/ADAS domain controllers.	Select for simpler ASIL B systems where 4.5 A BUCK1/BUCK3 and BOOST are unnecessary.

Compared with NCP81239MNTXG and TPS65381A-Q1, the MFS8416AMBP0ES uniquely combines ASIL B compliance, 10 A VPRE controller, dual 4.5 A bucks, BOOST, dual LDOs, five VMON inputs, PSYNC, and deep fail-safe recovery - making it the only option qualified for high-performance automotive radar and domain controller power architectures.

Availability

MFS8416AMBP0ES is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, vision processing units, and automotive gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant power management ICs.

Supply support for MFS8416AMBP0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The FS84 QFN48EP product line was designed specifically to address the stringent functional safety, EMC, and multi-rail sequencing demands of next-generation automotive radar, vision, and domain controller systems - enabling consolidation of discrete power and safety functions into a single ASIL B-compliant IC.

FAQ

What safety certifications does the MFS8416AMBP0ES hold?

The MFS8416AMBP0ES is certified to ISO 26262 ASIL B for functional safety and qualified per AEC-Q100 Grade 1 (−40 °C to 125 °C). It includes integrated ABIST/LBIST, FCCU-based MCU monitoring, and fail-safe outputs (FS0B, RSTB, PGOOD) with configurable OV/UV thresholds and 25 µs glitch filtering - all verified in the official NXP FS84QFN48EP product data sheet Rev. 4.0.

How is the MFS8416AMBP0ES configured for production use?

The MFS8416AMBP0ES is delivered as a nonprogrammed OTP (P0) variant. Production OTP programming is performed exclusively by NXP or NXP-authorized third parties - not by end customers. During engineering development, customers use NXP's graphical user interface and socketed evaluation board for OTP emulation and configuration testing before final production programming.

Does the MFS8416AMBP0ES support external frequency synchronization?

Yes, the MFS8416AMBP0ES supports bidirectional frequency synchronization via FIN (input) and FOUT (output) pins. This enables system-level EMC optimization by aligning switching frequencies across multiple SMPS stages or coordinating with external PMICs. The device also supports phase shifting (e.g., delay 0–6 slots) between BUCK1, BUCK3, and BOOST to further reduce peak current demand.

What are the key differences between the MFS8416AMBP0ES and MFS8416AMBP3ES variants?

The MFS8416AMBP0ES is the base nonprogrammed (P0) variant, while MFS8416AMBP3ES is a preprogrammed OTP flavor optimized for radar applications. Key differences include: BUCK1 output = 1.25 V (vs. 1.2 V in P5), VPRE slope compensation = 140 mV/µs (vs. 60 mV/µs), and VCOREMON UVTH = 95% (vs. 95.5% in P8). All share identical pinout, package, and safety architecture.

Can the MFS8416AMBP0ES drive external MOSFETs for the VPRE stage?

Yes, the MFS8416AMBP0ES includes a complete VPRE controller interface with PRE_GHS (high-side gate driver), PRE_GLS (low-side gate driver), PRE_SW (switching node), PRE_FB (feedback), PRE_COMP (compensation), PRE_CSP (current sense positive), and PRE_BOOT (bootstrap capacitor connection) - enabling direct control of external N-channel and P-channel MOSFETs for the 10 A VPRE stage.

MFS8416AMBP0ES Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 48-VFQFN Exposed Pad

Packaging:: Tray

Product Status:: Active

Applications:: System Basis Chip

Current - Supply:: -

Voltage - Supply:: 2.7V ~ 60V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 48-HVQFN (7x7)

MFS8416AMBP0ES FAQ

1.How can I place an order for MFS8416AMBP0ES through Aetrix?

Please submit a Request for Quotation (RFQ) for MFS8416AMBP0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MFS8416AMBP0ES reliable?

The price and inventory of MFS8416AMBP0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8416AMBP0ES is usually 5 days.

3.What payment methods are accepted for MFS8416AMBP0ES?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MFS8416AMBP0ES transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MFS8416AMBP0ES?

MFS8416AMBP0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MFS8416AMBP0ES order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MFS8416AMBP0ES?

For technical support, including MFS8416AMBP0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8416AMBP0ES requirements.

6.How does Aetrix verify that MFS8416AMBP0ES is sourced from the original manufacturer or authorized distributors?

All MFS8416AMBP0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8416AMBP0ES meets industry standards.

7.What is the process for return or replacement of MFS8416AMBP0ES?

All MFS8416AMBP0ES units undergo pre-shipment inspection (PSI). If there is an issue with MFS8416AMBP0ES, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MFS8416AMBP0ES part is unused and in its original packaging.

Return procedure for MFS8416AMBP0ES:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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