NXP Semiconductors MFS8416AMBP3ESR2
- Part No.:
- MFS8416AMBP3ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8416AMBP3ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN4
- Quantity:
- Payment:

- Shipping:

Inventory:4,760
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Product details
Overview
MFS8416AMBP3ES from NXP Semiconductors is a functionally safe, ASIL B-compliant system basis chip (SBC) designed for automotive radar applications. It integrates a 10 A peak VPRE synchronous buck controller, a 4.5 A BUCK1 core regulator (1.25 V output), a 4.5 A BUCK3 regulator (2.3 V output), a BOOST converter (5.74 V), two LDOs (3.3 V/150 mA and 5.0 V/150 mA), and fail-safe outputs - all in a HVQFN48EP package with wettable flanks.
For engineers reviewing the MFS8416AMBP3ES datasheet, MFS8416AMBP3ES pinout, MFS8416AMBP3ES application, or MFS8416AMBP3ES equivalent, this page delivers verified technical context, safety-critical power sequencing details, OTP-configured regulator settings for radar systems, and validated alternative options aligned to ISO 26262 ASIL B requirements.
Technical Context
The MFS8416AMBP3ES implements dual independent state machines: a main power management state machine handling wake-up, standby, and regulator sequencing, and a dedicated fail-safe state machine managing ABIST, voltage supervision (VCOREMON, VMON1–4), FCCU-based MCU error monitoring, and deep fail-safe auto-retry (x15). Its safety architecture supports full ASIL B partitioning per ISO 26262.
Regulator control uses SPI (32-bit with CRC) for configuration and runtime adjustment, while hardware-level safety features include programmable undervoltage/overvoltage detection (UVTH/OVTH with 15–25 µs delay), thermal shutdown coordination across all SMPS/LDOs, and fail-safe output FS0B (open-drain, active-low) with configurable assertion timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP: 4.9 V to 40 V DC - supports wide automotive battery range including cold-crank conditions |
| VPRE Output | 3.3 V fixed, 10 A peak - supplies external radar transceiver or RF front-end with force-PWM mode for low-noise operation |
| BUCK1 Output | 1.25 V @ 4.5 A peak - dedicated core supply for radar MCU with SVS capability and 2.22 MHz switching |
| BUCK3 Output | 2.3 V @ 4.5 A peak - powers radar sensor interface or high-speed ADC with slot-0 power sequencing |
| LDO1/LDO2 | 3.3 V/150 mA and 5.0 V/150 mA - provide noise-sensitive analog/IO rails with independent TSD behavior and slot-2/slot-1 sequencing |
| Safety Compliance | ISO 26262 ASIL B, AEC-Q100 Grade 1 (−40 °C to +125 °C), QM option available - certified for radar domain controller use |
| Quiescent Current | 10 µA typ in OFF mode - enables ultra-low-power sleep states for always-on radar wake-up functionality |
Pinout & Package
HVQFN48EP package (SOT619-27), 7 mm × 7 mm, 0.5 mm pitch, thermally enhanced with exposed pad (EP) connected to GND - optimized for automotive thermal cycling and EMC robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP (Pin 44) | Main power input | 40 V max DC input; requires reverse-battery protection diode; UV threshold at 4.9 V |
| BUCK1_SW (Pin 31) | Core regulator switch node | Connects to external 1 µH inductor; supports 2.22 MHz switching and thermal shutdown coordination |
| VCOREMON (Pin 15) | Core voltage monitor input | Must be directly tied to BUCK1 output for SVS; enables precise 1.25 V regulation monitoring |
| FS0B (Pin 12) | Fail-safe output | Open-drain, active-low signal asserting deep fail-safe state; internal 2 MΩ pulldown when unused |
| INTB (Pin 29) | Interrupt output | Active-low push-pull interrupt signaling fault events (TSD, UV/OV, watchdog timeout) to MCU |
| PSYNC (Pin 32) | Power sync I/O | Configurable as input or output to synchronize multiple FS84 devices or external PMICs; requires external pullup to VBOS |
