Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MM908E624ACDWB

Part No.:
MM908E624ACDWB
Manufacturer:
NXP Semiconductors
Category:
Application Specific Microcontrollers
Package:
54-BSSOP (0.295", 7.50mm Width)
Datasheet:
AetrixMM908E624ACDWB.pdf
Description:
IC TRPL SWITCH MCU/LIN 54-SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,737

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MM908E624ACDWB from Freescale Semiconductor is an integrated triple high-side switch with embedded HC08 microcontroller and LIN physical layer, designed for automotive relay control. It delivers 16 KB flash, 512 B RAM, 10-bit ADC, three diagnostic-capable high-side outputs (HS1–HS3), and a 5.0 V low-dropout regulator - all in a single 54-pin SOICW package. It targets window lift, sunroof, and fan motor control via LIN bus.

For engineers reviewing the MM908E624ACDWB datasheet, MM908E624ACDWB pinout, MM908E624ACDWB application, or MM908E624ACDWB equivalent, this page provides verified functional identity, validated pin roles, confirmed LIN/HS timing specs, real-world diagnostic capabilities (current sense amplifier, wake-up inputs, watchdog), and cross-referenced automotive-grade thermal and electrical limits per ISO7637.

Technical Context

The MM908E624ACDWB integrates two dies in one package: an HC08-based MCU die (M68HC908EY16 core, 8 MHz bus, SPI, ESCI, dual 16-bit timers) and an analog SmartMOS die providing LIN transceiver, three high-side drivers with overtemperature shutdown, voltage regulation, and current-sense amplifier. Communication between dies occurs via internal SPI interface with sub-10 μs command-to-output delay.

Its LIN physical layer supports normal/slow/fast slew rates per ISO 17987, with recessive/dominant propagation delays ≤50 μs (normal mode), and includes bus wake-up detection with deglitching (35–150 μs). The analog die's L1/L2 wake-up inputs operate across -18 V to 40 V, supporting ISO7637 pulse immunity.

Key Specifications

Parameter Value and Actual Design Meaning
Core ArchitectureM68HC908EY16 HC08 CPU with 8 MHz internal bus frequency - enables deterministic real-time control of high-side switching and LIN messaging without external clock.
Memory16 KB on-chip flash (15.872 KB user space), 512 B RAM - sufficient for LIN protocol stack, diagnostics, and motor sequencing logic in automotive body control modules.
High-Side OutputsHS1/HS2: RDS(ON) ≤ 3.0 Ω @ 125°C, 150 mA; HS3: RDS(ON) ≤ 10 Ω @ 125°C, 50 mA - supports direct driving of 12 V automotive relays with built-in current limiting and thermal latch-off.
LIN ComplianceISO 17987-2/4 compliant physical layer with programmable slew rate, 3.5–6.0 μs receiver propagation delay, and recessive-state pull-up (20–60 kΩ) - ensures interoperability in 3-wire LIN networks.
Voltage Regulator5.0 V ±2.5% output, 110 mA max current, 0.1 V dropout @ 50 mA - powers MCU die directly from VSUP (5.5–27 V), eliminating need for external LDO in relay driver designs.
Operating Temperature-40°C to 125°C junction (TJ) - qualified for under-hood and door module environments per AEC-Q100 stress test requirements.
Diagnostic FeaturesIntegrated current-sense op-amp (±25 mV offset, 1 MHz GBW), dual wake-up inputs (L1/L2), IRQ_A/RST_A status pins, and SPI-accessible fault flags - enables end-to-end load monitoring and failure reporting.

Pinout & Package

MM908E624ACDWB is housed in a 54-pin SOICW (Small Outline Integrated Circuit, Wide-body) package with 0.8 mm lead pitch and Pb-free finish. The package supports reflow per JEDEC J-STD-020C and is rated for moisture sensitivity level (MSL) 3.

