NXP Semiconductors MFS8416AMBP3ES
- Part No.:
- MFS8416AMBP3ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8416AMBP3ES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MFS8416AMBP3ES from NXP Semiconductors is a functionally safe, ASIL B-compliant system basis chip (SBC) for automotive radar applications, integrating a 10 A VPRE synchronous buck controller, 4.5 A BUCK1 core regulator (1.25 V), 4.5 A BUCK3 (2.3 V), 5.74 V BOOST converter, and dual LDOs (3.3 V/150 mA and 5.0 V/150 mA). It supports fail-safe outputs, SPI-based configuration, and EMC-optimized 2.22 MHz switching.
For engineers reviewing the MFS8416AMBP3ES datasheet, MFS8416AMBP3ES pinout, MFS8416AMBP3ES application, or MFS8416AMBP3ES equivalent, this device delivers deterministic power sequencing, integrated voltage supervision (VCOREMON, VMON1–VMON4), deep fail-safe auto-retry (×15), and radar-specific OTP calibration including 140 mV/µs VPRE slope compensation and 250 µs turn-off delay.
Technical Context
The MFS8416AMBP3ES implements two independent state machines: a main power management engine handling wake-up, standby, and regulator sequencing, and a dedicated fail-safe state machine managing ABIST, FCCU monitoring, PGOOD/RSTB/FS0B assertion, and deep fail-safe recovery. Its safety architecture complies with ISO 26262 ASIL B and AEC-Q100 Grade 1.
It features hardware-enforced power sequencing across eight slots, configurable via OTP; real-time analog monitoring of five rails (VCOREMON, VDDIOMON, VMON1–VMON4); and synchronized 2.22 MHz SMPS operation with zero-phase-shift synchronization for multi-device EMC optimization in radar ECU designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP = 4.9 V to 40 V - supports cold-crank and load-dump conditions in 12 V automotive systems |
| VPRE Output | 3.3 V @ 10 A peak - high-current pre-regulator for external FETs, with 140 mV/µs slope compensation |
| BUCK1 Output | 1.25 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and 2.22 MHz fixed-frequency operation |
| BUCK3 Output | 2.3 V @ 4.5 A peak - auxiliary rail for radar signal chain, sequenced in Slot 0 with 10.41 mV/µs soft-start |
| LDO1/LDO2 | 3.3 V/150 mA and 5.0 V/150 mA - low-noise IO/ADC supplies with independent power sequencing slots (Slot 2 and Slot 1) |
| Safety Features | ASIL B compliance, ABIST1/ABIST2, FCCU1/FCCU2 inputs, PGOOD/RSTB/FS0B fail-safe outputs, ×15 deep fail-safe retry |
| Interface | 32-bit SPI with CRC - enables secure OTP programming, real-time register access, and fault reporting |
Pinout & Package
HVQFN48, plastic thermally enhanced thin quad flat package, no lead, wettable flanks (SOT619-27); exposed pad (EP) connected to GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_SW (31) | Low-side switch node | Connects to BUCK1 inductor; requires low-inductance layout to minimize switching loss and EMI |
| VCOREMON (15) | Core voltage monitor input | Mandatory connection to BUCK1 output for SVS and fail-safe detection of VCORE undervoltage/overvoltage |
| FS0B (12) | Fail-safe output 0 | Active-low open-drain output asserting during fault; requires external pull-up to VDDIO for logic-level compatibility |
| PGOOD (16) | Power good indicator | Active-low output signaling stable regulation of all enabled rails; pull-up to VDDIO mandatory |
| RSTB (17) | Reset output | Active-low reset driver for MCU; monitors external reset and internal faults; pull-up to VDDIO mandatory |
| WAKE1/WAKE2 (1, 43) | Wake-up inputs | Dual asynchronous wake sources; require external pulldown resistors when unused per AEC-Q100 requirements |
| SPI (22–25) | Serial peripheral interface | MISO/MOSI/SCLK/CSB pins support daisy-chaining and CRC-protected configuration in safety-critical boot sequences |
| EP (49) | Exposed thermal pad | Electrically and thermally tied to GND; must be soldered to PCB thermal plane for junction temperature control ≤150 °C |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B functional safety certification | Fully qualified per ISO 26262:2018 Part 5/6; includes ABIST, LBIST, FCCU monitoring, and fail-safe state machine |
