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NXP Semiconductors MFS8620BMDA0ESR2
- Part No.:
- MFS8620BMDA0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8620BMDA0ESR2.pdf
- Description:
- SAFETY SYSTEM BASIS CHIP FOR DOM
- Quantity:
- Payment:
- Shipping:
Inventory:1,501
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Product details
Overview
MFS8620BMDA0ES from NXP Semiconductors is a fail-safe system basis chip (SBC) designed for ASIL D automotive domain controllers, integrating a 15 A high-voltage buck controller (VPRE), 1 A boost converter (BOOST), 2.5 A low-voltage buck (BUCK), two 400 mA LDOs (LDO1/LDO2), and ten ±1 % accurate voltage monitors. It supports 36 V max input for 12 V battery networks and delivers synchronized power sequencing via XFAILB for radar and ADAS ECUs.
For engineers reviewing the MFS8620BMDA0ES datasheet, MFS8620BMDA0ES pinout, MFS8620BMDA0ES application, or MFS8620BMDA0ES equivalent, this page provides verified functional safety architecture, I²C-configurable regulator settings, fail-safe outputs (PGOOD/RSTB/FS0B), and thermal performance data for production-grade automotive power design.
Technical Context
The MFS8620BMDA0ES implements a leader/follower power-up sequencing architecture using the XFAILB pin to coordinate cascaded SBCs as a single synchronized system. Its fail-safe state machine integrates LBIST/ABIST, dedicated MCU failure monitoring (FCCU1/FCCU2), and external IC error detection (ERRMON) with latent fault detection on PGOOD, RSTB, and FS0B outputs.
It features a 32-bit I²C interface with 8-bit CRC for configuration and watchdog monitoring, spread spectrum and slew rate control for EMC compliance, and OTP-programmable functionality including FIN/VMON9_RES pin multiplexing. The device operates across −40 °C to 125 °C and meets ISO 26262 ASIL D requirements per AEC-Q100 Grade 1 qualification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | −0.3 V to 36 V DC on VSUP1/VSUP2 - supports 12 V automotive battery networks with reverse-battery protection diode requirement. |
| VPRE Output Capability | Configurable 3.3 V–5.0 V, up to 15 A DC - enables high-power pre-regulation for downstream MCUs and PMICs in domain controllers. |
| BOOST Output | 5 V–6 V, up to 1 A DC - powers CAN transceivers or isolated interfaces without external boost circuitry. |
| BUCK Output | 1.0 V–3.3 V, up to 2.5 A DC - supplies core voltage to automotive MCUs with integrated synchronous FETs. |
| LDO1/LDO2 Current | Each rated 400 mA DC - supports I/O rails and peripherals with load switch capability (LDO1) and medium-voltage flexibility (LDO2). |
| Voltage Monitoring | 10 inputs with ±1 % accuracy - enables QM rail supervision of non-NXP components and full-system safety coverage. |
| Thermal Resistance | RθJA = 23 °C/W (2s6p layout) - ensures stable operation at 150 °C junction temperature under sustained 15 A load. |
| Fail-Safe Outputs | PGOOD, RSTB, FS0B - all active-low open-drain with latent fault detection, enabling safe system shutdown and reset coordination. |
Pinout & Package
Package: HPQFN48eP (48-pin plastic thermally enhanced very thin quad flat package with wettable flanks and exposed pad). Exposed pad must be connected to GND for optimal thermal performance (RθJC_BOT = 1 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power supply inputs | Accept 36 V max DC input; require external reverse-battery protection diodes in series per specification. |
| VPRE-related pins (PRE_SW, PRE_GHS, PRE_GLS, PRE_FB, PRE_CSP, PRE_CSN, PRE_COMP, PRE_BOOT) | High-voltage buck controller interface | Drive external high-side/low-side FETs; support current sensing, feedback, compensation, and bootstrap for 15 A output. |
| BUCK_SW / BUCK_IN / BUCK_FB | Integrated low-voltage buck converter interface | Switching node, input supply, and feedback path for 2.5 A synchronous buck regulating 1.0–3.3 V outputs. |
| LDO1 / LDO2 | Linear regulator outputs | 400 mA configurable outputs; LDO1 includes load switch capability for controlled peripheral power-up/down. |
| VMON0_I2C to VMON9_RES | Voltage monitoring inputs | 10 analog inputs supporting ±1 % accurate monitoring of internal/external rails; VMON0_I2C also supplies I²C/INTB/FCCU/ERRMON logic. |
| XFAILB | Power synchronization I/O | Enables leader/follower sequencing with other NXP low-voltage PMICs to synchronize startup/shutdown across multi-chip power systems. |
| PGOOD / RSTB / FS0B | Fail-safe outputs | Active-low open-drain signals with built-in latent fault detection; used for system reset, safety state assertion, and coordinated fail-safe shutdown. |