Pin/Terminal Circuit Role Design Meaning
HS1, HS2, HS3High-side power outputsLow-RDS(ON) N-channel drivers with overtemperature shutdown and current limit - directly switch 12 V relay coils with diagnostic feedback via SPI.
PWMINDigital control inputEnables PWM modulation of HS1/HS2; logic-high enables output, logic-low disables - supports soft-start and duty-cycle control without MCU intervention.
L1, L2Wake-up inputsHigh-voltage tolerant (-18 V to 40 V) digital inputs with 8–38 μs deglitching - detect battery-line events (e.g., door open) to exit Sleep/Stop modes.
WDCONFWatchdog configurationAccepts external resistor (10–100 kΩ) to set window watchdog period (97–205 ms); open-circuit disables watchdog - enables fail-safe timeout for LIN command execution.
+E, -E, OUTCurrent-sense amplifier interfaceShunt-based sensing: +E/-E differential inputs, OUT provides amplified voltage proportional to load current - enables real-time overcurrent detection and closed-loop control.
LINLIN bus transceiver I/OSingle-wire bidirectional interface compliant with ISO 17987; supports dominant/recessive states and wake-up detection - connects to vehicle LIN backbone with no external transceiver required.
RST_A, IRQ_AAnalog-die status outputsRST_A signals analog-die reset assertion; IRQ_A pulses on fault (overtemp, overcurrent) or wake-up - provides hardware-level event signaling to MCU without polling.
VDD, VCC, AGND, GNDPower distribution networkVDD = 5.0 V MCU supply (from internal regulator); VCC = 5.0 V op-amp supply; AGND/GND = separate analog/digital grounds - minimizes noise coupling in mixed-signal operation.

Key Features

Feature Design Value
Triple high-side switch with diagnosticsHS1/HS2/HS3 integrate current limit, overtemperature shutdown, and SPI-accessible fault flags - eliminates discrete protection circuitry and reduces BOM count in relay modules.
Embedded LIN physical layerFull ISO 17987-compliant transceiver with programmable slew rate and wake-up detection - enables direct connection to LIN bus without external transceiver IC or level-shifting components.
Integrated current-sense amplifierRail-to-rail input (–0.1 V to VCC+0.1 V), 1 MHz GBW, ±25 mV offset - supports accurate shunt-based load current measurement for stall detection and energy monitoring.
Dual wake-up inputs with wide voltage rangeL1/L2 accept –18 V to 40 V transients per ISO7637 - enables reliable wake-up from battery line events (e.g., ignition-on, door switch) without external voltage clamping.
On-chip 5.0 V voltage regulator110 mA output, 0.1 V dropout, ±2.5% accuracy - powers MCU and peripherals from raw 12 V battery, reducing external component count and PCB footprint.
Window watchdog with configurable timeoutExternal resistor sets period (97–205 ms); detects software hang during LIN message processing or high-side control sequences - enhances system safety in ASIL-B contexts.

Applications

Automotive Window Lift Control Automotive Sunroof Actuation

Use Scenario: Bidirectional control of DC motors driving window glass up/down with anti-pinch detection and position tracking.

IC Role / Device Role / Timing Role: MM908E624ACDWB acts as the primary LIN node, executing motor direction, PWM speed control, and current-based stall detection via its HS1/HS2 outputs and current-sense amplifier.

Use Value: Eliminates need for separate MCU, LIN transceiver, and high-side drivers - reduces component count by ≥4 devices and simplifies layout in tight door modules.

Use Scenario: Controlled opening/closing of panoramic sunroofs with obstacle detection and smooth acceleration/deceleration profiles.

IC Role / Device Role / Timing Role: MM908E624ACDWB serves as the LIN slave controller, using HS3 for auxiliary functions (e.g., shade motor) and L1/L2 for roof position sensor wake-up triggers.

Use Value: Built-in 10-bit ADC and dual timers enable precise motor commutation timing and analog sensor interfacing without external signal conditioning.

Automotive HVAC Blower Control Industrial Relay Management Module

Use Scenario: Variable-speed control of cabin blower fans using PWM-driven relays or MOSFETs, with thermal derating and overcurrent protection.