| Radar-optimized OTP configuration | Pre-programmed for corner/imaging radar: 2.22 MHz BUCK1/BUCK3/BOOST, 140 mV/µs VPRE slope, 250 µs turn-off delay |
| Multi-rail voltage supervision | Five independent monitors (VCOREMON, VDDIOMON, VMON1–VMON4) with programmable OV/UV thresholds and 15–25 µs glitch filtering |
| EMC-optimized switching | 2.22 MHz fixed frequency + spread spectrum + slew rate control + FIN/FOUT synchronization for multi-SBC radar stacks |
| Fail-safe output coordination | Hardware-coordinated PGOOD, RSTB, and FS0B assertion with deterministic timing; supports safe machine shutdown |
| Production-ready OTP programming | Factory-programmed configuration; engineering-mode emulation supported via GUI and socketed eval board |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
|
Use Scenario: Powers 77 GHz corner radar modules requiring tightly regulated, low-noise, and fail-safe DC rails for RF front-end, DSP, and interface ICs. IC Role / Device Role / Timing Role: System basis chip providing VPRE (3.3 V), BUCK1 (1.25 V), BUCK3 (2.3 V), BOOST (5.74 V), and dual LDOs with synchronized 2.22 MHz switching and slot-based sequencing. Use Value: Enables single-chip power solution meeting ASIL B requirements, reducing BOM count by eliminating discrete supervisors and sequencers while maintaining <25 µs fault response. |
Use Scenario: Supplies multi-core MCU (e.g., S32R274), radar ASIC, CAN transceiver, and Ethernet PHY in centralized ADAS domain controllers. IC Role / Device Role / Timing Role: Centralized power manager delivering six regulated outputs with independent sequencing slots, voltage supervision, and fail-safe outputs coordinated to MCU reset logic. Use Value: Eliminates need for external watchdog and power-good logic; built-in FCCU inputs and ABIST allow direct integration with safety MCU error reporting paths. |
| Vision Processing Unit (VPU) Power | Automotive Gateway Power Subsystem |
|
Use Scenario: Powers stereo camera modules and image signal processors in vision-based ADAS, requiring precise voltage tracking and fast transient response. IC Role / Device Role / Timing Role: Provides BUCK1 (1.25 V) for VPU core, BUCK3 (2.3 V) for memory I/O, LDO1 (3.3 V) for sensor interface, and BOOST (5.74 V) for active pixel sensors. Use Value: Soft-start ramp rates (7.81–10.41 mV/µs) prevent inrush current-induced brownouts; VMONx inputs enable per-rail health monitoring for diagnostic logging. |
Use Scenario: Delivers clean, sequenced power to gateway MCUs (e.g., MPC5748G), CAN FD transceivers, Ethernet switches, and security co-processors. IC Role / Device Role / Timing Role: SBC supplying VPRE (3.3 V), BUCK1 (1.2 V), LDO1 (3.3 V), LDO2 (5.0 V), and BOOST (5.0 V) with PSYNC pin disabled per MFS8416AMBP3ES OTP. Use Value: Reduces gateways' external component count by integrating fail-safe reset generation, voltage supervision, and SPI-configurable sequencing - critical for OTA update reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8412AMBP7ES | Same HVQFN48EP package; BUCK1 = 1.25 V/4.5 A but uses 140 mV/µs VPRE slope and phase shift delay 3; includes VMON3/VMON4 monitoring | Optimized for radar with NXP S32R274 MCU; adds extra voltage monitors and different sequencing slot assignment | Select when S32R274 integration and extended analog monitoring are required; not drop-in due to differing OTP sequencing and ABIST configuration |
| MFS8406AMBP4ES | Same footprint; VPRE max = 5 A (vs. 10 A); BUCK1 = 1.25 V/2.6 A; LDO2 = 5.0 V/150 mA but lacks PSYNC and has reduced VMON coverage | Targeted for camera modules; lower current capability and simplified safety feature set (no FCCU2, no VMON3/VMON4) | Choose for cost-sensitive vision systems where 5 A VPRE and reduced monitoring suffice; requires layout review for current path derating |
Compared with MFS8416AMBP3ES, MFS8412AMBP7ES offers enhanced monitoring depth for S32R274-based radar, while MFS8406AMBP4ES reduces cost and complexity for camera applications - both require OTP revalidation and sequencing verification, as none are pin-to-pin or software-compatible replacements.
