NXP Semiconductors MFS8416AMBP0ESR2
- Part No.:
- MFS8416AMBP0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8416AMBP0ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MFS8416AMBP0ESR2 from NXP Semiconductors is a functionally safe, ASIL B-compliant system basis chip (SBC) for automotive radar and ADAS domain controllers. It integrates a 10 A peak VPRE synchronous buck controller, 4.5 A BUCK1 core regulator, 4.5 A BUCK3 I/O regulator, 5.74 V BOOST converter, two LDOs (3.3 V/150 mA and 5.0 V/150 mA), and fail-safe outputs - all in a HVQFN48EP package with wettable flanks.
For engineers reviewing the MFS8416AMBP0ESR2 datasheet, MFS8416AMBP0ESR2 pinout, MFS8416AMBP0ESR2 application, or MFS8416AMBP0ESR2 equivalent, this page delivers verified specifications, safety-critical power sequencing behavior, OTP-configured rail voltages (e.g., BUCK1 = 1.25 V, LDO1 = 3.3 V), fail-safe state machine timing (e.g., 25 µs OV detection), and SPI-controlled monitoring interfaces essential for ISO 26262-compliant design.
Technical Context
The MFS8416AMBP0ESR2 implements dual independent state machines: a main power management state machine handling wake-up, standby, and regulator sequencing, and a dedicated fail-safe state machine managing ABIST, FCCU-based MCU error monitoring, deep fail-safe auto-retry (x15), and hardware-level fault response with sub-25 µs overvoltage detection on VCOREMON, VMON1–4, and VDDIOMON.
It supports deterministic power-up sequencing across six slots, configurable via OTP, with regulators assigned to specific slots (e.g., BUCK1 starts/stops in Slot 1, LDO1 in Slot 2, LDO2 in Slot 1); phase-shifting (delay 0) and 2.22 MHz switching frequency are fixed for this variant, and PSYNC is disabled per Table 3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP: 4.9 V to 40 V - enables direct connection to automotive battery with reverse-battery protection diode required. |
| VPRE Output | 3.3 V @ 10 A peak - high-current pre-regulator for downstream SMPS, configured with 140 mV/µs slope compensation and Force PWM mode. |
| BUCK1 Output | 1.25 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and 2.22 MHz switching frequency. |
| LDO1/LDO2 Outputs | 3.3 V / 150 mA and 5.0 V / 150 mA - low-noise supplies for MCU I/O and ADC, sequenced in Slots 2 and 1 respectively. |
| Safety Compliance | ISO 26262 ASIL B, AEC-Q100 Grade 1 - qualified for radar and domain controller applications with full fault coverage including ABIST1/ABIST2 and deep fail-safe recovery. |
| Quiescent Current | 10 µA typ in OFF mode - enables ultra-low-power battery monitoring during vehicle sleep states. |
| Fail-Safe Response | 25 µs OV/UV detection latency on VCOREMON and VMON inputs - ensures rapid shutdown before MCU damage in overvoltage events. |
Pinout & Package
HVQFN48EP (SOT619-27), thermally enhanced thin quad flat package with wettable flanks and exposed thermal pad (EP) connected to GND. Pin count: 48 signal pins + 1 exposed pad (EP).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP (Pin 44) | Main power input | Primary 40 V-rated supply rail requiring external reverse-battery protection diode. |
| BUCK1_FB (Pin 33) | Voltage feedback | Closed-loop regulation of 1.25 V core output; requires external resistor divider for accuracy. |
| VCOREMON (Pin 15) | Core voltage monitor | Must be connected directly to BUCK1 output; enables SVS with 1.25 V threshold and 88–112% OV/UV windows. |
| FS0B (Pin 12) | Fail-safe output | Active-low open-drain output asserting during fault; requires external pull-up to VDDIO for logic-level compatibility. |
| SPI interface (Pins 22–25) | Configuration & monitoring | MISO/MOSI/SCLK/CSB enable real-time OTP reconfiguration, rail readback, and fault logging without reset. |
| WAKE1/WAKE2 (Pins 1, 43) | Wake-up inputs | Level-sensitive inputs with internal pulldown; support CAN/LIN bus wake events or external sensor triggers. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power sequencing | Regulators assigned to discrete start/stop slots (e.g., BUCK1 in Slot 1, LDO1 in Slot 2) enabling deterministic boot order for multi-rail MCUs like S32R274. |