| I²C (SDA/SCL) | Configuration and monitoring interface | 32-bit addressable bus with 8-bit CRC; supports OTP programming, regulator configuration, watchdog monitoring, and AMUX parameter selection. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL D Functional Safety Architecture | Includes independent voltage monitoring, LBIST/ABIST, challenger watchdog (FCCU), ERRMON, and fail-safe outputs with latent fault detection. |
| Scalable Power Management | Supports cascaded SBC/PMIC systems via XFAILB synchronization, enabling unified power sequencing across domain controller subsystems. |
| EMC-Optimized Switching Regulators | Spread spectrum modulation, slew rate control, and manual frequency tuning reduce conducted/radiated emissions to meet IEC 61967-4, ISO11452-4, and FMC1278 standards. |
| OTP-Programmable Configuration | Enables pin multiplexing (e.g., FIN/VMON9_RES), watchdog mode selection (simple/challenger), and feature enablement without hardware change. |
| Thermally Enhanced Package | HPQFN48eP with wettable flanks and exposed pad achieves RθJB = 10 °C/W (2s6p), critical for sustained 15 A VPRE operation in compact ECU layouts. |
| Low-Power OFF Mode | 10 µA typical sleep current enables always-on wake-up capability while meeting automotive quiescent power budgets. |
Applications
| Radar ECU Power Management | ADAS Domain Controller |
|---|---|
Use Scenario: Powers 77 GHz radar SoC, CAN transceiver, and sensor interface in front-end radar module requiring tight voltage tolerances and fail-safe reset coordination. IC Role / Device Role / Timing Role: Primary SBC providing VPRE (5 V @ 12 A), BOOST (5.5 V @ 0.8 A), BUCK (1.2 V @ 2.2 A), and LDOs; manages power sequencing and safety state transitions. Use Value: ±1 % voltage monitoring ensures radar SoC supply integrity; PGOOD/RSTB/FS0B outputs enforce deterministic fail-safe behavior during overvoltage or thermal faults. |
Use Scenario: Centralized power management for zonal domain controller hosting multiple MCUs, Ethernet switches, and PCIe endpoints in next-gen vehicle architectures. IC Role / Device Role / Timing Role: Leader SBC coordinating cascaded low-voltage PMICs via XFAILB; supplies core, I/O, and interface rails with synchronized startup and fault propagation. Use Value: Enables single-point safety configuration and unified diagnostics across distributed power stages, reducing system-level validation effort for ASIL D compliance. |
| Electrification Control Unit | Commercial Vehicle 24 V Network |
Use Scenario: Manages power for battery management system (BMS) gateway MCU, isolated CAN FD, and HV contactor drivers in 48 V mild-hybrid applications. IC Role / Device Role / Timing Role: Fail-safe SBC delivering regulated rails (VPRE=4.2 V, BUCK=3.3 V, LDO2=2.5 V) and monitoring auxiliary 12 V QM supplies from third-party regulators. Use Value: Ten VMON inputs allow supervision of external PMIC outputs, extending safety coverage beyond NXP silicon and satisfying ISO 26262 decomposition requirements. |
Use Scenario: Powers infotainment head unit and ADAS camera ECU in truck/bus platforms with 24 V battery network and 36 V load-dump tolerance. IC Role / Device Role / Timing Role: High-reliability SBC operating at 36 V max input; uses WAKE1/WAKE2 for ignition-sense and battery-voltage-based wake events. Use Value: 10 µA OFF-mode current and −40 °C to 125 °C operation ensure robustness in extended temperature environments; wettable flank QFN aids automated optical inspection (AOI) in high-volume manufacturing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8623BMDA0ES | Includes integrated LDO2 and ERRMON support; same 36 V input rating and ASIL D qualification. | Required where external IC failure monitoring (ERRMON) and dual-LDO redundancy are mandatory for safety case. | Select MFS8623BMDA0ES when ERRMON input and full LDO2 functionality are needed; MFS8620BMDA0ES omits ERRMON and LDO2 per OTP configuration. |
| MFS8633BMDA0ES | Supports both 12 V and 24 V networks (36 V/60 V dual rating); adds FIN pin for frequency synchronization. | Suitable for mixed-voltage platforms requiring flexible input range and precise clock-domain alignment across power stages. | Choose MFS8633BMDA0ES for designs needing dual-network compatibility or deterministic switching frequency control via FIN; MFS8620BMDA0ES is fixed to 12 V network only. |
Compared with MFS8620BMDA0ES, MFS8623BMDA0ES adds ERRMON and LDO2 for enhanced fault coverage, while MFS8633BMDA0ES extends input voltage range and adds FIN for cross-domain timing alignment-both retain pin-to-pin compatibility but differ in OTP-enabled features and safety scope.