Availability
MFS8416AMBP3ES is available at Aetrix Electronics and suitable for automotive radar, ADAS domain controllers, vision processing units, and gateway ECUs requiring stable component supply, long-term lifecycle support, and ASIL B-certified power management.
Supply support for MFS8416AMBP3ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade power management.
The FS84 QFN48EP family - including MFS8416AMBP3ES - was designed specifically for next-generation automotive radar and ADAS systems, integrating fail-safe power delivery, deterministic sequencing, and ISO 26262-compliant monitoring in a single HVQFN48EP package.
FAQ
What is the primary application target for the MFS8416AMBP3ES?
The MFS8416AMBP3ES is specifically configured for automotive radar applications, as indicated by its ordering information entry "Radar" in Table 2. Its OTP settings - including 2.22 MHz switching, 140 mV/µs VPRE slope compensation, 250 µs turn-off delay, and Slot 0 BUCK3 sequencing - are calibrated for 77 GHz corner and imaging radar ECUs. The device powers RF front-ends, DSPs, and interface ICs while meeting ASIL B requirements per ISO 26262.
Does the MFS8416AMBP3ES support pin-to-pin replacement with other FS84 QFN48EP variants?
No, the MFS8416AMBP3ES does not support pin-to-pin replacement with other FS84 QFN48EP variants. While all devices share the HVQFN48EP package and pinout, they differ in OTP-programmed functionality - including VPRE current capability (10 A vs. 5 A), BUCK1/BUCK3 output voltages, LDO configurations, VMON enablement, and safety feature sets (e.g., FCCU2 presence). Swapping requires full OTP revalidation and sequencing verification.
What safety certifications apply to the MFS8416AMBP3ES?
The MFS8416AMBP3ES is qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C ambient) and compliant with ISO 26262:2018 up to ASIL B. It incorporates ABIST1/ABIST2, LBIST, FCCU1/FCCU2 monitoring inputs, hardware-coordinated PGOOD/RSTB/FS0B outputs, and a dedicated fail-safe state machine - all verified in the FS84 QFN48EP product data sheet Rev. 4.0.
How is voltage supervision implemented on the MFS8416AMBP3ES?
The MFS8416AMBP3ES provides five independent voltage supervision channels: VCOREMON (BUCK1 output), VDDIOMON (LDO1 output), and VMON1–VMON4 (configurable analog inputs). Each channel features programmable overvoltage (OVTH) and undervoltage (UVTH) thresholds with 25 µs OV and 15 µs UV deglitching. Supervision triggers fail-safe outputs and ABIST events without MCU intervention.
What is the role of the PSYNC pin on the MFS8416AMBP3ES?
On the MFS8416AMBP3ES, the PSYNC pin is disabled per its OTP configuration (Table 3). Unlike variants such as MFS8412AMB, this device does not support power synchronization with another FS84 or external PMIC. The pin must be externally pulled up to VBOS per Table 6, but it remains functionally inactive - simplifying design for single-SBC radar implementations.
MFS8416AMBP3ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8416AMBP3ES FAQ
1.How can I place an order for MFS8416AMBP3ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8416AMBP3ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8416AMBP3ES reliable?
The price and inventory of MFS8416AMBP3ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8416AMBP3ES is usually 5 days.
3.What payment methods are accepted for MFS8416AMBP3ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MFS8416AMBP3ES transactions.
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4.How is shipping managed for MFS8416AMBP3ES?
MFS8416AMBP3ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8416AMBP3ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8416AMBP3ES?
For technical support, including MFS8416AMBP3ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8416AMBP3ES requirements.
6.How does Aetrix verify that MFS8416AMBP3ES is sourced from the original manufacturer or authorized distributors?
All MFS8416AMBP3ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8416AMBP3ES meets industry standards.
7.What is the process for return or replacement of MFS8416AMBP3ES?
All MFS8416AMBP3ES units undergo pre-shipment inspection (PSI). If there is an issue with MFS8416AMBP3ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8416AMBP3ES part is unused and in its original packaging.
Return procedure for MFS8416AMBP3ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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