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NXP Semiconductors MFS8610BMDA0ESR2
- Part No.:
- MFS8610BMDA0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8610BMDA0ESR2.pdf
- Description:
- SAFETY SYSTEM BASIS CHIP FOR DOM
- Quantity:
- Payment:
- Shipping:
Inventory:4,342
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Product details
Overview
MFS8610BMDA0ES from NXP Semiconductors is a fail-safe system basis chip (SBC) designed for automotive domain controllers requiring ASIL D compliance, integrated power management, and functional safety monitoring. It delivers 15 A VPRE buck controller, 2.5 A integrated BUCK, 1 A BOOST, dual 400 mA LDOs, and ±1 % accuracy across ten voltage monitoring inputs. It serves as the central power and safety manager in radar and ADAS ECUs operating on 12 V battery networks.
For engineers reviewing the MFS8610BMDA0ES datasheet, MFS8610BMDA0ES pinout, MFS8610BMDA0ES application, or MFS8610BMDA0ES equivalent, key selection criteria include its 36 V max input rating, ASIL D qualification per ISO 26262, OTP-configurable power sequencing, I²C-based safety monitoring interface, and QFN48 wettable flank package for automotive thermal reliability.
Technical Context
The MFS8610BMDA0ES implements a hierarchical safety architecture with independent analog voltage supervision circuitry, logical and analog built-in self-test (LBIST/ABIST), and dedicated failure monitoring paths for MCU (FCCU1/FCCU2) and external ICs (ERRMON). Its fail-safe state machine drives PGOOD, RSTB, and FS0B outputs with latent fault detection.
It supports cascaded power-up sequencing via XFAILB synchronization and integrates BYLink-compatible power management for coordinated behavior across multiple SBCs. The device uses a 32-bit I²C interface with 8-bit CRC for configuration and watchdog communication, and includes spread spectrum, slew rate control, and manual frequency tuning to meet automotive EMC standards including IEC 61967-4 and ISO11452-4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.5 V to 36 V DC - supports full operation across 12 V automotive battery networks with reverse-battery protection diodes required on VSUP1/VSUP2. |
| VPRE Output Capability | Configurable 3.3 V–5.0 V, up to 15 A DC - enables high-current pre-regulation for downstream MCUs or PMICs using external FETs. |
| Integrated BUCK | 1.0 V–3.3 V output, 2.5 A DC - supplies core voltage to safety-critical MCUs with internal synchronous rectification. |
| BOOST Converter | 5 V–6 V output, 1 A DC - powers CAN transceivers or other 5 V peripherals without external inductors. |
| Voltage Monitoring | 10 inputs with ±1 % accuracy - monitors QM rails from non-NXP components and internal regulators for ASIL-compliant safety checking. |
| Functional Safety | ISO 26262 ASIL D compliant - includes challenger watchdog, ERRMON, FCCU, PGOOD/RSTB/FS0B safety outputs with latent fault detection. |
| Package | HPQFN48eP (SOT619-26) with wettable flanks - provides enhanced thermal dissipation (RθJB = 10 °C/W in 2s6p layout) and automated optical inspection capability. |
| Ambient Temperature | −40 °C to +125 °C - qualified per AEC-Q100 Grade 1 for under-hood automotive deployment. |
Pinout & Package
Package: HPQFN48eP (48-pin plastic thermally enhanced very thin quad flat no-lead package with wettable flanks and exposed pad). Exposed pad must be soldered to PCB ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power supply inputs | Accept 36 V max DC input; require external reverse-battery protection diodes in series for automotive robustness. |
| VPRE-related pins (PRE_SW, PRE_GHS, PRE_GLS, PRE_FB, PRE_CSP, PRE_CSN, PRE_COMP, PRE_BOOT) | High-voltage buck controller interface | Enable external 15 A synchronous buck stage with current sensing, feedback, gate drive, and bootstrap support. |
| BUCK_SW / BUCK_IN / BUCK_FB | Integrated low-voltage buck converter interface | Support 2.5 A regulated output; BUCK_SW is switching node, BUCK_IN is input, BUCK_FB sets output voltage via resistor divider. |
| LDO1 / LDO2 | Linear regulator outputs | Each delivers up to 400 mA; LDO1 supports load switch capability for controlled peripheral power-up/down. |
| VMON0_I2C to VMON9_RES | Voltage monitoring inputs | 10 dedicated analog inputs - VMON0_I2C monitors internal rails; VMON1–3 use DAC reference; VMON4–9 use resistor bridges for external rail supervision. |
| FCCU1 / FCCU2 / ERRMON / XFAILB / INTB | Safety and synchronization signals | FCCU inputs monitor MCU PWM failure; ERRMON detects external IC faults; XFAILB enables leader/follower sequencing; INTB signals status events to MCU. |
