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NXP Semiconductors MFS8623BMBA0ESR2
- Part No.:
- MFS8623BMBA0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MFS8623BMBA0ESR2.pdf
- Description:
- SAFETY SYSTEM BASIS CHIP FOR DOM
- Quantity:
- Payment:
- Shipping:
Inventory:2,837
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Product details
Overview
MFS8623BMBA0ES from NXP Semiconductors is a fail-safe system basis chip (SBC) designed for 12 V automotive battery networks, integrating a high-voltage buck controller (VPRE), low-voltage boost converter (BOOST), synchronous buck regulator (BUCK), two LDOs (LDO1/LDO2), and ten-channel voltage monitoring with ±1 % accuracy. It delivers ASIL B functional safety compliance, supports wake-up detection on two pins, and enables power sequencing via XFAILB for domain controllers in ADAS and radar systems.
For engineers reviewing the MFS8623BMBA0ES datasheet, MFS8623BMBA0ES pinout, MFS8623BMBA0ES application, or MFS8623BMBA0ES equivalent, this page provides verified technical context, exact pin functions, real-world use cases in electrified vehicle subsystems, and validated alternative options aligned with ISO 26262 and AEC-Q100 Grade 1 requirements.
Technical Context
The MFS8623BMBA0ES implements a leader/follower power-up sequencing architecture synchronized through the XFAILB pin, enabling cascaded SBC/PMIC coordination as a single safe power domain. Its integrated analog multiplexer (AMUX) routes up to ten monitored voltages-including internal rails (VCORE, VPRE, VBOOST) and external PMIC outputs-to a single MCU ADC input under I2C control.
It features dual watchdog monitoring: simple watchdog via I2C interface and challenger watchdog (FCCU1/FCCU2) for MCU hardware failure detection, plus ERRMON input for external IC fault reporting. Safety outputs (PGOOD, RSTB, FS0B) incorporate latent fault detection and open-drain active-low drive capability compatible with 3.3 V logic interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.5 V to 36 V DC - supports full operation across 12 V automotive battery network transients including cold-crank and load-dump conditions. |
| VPRE Output Capability | Configurable 3.3 V–5.0 V, up to 15 A DC - enables high-current pre-regulation for downstream MCUs or FPGAs using external high-side/low-side MOSFETs. |
| BOOST Output | 5.0 V–6.0 V, up to 1 A DC - powers CAN transceivers or sensor interfaces requiring stable >5 V supply independent of main rail. |
| BUCK Output | 1.0 V–3.3 V, up to 2.5 A DC - supplies core voltage to automotive-grade microcontrollers with tight regulation and fast transient response. |
| LDO1/LDO2 Current | Each rated 400 mA DC - powers I/O banks, peripherals, or communication interfaces with configurable output voltage (LDO1: 1.5–5.0 V; LDO2: 1.1–5.0 V). |
| Voltage Monitoring | 10 inputs with ±1 % accuracy - monitors QM rails from non-NXP components (e.g., external PMICs, sensors) to extend system-level safety coverage. |
| Functional Safety | ASIL B compliant per ISO 26262 - includes LBIST/ABIST, dedicated error monitoring (ERRMON), and fail-safe outputs with latent fault detection. |
| Package | HPQFN48eP (SOT619-26), wettable flank - 7 mm × 7 mm × 0.85 mm footprint with exposed pad for thermal management; RθJA = 23 °C/W (2s6p). |
Pinout & Package
Package: HPQFN48eP (SOT619-26), 7 mm × 7 mm × 0.85 mm plastic thermally enhanced quad flat no-lead package with wettable flanks and exposed thermal pad connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power supply inputs | Accept 36 V max DC input; require external reverse-battery protection diodes in series for automotive robustness. |
| VPRE-related pins (PRE_SW, PRE_GHS, PRE_GLS, PRE_FB, PRE_CSP, PRE_CSN, PRE_COMP, PRE_BOOT) | High-voltage buck controller interface | Drive external high-side/low-side MOSFETs; support current sensing, feedback, gate drive, and bootstrap biasing for 15 A VPRE regulation. |
| BUCK_SW / BUCK_IN / BUCK_FB | Integrated synchronous buck regulator node | Switching node (BUCK_SW), input supply (BUCK_IN), and feedback (BUCK_FB) enable direct connection to inductor, input capacitor, and resistor divider for 2.5 A VCORE generation. |
| LDO1 / LDO2 | Linear regulator outputs | Provide independently configurable, low-noise 400 mA outputs for MCU I/O, CAN PHY, or camera sensor biasing. |
| VMON0_I2C to VMON9_RES | Voltage monitoring inputs | Support ten analog inputs-five DAC-based (VMON1–3), four resistor-bridge (VMON4–9), one I2C-supplied (VMON0)-for ±1 % accurate rail supervision. |
| XFAILB | Power synchronization I/O | Enables leader/follower sequencing with other NXP SBCs/PMICs; asserts fail-safe state if synchronization fails or timeout occurs. |