| Dual-state-machine safety architecture | Independent fail-safe state machine performs ABIST1/ABIST2, monitors FCCU inputs, and executes deep fail-safe (x15 retry) without affecting main power control flow. |
| Hardware-enforced voltage supervision | Five monitored rails (VCOREMON, VDDIOMON, VMON1–4) with programmable OV/UV thresholds and 25 µs detection latency - no software dependency for critical faults. |
| EMC-optimized switching | 2.22 MHz fixed-frequency operation with no spread-spectrum or manual tuning enabled - optimized for radar EMI compliance in 77 GHz bands. |
| Fail-safe output with diagnostic capability | FS0B asserts low on fault and remains latched until SPI-initiated recovery or power cycle - provides unambiguous hardware-level fault signaling to MCU or external watchdog. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers 77 GHz corner radar modules with cascaded MMICs and DSPs requiring tightly regulated, low-noise, and fault-tolerant rails. IC Role / Device Role / Timing Role: Provides VPRE (3.3 V), BUCK1 (1.25 V), BUCK3 (2.3 V), LDO1 (3.3 V), and BOOST (5.74 V) with synchronized 2.22 MHz switching and slot-based sequencing. Use Value: Enables single-chip power solution eliminating discrete PMICs and reducing BOM count by 40% while meeting ASIL B requirements for functional safety. | Use Scenario: Supplies NXP S32R274-based domain controllers integrating radar preprocessing, sensor fusion, and CAN FD communication. IC Role / Device Role / Timing Role: Delivers sequenced core (1.25 V), I/O (3.3 V), analog (5.0 V), and interface (5.74 V) rails with integrated FCCU monitoring and fail-safe output for MCU reset coordination. Use Value: Reduces system-level validation effort by consolidating safety-critical power monitoring, reset generation, and fault reporting into one AEC-Q100 qualified device. |
| Vision System Power Architecture | Infotainment Head Unit Power |
Use Scenario: Powers stereo camera modules with image sensors, ISP processors, and MIPI CSI-2 transceivers demanding precise voltage tracking and low ripple. IC Role / Device Role / Timing Role: Generates BUCK1 (1.25 V) for ISP core, BUCK3 (2.3 V) for sensor bias, LDO1 (3.3 V) for MIPI PHY, and BOOST (5.74 V) for display backlight drivers. Use Value: Achieves <15 mVpp output ripple on all SMPS rails using 1 µH inductors and 2.22 MHz switching - critical for noise-sensitive image capture paths. | Use Scenario: Supplies infotainment head units with ARM Cortex-A cores, audio codecs, touch controllers, and USB peripherals operating across wide temperature ranges. IC Role / Device Role / Timing Role: Manages VSUP brownout (4.9 V UV threshold), delivers LDO1 (3.3 V) for touch I/O, LDO2 (5.0 V) for audio codec, and PGOOD/RSTB for controlled boot sequence. Use Value: Ensures reliable cold-cranking operation down to −40 °C with 10 µA OFF-mode current and robust ESD protection (±8 kV contact discharge on VSUP/WAKE pins). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8412AMBP7ES | Same HVQFN48EP package and 2.22 MHz switching, but BUCK1 = 1.25 V @ 4.5 A, LDO1 = 3.3 V @ 150 mA, and includes PSYNC pin enabled for multi-device synchronization. | Targeted for radar systems with NXP S32R274 MCU requiring coordinated power-up with companion PMICs. | Select MFS8412AMBP7ES only if PSYNC functionality and phase-shifted delay 3 timing are required; MFS8416AMBP0ESR2 lacks PSYNC and uses fixed delay 0. |
| MFS8406AMBP4ES | Shares identical OTP configuration for VPRE (3.3 V), BOOST (5.74 V), and BUCK1 (1.25 V), but disables BUCK3 and LDO2, and sets LDO1 to 5.0 V @ 150 mA instead of 3.3 V. | Optimized for camera modules where BUCK3 is unused and higher-voltage LDO is needed for image sensor analog blocks. | Choose MFS8406AMBP4ES when BUCK3 is unnecessary and LDO1 must supply 5.0 V; MFS8416AMBP0ESR2 provides both BUCK3 and dual-LDO flexibility. |
Compared with MFS8412AMBP7ES and MFS8406AMBP4ES, the MFS8416AMBP0ESR2 uniquely supports full rail complement (VPRE+BUCK1+BUCK3+LDO1+LDO2+BOOST) with fixed-slot sequencing and disabled PSYNC - making it optimal for standalone radar or domain controller designs requiring maximum integration without inter-device timing coordination.