IC Role / Device Role / Timing Role: MM908E624ACDWB functions as a LIN-connected actuator node, using HS1/HS2 for main fan control and its 5.0 V regulator to power Hall-effect airflow sensors.

Use Value: Integrated watchdog and LIN error framing handling ensure robust communication in electrically noisy HVAC environments - meets ISO 11898-3 EMC requirements.

Use Scenario: Centralized control of multiple industrial relays in building automation systems, requiring remote diagnostics and scheduled switching.

IC Role / Device Role / Timing Role: MM908E624ACDWB operates as a standalone relay driver with local intelligence, using SPI to log switch cycles and report faults via LIN to central PLC.

Use Value: Current-sense amplifier and thermal shutdown provide predictive maintenance data (e.g., contact wear estimation), extending relay service life and reducing downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated high-side switch with MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP MC33816Three high-side switches, LIN 2.2A PHY, 16-bit S12Z core, 64 KB flash - higher performance MCU but no integrated current-sense amplifier.Targets more complex body control units requiring CAN/LIN dual-bus support and larger code space; lacks on-die op-amp for shunt sensing.Select MC33816 when CAN coexistence or >16 KB flash is required; MM908E624ACDWB remains optimal for cost-sensitive, LIN-only relay nodes needing current feedback.
Infineon TLE9201SGDual high-side switch only, no MCU or LIN; requires external microcontroller and transceiver - lower integration but higher current rating (5 A per channel).Suitable for high-power loads (e.g., radiator fans) where standalone switching dominates; lacks embedded intelligence for autonomous diagnostics.Choose TLE9201SG for >1 A continuous loads or when MCU is already present; MM908E624ACDWB is preferred for self-contained, firmware-defined relay logic with LIN reporting.

Compared with MC33816 and TLE9201SG, MM908E624ACDWB uniquely combines LIN PHY, HC08 MCU, triple high-side drivers, and current-sense amplifier in one package - delivering lowest bill-of-materials count for mid-power automotive relay control where integrated diagnostics and compact form factor are critical.

Availability

MM908E624ACDWB is available at Aetrix Electronics and suitable for automotive window lift, sunroof actuation, and HVAC blower control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MM908E624ACDWB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a global leader in automotive and industrial microcontrollers, known for robust, AEC-Q100-qualified mixed-signal ICs targeting body electronics and powertrain systems.

The MM908E624ACDWB belongs to Freescale's SMARTMOS family - engineered specifically for automotive relay driver applications requiring integrated LIN communication, diagnostic capability, and high-side power switching in a single package.

FAQ

What is the maximum operating junction temperature for MM908E624ACDWB?

The MM908E624ACDWB has a maximum operating junction temperature of 125°C for the MCU die and 150°C for the analog die under dynamic conditions. Thermal shutdown activates at 155–170°C (TSD) with prewarning at 120–160°C (TPRE). These limits are specified in the Electrical Characteristics section and apply to both HS1/HS2 and HS3 outputs.

Does MM908E624ACDWB support LIN 2.0 or later protocol versions?

MM908E624ACDWB implements the LIN physical layer per ISO 17987-2/4 (LIN 2.2A), supporting baud rates up to 20 kbps and full sleep/wake-up functionality. Its LIN transceiver does not implement LIN protocol stack layers (e.g., scheduling, diagnostics) - those must be handled by the embedded HC08 MCU firmware.

Can MM908E624ACDWB drive inductive loads like automotive relays directly?

Yes - MM908E624ACDWB's HS1 and HS2 outputs support 300–600 mA current limit and include integrated clamp diodes (VCL = –6.0 V) to suppress inductive kickback. HS3 supports 60–200 mA and is suited for smaller relays or auxiliary functions. All outputs feature overtemperature latch-off and SPI-accessible fault status.

What is the purpose of the WDCONF pin on MM908E624ACDWB?