| PGOOD / RSTB / FS0B | Fail-safe outputs | Open-drain active-low outputs - PGOOD indicates stable power; RSTB resets MCU; FS0B asserts safe state during fault conditions. |
| I²C (SDA/SCL) | Configuration and monitoring interface | 32-bit addressable interface with 8-bit CRC ensures reliable register access and watchdog handshake in noisy automotive environments. |
Key Features
| Feature | Design Value |
|---|---|
| BYLink Synchronization | Enables cascaded SBCs to behave as one system with synchronized power-up sequencing and safety state coordination across domain controllers. |
| OTP Configuration | Factory-programmed A0 OTP code enables fixed feature set (FS8613 variant); supports ASIL D watchdog challenger mode and full 10-VMON capability. |
| e-Fuse Protection | Hardware-level shutdown of VPRE stage upon overcurrent or fault, preventing damage to downstream systems in hazardous events. |
| EMC Optimization | Integrated spread spectrum, slew rate control, and manual frequency tuning meet IEC 61967-4 (conducted emission), ISO11452-4 (radiated immunity), and FMC1278 EMI requirements. |
| Analog Multiplexer (AMUX) | Single-pin analog output multiplexing of all monitored voltages to MCU ADC, reducing routing complexity and pin count in safety-critical designs. |
| Thermal Management | Exposed pad package with RθJB = 10 °C/W (2s6p) enables high-power operation at 125 °C ambient without derating in compact ECU layouts. |
Applications
| Radar ECU Power Management | ADAS Domain Controller |
|---|---|
Use Scenario: High-reliability power delivery and safety monitoring for 77 GHz radar processing units in front-end sensor modules. IC Role / Device Role / Timing Role: Central SBC providing VPRE (5 V @ 15 A) for RF SoC, BUCK (1.2 V @ 2.5 A) for radar DSP, and real-time voltage supervision of all supply rails. Use Value: Enables ASIL D-compliant radar ECU design with single-chip power + safety integration, eliminating discrete supervisors and reducing BOM count by ≥40 %. | Use Scenario: Consolidated power and safety management for zonal or central domain controllers integrating camera, radar, and vehicle motion processing. IC Role / Device Role / Timing Role: Fail-safe system basis chip coordinating multi-rail sequencing, MCU reset timing (10 ms RSTB delay), and inter-SBC synchronization via XFAILB for deterministic boot. Use Value: Reduces development time for ISO 26262-compliant domain controllers by providing pre-validated safety mechanisms and BYLink interoperability with NXP's scalable SBC portfolio. |
| Electric Power Steering (EPS) ECU | Commercial Vehicle ADAS |
Use Scenario: Safety-critical power regulation and fault response in EPS motor control units operating on 12 V battery with high transient immunity requirements. IC Role / Device Role / Timing Role: Supplies isolated 5 V (BOOST) for CAN FD transceivers, 3.3 V (LDO1) for microcontroller I/O, and monitors motor driver supply rails via VMONx_RES inputs. Use Value: Meets stringent EPS functional safety requirements through hardware-enforced fail-safe outputs (FS0B), e-fuse shutdown, and dual watchdog monitoring (FCCU1/FCCU2). | Use Scenario: Robust power management for ADAS systems in trucks and buses where 12 V network voltage can dip below 6 V during cranking. IC Role / Device Role / Timing Role: Maintains operation down to 4.5 V battery voltage with VPRE = 3.3 V; supports wake-up via WAKE1/WAKE2 with battery-sensing capability. Use Value: Ensures uninterrupted ADAS functionality during cold-cranking events, meeting OEM requirements for commercial vehicle safety system uptime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8613BMDA0ES | Same package and ASIL D qualification, but adds integrated LDO2 and full 10-VMON support enabled by OTP; differs only in factory programming. | Supports additional LDO2 output and full voltage monitoring capability out-of-box; suitable when both LDOs and all 10 VMONs are required. | Select MFS8613BMDA0ES if LDO2 usage and full VMON count are needed; MFS8610BMDA0ES is functionally identical except for OTP-limited VMON count (4) and disabled LDO2. |
| FS8526MBA0ES | ASIL B-rated predecessor with lower 24 V input rating (60 V max), no BYLink, reduced VMON count (6), and no BOOST converter. | Targeted at legacy ASIL B domain controllers without radar-level power demands or cascaded SBC requirements. | Choose FS8526MBA0ES only for cost-sensitive ASIL B designs lacking need for BOOST, BYLink, or ASIL D certification; not a drop-in replacement. |
Compared with MFS8610BMDA0ES, MFS8613BMDA0ES offers identical silicon and package but unlocks additional LDO2 and VMON resources via OTP, while FS8526MBA0ES lacks ASIL D compliance, BOOST, BYLink, and failsafe scalability-making it unsuitable for new radar or zonal architecture designs.