| PGOOD / RSTB / FS0B | Fail-safe outputs | Open-drain active-low signals indicating power health (PGOOD), asserting MCU reset (RSTB), and signaling system-level safe state (FS0B). |
| FCCU1 / FCCU2 / ERRMON | MCU and external IC monitoring inputs | Accept PWM challenge signals from MCU (FCCU1/FCCU2) and fault flags from external ICs (ERRMON) to trigger fail-safe transitions. |
Key Features
| Feature | Design Value |
|---|---|
| BYLink-compatible synchronization | Enables multi-chip power domains to behave as one coordinated unit with shared safety state and sequenced power-up/down timing. |
| 10-channel ±1 % voltage monitoring | Extends safety coverage beyond internal regulators to include QM rails from third-party PMICs, sensors, or transceivers without additional supervisory ICs. |
| Configurable 15 A VPRE controller | Reduces bill-of-materials by eliminating discrete HV buck controllers while supporting e-fuse shutdown during overcurrent events. |
| ASIL B-certified safety architecture | Includes LBIST/ABIST, dual watchdog modes (simple/challenger), and dedicated error monitoring paths meeting ISO 26262 requirements for domain controllers. |
| Wettable flank QFN48 package | Enables automated optical inspection (AOI) of solder joints and improves thermal performance with RθJB = 10 °C/W (2s6p) for high-power automotive applications. |
| I²C with 8-bit CRC | Ensures robust configuration and status reporting in noisy automotive environments; supports OTP programming and runtime register access. |
Applications
| ADAS Domain Controller | Radar Signal Processing Unit |
|---|---|
|
Use Scenario: Centralized power management for multi-core SoC, CAN FD gateway, and Ethernet AVB switch in L2+ autonomous driving ECU. IC Role / Device Role / Timing Role: System basis chip providing primary VPRE (5.0 V/10 A), VCORE (1.2 V/2.5 A), VIO (3.3 V/400 mA), and 10-rail monitoring for ASIL B decomposition. Use Value: Eliminates need for discrete supervisors and reduces PCB area by 35 % versus discrete PMIC + monitor solution while maintaining ±1 % rail accuracy. |
Use Scenario: Powering 77 GHz radar transceiver, DSP, and RF front-end in corner radar module with strict EMI and thermal constraints. IC Role / Device Role / Timing Role: Supplies BOOST (5.5 V/1 A) to radar PHY, BUCK (1.1 V/2.5 A) to DSP core, and monitors VDDA/VDDD rails with VMON1–VMON4 DAC inputs. Use Value: Spread-spectrum switching and slew-rate control reduce conducted emissions below CISPR 25 Class 5 limits without added filtering components. |
| 12 V Battery Network ECU | Camera Vision Processing Module |
|
Use Scenario: Body control module managing door locks, lighting, and HVAC actuators with wake-on-LIN capability and low sleep current. IC Role / Device Role / Timing Role: Provides VPRE (3.3 V/15 A) for main MCU, LDO2 (5.0 V/400 mA) for LIN transceiver, and WAKE1/WAKE2 inputs with battery-sensing capability. Use Value: Achieves 10 µA typical OFF-mode current enabling always-on functionality while meeting UNECE R10 EMI immunity requirements. |
Use Scenario: Front-facing mono camera ECU powering image sensor, ISP, and MIPI CSI-2 serializer in driver monitoring system. IC Role / Device Role / Timing Role: Generates VCORE (1.0 V/2.5 A) for ISP, LDO1 (2.8 V/400 mA) for sensor bias, and monitors VDDIO (1.8 V) via VMON5_RES resistor bridge. Use Value: Integrated AMUX allows all 10 monitored rails to share one MCU ADC channel, reducing pin count and simplifying firmware calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MFS8633BMBA0ES | Supports 12 V network (36 V max) with full feature set: BOOST, BUCK, both LDOs, and ERRMON enabled; OTP A0 unprogrammed. | Enables full power tree including external IC fault reporting (ERRMON) and dual-LDO support for complex vision/radar ECUs. | Select when ERRMON input and second LDO are required for extended safety monitoring or peripheral power isolation. |
| MFS8622BMBA0ES | Same 12 V network rating and VPRE/BOOST/BUCK/LDO1/LDO2 integration but lacks ERRMON pin; shares identical pinout and OTP A0 base configuration. | Suitable for cost-optimized ADAS ECUs where external IC failure monitoring is handled externally or omitted. | Choose for reduced BOM cost where ERRMON functionality is not needed, retaining full power regulation and ASIL B compliance. |
Compared with MFS8623BMBA0ES, MFS8633BMBA0ES adds ERRMON and full LDO support for higher-integration domain controllers, while MFS8622BMBA0ES removes ERRMON to lower system cost-both maintain pin-to-pin compatibility and identical thermal/safety qualification.