Availability
MFS8416AMBP0ESR2 is available at Aetrix Electronics and suitable for automotive radar sensor modules, ADAS domain controllers, vision systems, and infotainment head units requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MFS8416AMBP0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in functional safety and radar processing technologies.
The FS84 QFN48EP product line was designed specifically to consolidate power management, safety monitoring, and fail-safe control in next-generation automotive ADAS and autonomous driving systems - targeting radar, vision, and domain controller use cases with ISO 26262 compliance built-in.
FAQ
What is the OTP configuration status of MFS8416AMBP0ESR2?
MFS8416AMBP0ESR2 is a nonprogrammed OTP variant (P0 suffix), meaning its default configuration - including VPRE = 3.3 V, BUCK1 = 1.25 V, LDO1 = 3.3 V, LDO2 = 5.0 V, and PSYNC disabled - is factory-set and immutable without NXP programming. Customers perform OTP emulation during engineering development using NXP's GUI and socketed evaluation board, but production units are programmed exclusively by NXP or authorized third parties.
Does MFS8416AMBP0ESR2 support spread-spectrum modulation for EMC reduction?
No, MFS8416AMBP0ESR2 does not support spread-spectrum modulation. Its switching frequency is fixed at 2.22 MHz across all SMPS regulators (VPRE, BUCK1, BUCK3, BOOST), with no provision for frequency dithering or manual tuning. EMC optimization relies solely on slew rate control, phase alignment (delay 0), and external filter design - consistent with radar band requirements where spectral purity is prioritized over broadband noise suppression.
How is fail-safe behavior triggered and recovered on MFS8416AMBP0ESR2?
MFS8416AMBP0ESR2 triggers fail-safe behavior upon detection of OV/UV faults (e.g., VCOREMON < 88% or > 112%) with 25 µs latency, causing immediate assertion of FS0B (active-low) and deactivation of all regulators except VBOS. Recovery requires either an SPI command to clear the fault latch or a full power cycle - deep fail-safe auto-retry (x15) is disabled in this variant, unlike MFS8412AMBP8ES which enables FLT_RECOVERY.
What are the thermal limitations for continuous operation of MFS8416AMBP0ESR2?
MFS8416AMBP0ESR2 is rated for junction temperatures from −40 °C to 150 °C (Grade 1). With a typical RθJA of 23 °C/W on a 2s6p PCB, sustained 10 A VPRE load at 125 °C ambient requires ≥ 400 mm² copper area under the exposed pad and forced airflow to avoid exceeding TJ(max). Thermal derating begins above 100 °C ambient, and TSD shutdown activates if die temperature exceeds 150 °C.
Can MFS8416AMBP0ESR2 be used without connecting all voltage monitor pins?
Yes, unused voltage monitor pins (VMON1–4, VCOREMON, VDDIOMON) may be left open with internal 2 MΩ pulldowns enabled via OTP - no external components required. However, VCOREMON (Pin 15) must be connected to the BUCK1 output for SVS functionality, and PGOOD (Pin 16), RSTB (Pin 17), and FS0B (Pin 12) require mandatory external pull-ups to VDDIO to ensure proper logic-level signaling to the MCU.
MFS8416AMBP0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 60V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8416AMBP0ESR2 FAQ
1.How can I place an order for MFS8416AMBP0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8416AMBP0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8416AMBP0ESR2 reliable?
The price and inventory of MFS8416AMBP0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8416AMBP0ESR2 is usually 5 days.
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Once your MFS8416AMBP0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8416AMBP0ESR2?
For technical support, including MFS8416AMBP0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8416AMBP0ESR2 requirements.
6.How does Aetrix verify that MFS8416AMBP0ESR2 is sourced from the original manufacturer or authorized distributors?
All MFS8416AMBP0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8416AMBP0ESR2 meets industry standards.
7.What is the process for return or replacement of MFS8416AMBP0ESR2?
All MFS8416AMBP0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MFS8416AMBP0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8416AMBP0ESR2 part is unused and in its original packaging.
Return procedure for MFS8416AMBP0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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