Availability
MFS8620BMDA0ES is available at Aetrix Electronics and suitable for automotive radar modules, ADAS domain controllers, and electrification control units requiring stable component supply, ASIL D functional safety certification, and long-term automotive lifecycle support.
Supply support for MFS8620BMDA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive functional safety and radar processing.
The MFS8620BMDA0ES belongs to the FS86 family of fail-safe system basis chips, engineered to deliver scalable, synchronized, and ASIL-certified power management for next-generation automotive domain controllers and zonal architectures.
FAQ
What is the maximum input voltage rating for MFS8620BMDA0ES?
The MFS8620BMDA0ES is rated for a maximum DC input voltage of 36 V on VSUP1 and VSUP2 pins, making it suitable for 12 V automotive battery networks including load-dump conditions. External reverse-battery protection diodes are mandatory per the datasheet specification.
Does MFS8620BMDA0ES support ASIL D compliance?
Yes, MFS8620BMDA0ES is developed in compliance with ISO 26262 and qualified to AEC-Q100 Grade 1 (−40 °C to 125 °C), supporting ASIL D safety goals through integrated LBIST/ABIST, challenger watchdog (FCCU), ERRMON, and fail-safe outputs with latent fault detection.
How many voltage monitoring inputs does MFS8620BMDA0ES provide?
MFS8620BMDA0ES provides ten voltage monitoring inputs (VMON0_I2C through VMON9_RES) with ±1 % accuracy, enabling supervision of internal regulators and external QM rails from non-NXP components in safety-critical automotive systems.
What package type is used for MFS8620BMDA0ES?
MFS8620BMDA0ES uses the HPQFN48eP package: a 48-pin plastic thermally enhanced very thin quad flat package with wettable flanks and an exposed pad. The exposed pad must be soldered to GND for optimal thermal performance (RθJC_BOT = 1 °C/W).
Can MFS8620BMDA0ES be used in 24 V battery network applications?
No, MFS8620BMDA0ES is specifically configured for 12 V battery networks with a 36 V maximum input rating. For 24 V networks requiring 60 V max input, use MFS8603BMDA0ES or MFS8613BMDA0ES variants from the same FS86 family.
What is the role of the XFAILB pin on MFS8620BMDA0ES?
The XFAILB pin on MFS8620BMDA0ES enables power synchronization between cascaded SBCs and PMICs, allowing them to behave as a single coordinated system during power-up, power-down, and fail-safe transitions-critical for domain controller scalability and deterministic safety behavior.
MFS8620BMDA0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Camera
- Current - Supply:
- -
- Voltage - Supply:
- 36V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8620BMDA0ESR2 FAQ
1.How can I place an order for MFS8620BMDA0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8620BMDA0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8620BMDA0ESR2 reliable?
The price and inventory of MFS8620BMDA0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8620BMDA0ESR2 is usually 5 days.
3.What payment methods are accepted for MFS8620BMDA0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MFS8620BMDA0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MFS8620BMDA0ESR2?
MFS8620BMDA0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8620BMDA0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8620BMDA0ESR2?
For technical support, including MFS8620BMDA0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8620BMDA0ESR2 requirements.
6.How does Aetrix verify that MFS8620BMDA0ESR2 is sourced from the original manufacturer or authorized distributors?
All MFS8620BMDA0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8620BMDA0ESR2 meets industry standards.
7.What is the process for return or replacement of MFS8620BMDA0ESR2?
All MFS8620BMDA0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MFS8620BMDA0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8620BMDA0ESR2 part is unused and in its original packaging.
Return procedure for MFS8620BMDA0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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