| EP (Pin 49) | Exposed thermal pad | Connected internally to BUCK1/BUCK3 low-side GNDs; must be soldered to PCB ground plane for thermal compliance |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured radar-optimized power tree | Preprogrammed BUCK1 (1.25 V), BUCK3 (2.3 V), VPRE (3.3 V), BOOST (5.74 V), LDO1 (3.3 V), LDO2 (5.0 V) - eliminates external configuration resistors |
| ASIL B safety subsystem | Dual ABIST (ABIST1/ABIST2), FCCU1/FCCU2 MCU error inputs, VCOREMON/VMON1–4 supervision, and x15 deep fail-safe auto-retry - fully compliant with ISO 26262 Part 5 |
| EMC-optimized switching | 2.22 MHz fixed-frequency operation with phase-shifting (delay 0), spread-spectrum disabled, and slew-rate-controlled gate drivers - reduces radiated emissions in radar bands |
| Radar-specific power sequencing | Slot-based sequencing: BUCK1/BUCK3 start/stop in Slot 1/0, LDO1/LDO2 in Slot 2/1, enabling deterministic startup for multi-radar SoCs |
| Fail-safe output coordination | FS0B assertion synchronized with PGOOD/RSTB deassertion during fault; supports safe shutdown of radar transceivers and baseband processors |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers 77 GHz corner radar modules requiring low-noise, tightly regulated rails for RF transceivers and DSP cores. IC Role / Device Role / Timing Role: System basis chip providing VPRE (3.3 V), BUCK1 (1.25 V), BUCK3 (2.3 V), and BOOST (5.74 V) with ASIL B fail-safe monitoring. Use Value: Enables single-chip power solution meeting automotive radar EMI limits and functional safety requirements without discrete supervisors. | Use Scenario: Supplies NXP S32R274/S32R294 radar MCUs in centralized ADAS domain controllers with coordinated power-up sequencing. IC Role / Device Role / Timing Role: Integrates core, IO, analog, and boost rails with slot-based sequencing and real-time voltage supervision (VCOREMON, VMON1–4). Use Value: Reduces BOM count by replacing 6+ discrete regulators and supervisors while maintaining ISO 26262 ASIL B compliance. |
| Vision Processing Unit (VPU) Interface | Automotive Gateway with Radar Integration |
Use Scenario: Delivers clean, sequenced power to radar-Vision fusion processors (e.g., S32R45) requiring simultaneous 1.25 V core and 2.3 V interface rails. IC Role / Device Role / Timing Role: Dual SMPS (BUCK1/BUCK3) with independent current limits (4.5 A each) and soft-start (7.81 mV/µs) prevent inrush-induced voltage droop. Use Value: Ensures stable power delivery during simultaneous radar scan and camera frame capture, avoiding timing faults in sensor fusion algorithms. | Use Scenario: Used in gateway ECUs integrating radar data preprocessing with CAN FD and Ethernet communication stacks. IC Role / Device Role / Timing Role: Provides isolated LDO1 (3.3 V) and LDO2 (5.0 V) for CAN PHY and Ethernet PHY interfaces, with independent TSD behavior. Use Value: Prevents cascading failure - LDO2 shutdown during overtemperature does not affect BUCK1/BUCK3, preserving radar processing capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8412AMBP7ES | Same HVQFN48EP package; BUCK1 = 1.25 V/4.5 A, BUCK3 = 2.3 V/4.5 A, but includes PSYNC enabled and phase-shift delay 3 - optimized for dual-FS84 radar synchronization | Targeted for radar systems using NXP S32R274 MCU with dual-SBC redundancy | Select when dual-device synchronization or higher-level MCU integration (S32R274) is required; not drop-in due to PSYNC enable and different ABIST configuration |
| MFS8406AMBP4ES | Same package; VPRE = 3.3 V/10 A, BUCK1 = 1.25 V/2.6 A, BUCK3 disabled, LDO1 = 5.0 V/150 mA - lower BUCK1 current, no BUCK3 | Targeted for camera-based vision systems (mono/stereo) rather than radar | Select for vision-only applications where 2.6 A core supply suffices and BUCK3 is unnecessary; differs in OTP power tree and sequencing slots |
Compared with MFS8416AMBP3ES, MFS8412AMBP7ES adds PSYNC and MCU-specific sequencing for S32R274, while MFS8406AMBP4ES reduces BUCK1 capability and removes BUCK3 - both require OTP revalidation and are not pin-compatible replacements.