Availability
MFS8623BMBA0ES is available at Aetrix Electronics and suitable for automotive domain controllers, radar signal processing units, and 12 V battery network ECUs requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for MFS8623BMBA0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FS86 family-including MFS8623BMBA0ES-is engineered for ASIL B–D automotive domain controllers, delivering integrated power regulation, voltage monitoring, and fail-safe control in a single HPQFN48eP package compliant with ISO 26262 and AEC-Q100.
FAQ
What is the maximum input voltage rating for MFS8623BMBA0ES?
MFS8623BMBA0ES is rated for 12 V automotive battery networks with a maximum DC input voltage of 36 V on VSUP1 and VSUP2 pins. This rating covers worst-case load-dump transients per ISO 7637-2 Pulse 5a, and external reverse-battery protection diodes are mandatory on both supply inputs.
Does MFS8623BMBA0ES support fail-safe power sequencing with other NXP SBCs?
Yes, MFS8623BMBA0ES supports synchronized power sequencing via the XFAILB pin as part of the BYLink system power platform. It can operate as leader or follower in cascaded configurations with compatible NXP SBCs like MFS8633BMBA0ES, ensuring coordinated power-up/down and unified fail-safe state propagation across multi-chip domains.
How many voltage rails can MFS8623BMBA0ES monitor, and what is the accuracy?
MFS8623BMBA0ES supports monitoring of up to ten voltage rails with ±1 % accuracy across its VMON0_I2C to VMON9_RES inputs. Five channels accept DAC-based inputs (VMON1–VMON3, VMON0_I2C), four use resistor-bridge dividers (VMON4–VMON7, VMON8–VMON9), and one is dedicated to I2C-supplied reference (VMON0_I2C).
What safety certifications apply to MFS8623BMBA0ES?
MFS8623BMBA0ES is developed in compliance with ISO 26262 up to ASIL B and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C ambient). It includes LBIST/ABIST, dual watchdog modes (FCCU1/FCCU2), ERRMON input, and fail-safe outputs (PGOOD, RSTB, FS0B) with latent fault detection mechanisms.
Is MFS8623BMBA0ES pin-compatible with other FS86 family members?
Yes, MFS8623BMBA0ES uses the HPQFN48eP package and shares identical pinout with all FS86x3 variants (e.g., MFS8603BMBA0ES, MFS8613BMBA0ES, MFS8633BMBA0ES). Pin functions-including VPRE, BOOST, BUCK, LDO1, LDO2, VMONx, XFAILB, and safety outputs-are fully consistent across the family for drop-in replacement within same network voltage class.
Can MFS8623BMBA0ES be used in 24 V battery network applications?
No, MFS8623BMBA0ES is specifically designed for 12 V battery networks with a 36 V maximum input rating. For 24 V networks (60 V max), NXP specifies MFS8603BMBA0ES or MFS8613BMBA0ES-these variants share the same core architecture but are qualified for higher voltage stress and thermal conditions.
MFS8623BMBA0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Camera
- Current - Supply:
- -
- Voltage - Supply:
- 36V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-HVQFN (7x7)
MFS8623BMBA0ESR2 FAQ
1.How can I place an order for MFS8623BMBA0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MFS8623BMBA0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MFS8623BMBA0ESR2 reliable?
The price and inventory of MFS8623BMBA0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MFS8623BMBA0ESR2 is usually 5 days.
3.What payment methods are accepted for MFS8623BMBA0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MFS8623BMBA0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MFS8623BMBA0ESR2?
MFS8623BMBA0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MFS8623BMBA0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MFS8623BMBA0ESR2?
For technical support, including MFS8623BMBA0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MFS8623BMBA0ESR2 requirements.
6.How does Aetrix verify that MFS8623BMBA0ESR2 is sourced from the original manufacturer or authorized distributors?
All MFS8623BMBA0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MFS8623BMBA0ESR2 meets industry standards.
7.What is the process for return or replacement of MFS8623BMBA0ESR2?
All MFS8623BMBA0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MFS8623BMBA0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MFS8623BMBA0ESR2 part is unused and in its original packaging.
Return procedure for MFS8623BMBA0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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