Availability
MFS8610BMDA0ES is available at Aetrix Electronics and suitable for automotive radar ECUs, ADAS domain controllers, electric power steering systems, and commercial vehicle safety modules requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for MFS8610BMDA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and power management ICs.
The FS86 family-including MFS8610BMDA0ES-is designed specifically for next-generation automotive domain controllers, delivering scalable ASIL B-to-D power and safety integration to accelerate development of radar, ADAS, and vehicle electrification systems.
FAQ
What is the maximum input voltage rating for MFS8610BMDA0ES?
MFS8610BMDA0ES is rated for a maximum input voltage of 36 V DC on VSUP1 and VSUP2 pins, making it suitable for 12 V automotive battery networks. This rating complies with AEC-Q100 stress testing and includes built-in protection against transients up to 36 V, with external reverse-battery diodes required per datasheet guidance.
Does MFS8610BMDA0ES support ASIL D compliance?
Yes, MFS8610BMDA0ES is developed in compliance with ISO 26262 and qualified per AEC-Q100 Grade 1 for ASIL D applications. It includes challenger watchdog monitoring, dual FCCU inputs, ERRMON, LBIST/ABIST, and safety outputs (PGOOD, RSTB, FS0B) with latent fault detection-all verified in the FS8600_SDS Rev. 3.0 documentation.
What power rails does MFS8610BMDA0ES generate internally?
MFS8610BMDA0ES generates an integrated 2.5 A BUCK (1.0–3.3 V), a 1 A BOOST (5–6 V), and two 400 mA LDOs (LDO1: 1.5–5.0 V; LDO2: 1.1–5.0 V). The 15 A VPRE buck stage is external-FET-based and configurable from 3.3 V to 5.0 V. All regulators support programmable sequencing and monitoring via I²C.
How many voltage monitoring inputs does MFS8610BMDA0ES support?
MFS8610BMDA0ES supports up to 10 voltage monitoring inputs (VMON0–VMON9), with ±1 % accuracy. VMON0_I2C monitors internal rails; VMON1–VMON3 use DAC reference; VMON4–VMON9 use resistor bridge inputs. For MFS8610BMDA0ES, the OTP A0 configuration enables four VMON inputs by default, expandable via reprogramming.
What package type is used for MFS8610BMDA0ES?
MFS8610BMDA0ES uses the HPQFN48eP package (SOT619-26): a 48-pin plastic thermally enhanced very thin quad flat no-lead package with wettable flanks and an exposed thermal pad. The pad must be soldered to PCB ground for optimal thermal performance (RθJB = 10 °C/W in 2s6p layout).
Can MFS8610BMDA0ES synchronize power sequencing with other SBCs?
Yes, MFS8610BMDA0ES supports BYLink synchronization via the XFAILB pin, enabling leader/follower behavior with other NXP SBCs (e.g., FS86xx or FS85xx devices). This allows cascaded systems to coordinate power-up sequencing, safety state transitions, and fault propagation as a unified platform.
MFS8610BMDA0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Camera
- Current - Supply:
- -
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8610BMDA0ESR2 FAQ
1.How can I place an order for MFS8610BMDA0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8610BMDA0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8610BMDA0ESR2 reliable?
The price and inventory of MFS8610BMDA0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8610BMDA0ESR2 is usually 5 days.
3.What payment methods are accepted for MFS8610BMDA0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MFS8610BMDA0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MFS8610BMDA0ESR2?
MFS8610BMDA0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8610BMDA0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8610BMDA0ESR2?
For technical support, including MFS8610BMDA0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8610BMDA0ESR2 requirements.
6.How does Aetrix verify that MFS8610BMDA0ESR2 is sourced from the original manufacturer or authorized distributors?
All MFS8610BMDA0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8610BMDA0ESR2 meets industry standards.
7.What is the process for return or replacement of MFS8610BMDA0ESR2?
All MFS8610BMDA0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MFS8610BMDA0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8610BMDA0ESR2 part is unused and in its original packaging.
Return procedure for MFS8610BMDA0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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