Availability
MFS8416AMBP3ES is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive gateway systems requiring stable component supply, ASIL B certification, and preconfigured OTP power trees for rapid radar system integration.
Supply support for MFS8416AMBP3ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in radar processing and functional safety ICs.
The FS84 QFN48EP product line delivers integrated, ASIL B-compliant power management for next-generation automotive radar and ADAS systems - designed to replace discrete power trees with a single, safety-certified system basis chip.
FAQ
What is the primary application target for the MFS8416AMBP3ES?
The MFS8416AMBP3ES is specifically targeted for automotive radar systems, as indicated by its ordering information table and OTP configuration - it delivers preprogrammed 3.3 V VPRE, 1.25 V BUCK1, 2.3 V BUCK3, and fail-safe supervision optimized for 77 GHz radar sensor modules and associated domain controllers.
Does the MFS8416AMBP3ES support SPI configuration during operation?
Yes, the MFS8416AMBP3ES supports full runtime SPI configuration via its 32-bit interface with CRC protection. While OTP defines baseline regulator voltages and sequencing, SPI enables dynamic adjustment of soft-start rates, fault thresholds, and power-state transitions - critical for radar system calibration and adaptive power management.
What safety certifications apply to the MFS8416AMBP3ES?
The MFS8416AMBP3ES complies with ISO 26262 up to ASIL B and is qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes dual ABIST, FCCU-based MCU monitoring, programmable voltage supervision (VCOREMON, VMON1–4), and deep fail-safe auto-retry - all verified for automotive radar safety integrity.
How is thermal performance managed on the MFS8416AMBP3ES?
The MFS8416AMBP3ES uses an HVQFN48EP package with exposed thermal pad (EP) connected to GND, achieving RθJB = 10 °C/W on a 2s6p board. Thermal shutdown (TSD) is coordinated across all regulators - BUCK1, BUCK3, BOOST, and LDOs shut down independently based on OTP-configured behavior, preventing thermal runaway in radar ECU enclosures.
Can the MFS8416AMBP3ES be used in non-radar automotive applications?
While the MFS8416AMBP3ES is optimized for radar, its ASIL B compliance, wide input range (4.9–40 V), and flexible OTP configuration allow use in other safety-critical domains like vision ECUs or gateway systems - provided the specific OTP settings (e.g., 1.25 V BUCK1, 2.3 V BUCK3) align with the target application's power requirements.
MFS8416AMBP3ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8416AMBP3ESR2 FAQ
1.How can I place an order for MFS8416AMBP3ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8416AMBP3ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8416AMBP3ESR2 reliable?
The price and inventory of MFS8416AMBP3ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8416AMBP3ESR2 is usually 5 days.
3.What payment methods are accepted for MFS8416AMBP3ESR2?
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4.How is shipping managed for MFS8416AMBP3ESR2?
MFS8416AMBP3ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8416AMBP3ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8416AMBP3ESR2?
For technical support, including MFS8416AMBP3ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8416AMBP3ESR2 requirements.
6.How does Aetrix verify that MFS8416AMBP3ESR2 is sourced from the original manufacturer or authorized distributors?
All MFS8416AMBP3ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8416AMBP3ESR2 meets industry standards.
7.What is the process for return or replacement of MFS8416AMBP3ESR2?
All MFS8416AMBP3ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MFS8416AMBP3ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8416AMBP3ESR2 part is unused and in its original packaging.
Return procedure for MFS8416AMBP3ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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