NXP Semiconductors MM908E622ACPEK

Overview

MM908E622ACPEK from NXP Semiconductors (formerly Freescale) is an automotive-grade integrated system-on-package combining a M68HC908EY16 MCU with SMARTMOS analog driver die. It delivers four half-bridge outputs (HB1–HB4), three high-side switches (HS1–HS3), EC glass control, LIN physical layer, 10-bit ADC, and 16 KB flash - all in a single 54-pin SOICW-EP package for high-end mirror actuation.

For engineers reviewing the MM908E622ACPEK datasheet, MM908E622ACPEK pinout, MM908E622ACPEK application, or MM908E622ACPEK equivalent, key selection criteria include R_DS(ON) values per output channel (e.g., 185 mΩ HS1, 275 mΩ HB3), LIN compliance per ISO 17987, embedded watchdog supervision, and diagnostic capability across motor, EC glass, and Hall sensor interfaces.

Technical Context

The MM908E622ACPEK integrates two functionally independent dies: an HC08 microcontroller (16 KB flash, 512 B RAM, ESCI, SPI, 2×16-bit timers) and an analog SMARTMOS driver die with fault diagnostics, current-sense ratio trimming, and configurable wake-up inputs. The MCU controls logic while the analog die handles power switching, sensing, and LIN bus signaling.

Its architecture supports autonomous operation: the analog die provides hardware-level overcurrent shutdown (blanking time 4–8 µs), voltage regulation (5.0 V ±2.5%), and real-time diagnostics (e.g., open-load detection on EC outputs, HTI/LVI resets), reducing MCU intervention for safety-critical mirror functions.

Key Specifications

Pinout & Package

Package: 54-pin SOICW-EP (exposed pad), RoHS-compliant, moisture sensitivity level 3 per J-STD-020C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body electronics applications.

Compared with MC33816AEKR2 and FS6525G02000000, the MM908E622ACPEK uniquely integrates EC glass control, Hall sensor interface, and LIN PHY in one package - making it optimal for cost-sensitive, space-constrained mirror modules where mixed-signal integration reduces component count and validation effort.

Availability

MM908E622ACPEK is available at Aetrix Electronics and suitable for automotive exterior mirror control, auto-dimming rearview systems, and driver seat position memory applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MM908E622ACPEK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in automotive MCUs and analog power integration.

The MM908E622ACPEK belongs to NXP's legacy SMARTMOS automotive system basis chip (SBC) family, designed specifically for intelligent mirror actuation - integrating motor drive, EC dimming, sensor interface, and LIN communication into a single automotive-qualified package.

FAQ

What is the maximum operating junction temperature for the MM908E622ACPEK?

The MM908E622ACPEK has a maximum operating junction temperature of 125 °C, with thermal interrupt (HTI) triggering at 125 °C and thermal reset (HTR) at 155 °C. The analog die must not exceed 150 °C under dynamic load conditions, as specified in the Freescale datasheet Rev. 3.0. This rating ensures reliable operation in under-hood and door module environments where ambient temperatures reach 85 °C.

Does the MM908E622ACPEK support both 2-pin and 3-pin Hall effect sensors?

Yes, the MM908E622ACPEK supports both configurations via the H0 pin. When H0MS = 1, it operates in 2-pin Hall mode with output voltage referenced to VSUP (VSUP − 1.2 V typical). When H0MS = 0, it functions as a general-purpose digital input with 3.5 V high-threshold and 10 kΩ internal pull-up. Configuration is controlled by MCU software, enabling flexible sensor selection without hardware changes.

How does the MM908E622ACPEK handle overcurrent protection on its half-bridge outputs?

The MM908E622ACPEK implements hardware-based overcurrent shutdown with blanking time to suppress false triggers during switching transients. For HB1/HB2, shutdown occurs at 1.0–1.5 A with 4.8 µs blanking; for HB3/HB4, it triggers at 4.8–7.2 A with same blanking. Faults are reported via IRQ_A to the MCU, and recovery requires software reset or automatic restart depending on configuration - ensuring robust motor drive protection without MCU overhead.

Can the MM908E622ACPEK drive electrochromic glass without external components?

The MM908E622ACPEK provides direct EC glass drive via dedicated EC and ECR pins, but requires an external ballast resistor connected to ECR per datasheet Figure 1. It integrates 6-bit DAC-controlled voltage (0–1.4 V), current-source trimming, and open-load detection (≥10 kΩ), eliminating external op-amps or DACs. However, the ballast resistor value must be selected based on glass impedance and desired dimming range - no fully passive operation.

What LIN physical layer features are implemented in the MM908E622ACPEK?

The MM908E622ACPEK implements a full ISO 17987-4 LIN physical layer with programmable slew rate (slow/normal/fast), recessive/dominant propagation delay ≤50 µs, bus wake-up detection (t_WAKE ≤20 µs), and integrated pull-up (20–47 kΩ). Its LIN transceiver shares the MCU's PTE1/RXD pin internally, and supports standard LIN 2.x frame timing - enabling seamless integration into automotive body networks without external transceivers.