NXP Semiconductors MM908E622ACPEKR2

Overview

MM908E622ACPEKR2 from NXP Semiconductors (formerly Freescale) is an automotive-grade integrated quad half-bridge, triple high-side and EC glass driver with embedded HC08 MCU and LIN physical layer. It delivers 4× half-bridge (HB1–HB4), 3× high-side (HS1–HS3), EC glass control, Hall sensor interface, 10-bit ADC, and LIN bus transceiver in a single 54-pin SOICW-EP package. Designed for high-end mirror actuation, it enables precise motor control, electrochromic dimming, and LIN-based diagnostics in automotive exterior systems.

For engineers reviewing the MM908E622ACPEKR2 datasheet, MM908E622ACPEKR2 pinout, MM908E622ACPEKR2 application, or MM908E622ACPEKR2 equivalent, key selection criteria include R_DS(ON) values per output stage (e.g., 185 mΩ HS1, 275 mΩ HB3), LIN compliance per ISO 17987, diagnostic coverage (over-current, open-load, thermal), and integrated MCU resource allocation (16 KB flash, 512 B RAM, ESCI/SPI/ADC).

Technical Context

The MM908E622ACPEKR2 integrates two die: an M68HC908EY16 microcontroller core with flash memory, timers, ESCI, SPI, and 10-bit ADC; and an analog SMARTMOS die providing power drivers, LIN transceiver, voltage regulator (5.0 V @ 120 mA), and diagnostic logic. The dual-die architecture enables concurrent real-time motor control and system-level communication via LIN.

Power management includes autonomous watchdog supervision, low-voltage reset (3.8–4.65 V), high-voltage interrupt (20–24 V), and thermal shutdown (155 °C). All outputs feature current-sense feedback (CRRATIOHS1 = 1.2 V/A), programmable blanking time (4–8 µs), and freewheeling diodes (V_HSF = 0.9 V).

Key Specifications

Pinout & Package

MM908E622ACPEKR2 uses a 54-pin SOICW-EP (EK suffix) package with exposed thermal pad (EP) for enhanced heat dissipation in automotive under-hood/mirror housing environments. Pin count and layout support full integration of MCU I/O, analog drivers, LIN bus, and diagnostic signals without external support ICs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive mirror driver applications.

Compared with MC33883 and SPC560B50L5, MM908E622ACPEKR2 uniquely combines MCU, LIN, four half-bridges, three high-sides, and EC glass control in one package-reducing component count, board space, and software integration effort for mid-tier automotive mirror modules.

Availability

MM908E622ACPEKR2 is available at Aetrix Electronics and suitable for automotive power mirror control, electrochromic dimming, Hall-based position sensing, and LIN-based diagnostic gateway applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MM908E622ACPEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal integration.

The MM908E622ACPEKR2 belongs to NXP's legacy automotive analog+MCU integration product line, designed specifically for cost-sensitive, space-constrained exterior mirror control modules requiring embedded intelligence, power driving, and LIN communication.

FAQ

What is the maximum continuous current rating for HS1 output on the MM908E622ACPEKR2?

The MM908E622ACPEKR2 HS1 output has an over-current shutdown threshold of 6.0–9.0 A, with typical R_DS(ON) of 185 mΩ at 25 °C. Continuous operation is limited by thermal design and duty cycle; for sustained 1.0 A loads, junction temperature must remain ≤125 °C. Derating is required above 85 °C ambient due to reduced thermal headroom. The MM908E622ACPEKR2 datasheet specifies I_HSOC1 = 6.0–9.0 A as the trip point, not continuous rating.

Does the MM908E622ACPEKR2 support both 2-pin and 3-pin Hall effect sensors?

Yes, the MM908E622ACPEKR2 supports both configurations via the H0 pin. In 2-pin Hall mode (H0MS = 1), it provides a current-sink output (6–10 mA threshold) with internal pull-up; in 3-pin mode (H0MS = 0), it operates as a general-purpose digital input with programmable thresholds (1.5 V low, 3.5 V high) and hysteresis. Configuration is controlled by the H0MS bit in the analog die register set.

Can the MM908E622ACPEKR2 drive electrochromic glass without external components?

No, the MM908E622ACPEKR2 requires an external ballast resistor connected to the ECR pin to complete the EC glass current path. The EC pin supplies regulated voltage (0.18–1.4 V) and current, but the ballast resistor sets the dimming current magnitude and stability. The MM908E622ACPEKR2 does not integrate the ballast function; omitting ECR connection prevents proper EC operation and may trigger open-load fault detection.

What LIN baud rates are supported by the MM908E622ACPEKR2 physical layer?

The MM908E622ACPEKR2 LIN physical layer supports standard automotive baud rates from 10 kbps to 20 kbps, compliant with ISO 17987-2. Timing parameters (e.g., t_DOM-MAX = 50 µs, t_REC-MAX = 50 µs at normal slew rate) are validated for 10–20 kbps operation across -40 °C to +85 °C. The MM908E622ACPEKR2 does not support non-standard or high-speed LIN variants beyond this range.

How is the analog die reset managed relative to the MCU die in the MM908E622ACPEKR2?

The MM908E622ACPEKR2 uses independent reset paths: RST controls the MCU die, while RST_A controls the analog die. Both are bidirectional and internally connected-asserting either pin resets both domains. However, the analog die can generate autonomous reset events (e.g., LVR, HTR) that assert RST_A, which then propagates to RST. This ensures coordinated recovery during supply or thermal faults while allowing analog-domain supervision without MCU intervention.