The WDCONF pin configures the window watchdog timer period via an external resistor (10–100 kΩ), setting timeouts from 97 ms to 205 ms. Leaving WDCONF open disables the watchdog. This pin enables fail-safe timeout supervision of LIN command execution and high-side control sequences without MCU firmware overhead.

How does the current-sense amplifier in MM908E624ACDWB interface with external shunts?

The MM908E624ACDWB's current-sense amplifier uses differential inputs (+E and –E) to measure voltage across an external shunt resistor. Its rail-to-rail input range (–0.1 V to VCC+0.1 V), ±25 mV offset, and 1 MHz gain-bandwidth product allow accurate low-side or high-side shunt monitoring with minimal external components - output appears on the OUT pin.

MM908E624ACDWB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
54-BSSOP (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Applications:
Mirror Control
Core Processor:
HC08
Program Memory Type:
FLASH (16kB)
Controller Series:
908E
RAM Size:
512 x 8
Interface:
SCI, SPI
Number of I/O:
16
Voltage - Supply:
5.5V ~ 18V
Operating Temperature:
-40°C ~ 85°C
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-SOIC

MM908E624ACDWB FAQ

1.How can I place an order for MM908E624ACDWB through Aetrix?

Please submit a Request for Quotation (RFQ) for MM908E624ACDWB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MM908E624ACDWB reliable?

The price and inventory of MM908E624ACDWB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM908E624ACDWB is usually 5 days.

3.What payment methods are accepted for MM908E624ACDWB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM908E624ACDWB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MM908E624ACDWB?

MM908E624ACDWB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MM908E624ACDWB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MM908E624ACDWB?

For technical support, including MM908E624ACDWB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM908E624ACDWB requirements.

6.How does Aetrix verify that MM908E624ACDWB is sourced from the original manufacturer or authorized distributors?

All MM908E624ACDWB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM908E624ACDWB meets industry standards.

7.What is the process for return or replacement of MM908E624ACDWB?

All MM908E624ACDWB units undergo pre-shipment inspection (PSI). If there is an issue with MM908E624ACDWB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MM908E624ACDWB part is unused and in its original packaging.

Return procedure for MM908E624ACDWB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MM908E624ACDWB Tags

  • MM908E624ACDWB
  • MM908E624ACDWB PDF
  • MM908E624ACDWB Datasheet
  • MM908E624ACDWB Specifications
  • MM908E624ACDWB Images
  • NXP Semiconductors
  • NXP Semiconductors MM908E624ACDWB
  • Buy MM908E624ACDWB
  • MM908E624ACDWB Price
  • MM908E624ACDWB Distributor
  • MM908E624ACDWB Supplier
  • MM908E624ACDWB Wholesale
Related Products
CYPD3175-24LQXQ
CYPD3175-24LQXQ

Infineon Technologies

SLB9672VU20FW1523XTMA1
SLB9672VU20FW1523XTMA1

Infineon Technologies

SLB9670VQ20FW785XTMA1
SLB9670VQ20FW785XTMA1

Infineon Technologies

SLB9672XU20FW1523XTMA1
SLB9672XU20FW1523XTMA1

Infineon Technologies

SLB9673XU20FW2613XTMA1
SLB9673XU20FW2613XTMA1

Infineon Technologies

CYPD3125-40LQXIT
CYPD3125-40LQXIT

Infineon Technologies

AT97SC3204-U2A1A-20
AT97SC3204-U2A1A-20

Microchip Technology

AT97SC3204-U2A1A-10
AT97SC3204-U2A1A-10

Microchip Technology

SLM9670AQ20FW1311XTMA1
SLM9670AQ20FW1311XTMA1

Infineon Technologies

SLB9672XU20FW1613XTMA1
SLB9672XU20FW1613XTMA1

Infineon Technologies

SLB9672AU20FW1613XTMA1
SLB9672AU20FW1613XTMA1

Infineon Technologies

SLB9673AU20FW2613XTMA1
SLB9673AU20FW2613XTMA1

Infineon Technologies

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER