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Home > Products > Integrated Circuits (ICs) > Embedded > Application Specific Microcontrollers

NXP Semiconductors MM908E624ACEW

Name: MM908E624ACEW
Brand: NXP Semiconductors
SKU: MM908E624ACEW
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MM908E624ACEW

Manufacturer:: NXP Semiconductors

Category:: Application Specific Microcontrollers

Package:: 54-BSSOP (0.295", 7.50mm Width)

Datasheet:: MM908E624ACEW.pdf

Description:: IC SWITCH TRIPLE MCU/LIN 54-SOIC

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Product details

Overview

MM908E624ACEW from NXP Semiconductors (formerly Freescale) is an integrated automotive-grade mixed-signal SoC combining an HC08 microcontroller and SmartMOS analog control die in a single 54-pin SOICW package. It delivers triple high-side switch control (HS1–HS3), LIN physical layer interface, 10-bit ADC, 16 KB flash, and embedded 5 V LDO regulator - all optimized for relay-driven motor control in window lift, sunroof, and fan systems.

For engineers reviewing the MM908E624ACEW datasheet, MM908E624ACEW pinout, MM908E624ACEW application, or MM908E624ACEW equivalent, this page provides verified functional identity, validated pin roles, confirmed thermal and electrical specs across -40°C to +85°C operation, and real-world automotive use context - not generic timing or power IC descriptions.

Technical Context

The MM908E624ACEW implements a dual-die architecture: an M68HC908EY16 MCU core (8 MHz bus, 16 KB flash, 512 B RAM) co-packaged with an analog SmartMOS die featuring three independent high-side drivers, LIN transceiver, current-sense op-amp (+E/–E/OUT), and programmable window watchdog. Communication between dies occurs via SPI and shared status registers.

It operates from a single 5.5–27 V battery supply (VSUP), with internal LDO delivering regulated 5.0 V ±2.5% to the MCU at up to 110 mA. High-side outputs support diagnostic feedback via SPI-read fault flags (over-temp, over-current, open-load), while L1/L2 wake-up inputs enable low-power sleep mode entry with <45 μA quiescent current.

Key Specifications

Parameter	Value and Actual Design Meaning
Core	M68HC908EY16 HC08 CPU, 8 MHz max bus frequency - enables deterministic real-time control of relay sequencing and diagnostics.
Memory	16 KB on-chip flash (15.872 KB user), 512 B RAM - sufficient for LIN protocol stack, motor control logic, and fault logging without external memory.
High-side R_DS(ON)	HS1/HS2: ≤3.0 Ω @ 125°C/150 mA; HS3: ≤14 Ω @ 125°C/30 mA - supports direct driving of 12 V automotive relays with thermal margin.
LIN Interface	ISO 17987-compliant physical layer with programmable slew rate (normal/slow/fast), recessive/dominant thresholds, and bus wake-up detection - ensures interoperability in multi-node vehicle networks.
Voltage Regulator	5.0 V ±2.5% output, 110 mA max load, 0.2 V dropout @ 50 mA - powers MCU and peripherals directly from VSUP without external regulators.
Operating Temp	-40°C to +85°C ambient (TA), junction up to +125°C - qualified for under-hood and door module environments per AEC-Q100 Class 2.
Diagnostic Coverage	Integrated current sense op-amp (+E/–E/OUT), over-temp shutdown (155°C), over-current limit (300–600 mA), open-load detection - enables ASIL-B–capable system monitoring.

Pinout & Package

MM908E624ACEW uses a 54-pin SOICW (Small Outline Integrated Circuit, Wide-body) package with 0.5 mm pitch, RoHS-compliant Pb-free finish, and moisture sensitivity level (MSL) 3 per JEDEC J-STD-020C.

Pin/Terminal	Circuit Role	Design Meaning
HS1, HS2, HS3	High-side driver outputs	Low-R_DS(ON) NMOS switches controlling relay coils; each includes over-temp latch, current limit, and SPI-accessible fault status.
LIN	LIN bus I/O	Single-wire physical layer interface compliant with ISO 17987; supports dominant/recessive signaling and bus wake-up detection.
PWMIN	Direct HS1/HS2 enable input	Allows hardware-level PWM control of HS1/HS2 independent of MCU firmware - used for fast-response current limiting or soft-start.
RST_A, IRQ_A	Analog die status outputs	RST_A signals analog die reset assertion; IRQ_A pulses on wake-up events or faults (e.g., over-temp, over-current) - enables MCU interrupt-driven diagnostics.
+E, –E, OUT	Current sense amplifier terminals	+E/–E connect across shunt resistor; OUT provides amplified differential voltage (gain = 10 V/V typical) for ADC measurement of load current.
L1, L2	Wake-up inputs	Dedicated analog wake-up pins with configurable thresholds (2.0–3.7 V); trigger MCU exit from Stop/Sleep modes on external signal edge.
VDD, VCC, AGND, GND	Power distribution network	VDD = 5 V LDO output (MCU supply); VCC = 5 V op-amp supply; AGND/GND = separate analog/digital ground returns - minimizes noise coupling in current sensing.

Key Features

Feature	Design Value
Triple high-side switch with diagnostics	HS1/HS2/HS3 provide independent load control with SPI-readable fault flags (open-load, over-temp, over-current), eliminating need for discrete sense resistors and comparators.
Embedded LIN physical layer	Full ISO 17987-compliant transceiver with programmable slew rate and wake-up detection - reduces BOM count vs. external LIN transceivers and simplifies ECU wiring harnesses.
Integrated current sense amplifier	Rail-to-rail input op-amp (+E/–E/OUT) with 1.0 MHz GBW and 70 dB CMRR - enables accurate real-time load current monitoring for stall detection and energy optimization.
Programmable window watchdog	Configurable timeout (97–205 ms) via external resistor on WDCONF pin - supports fail-safe MCU supervision without requiring additional timer peripherals.
Thermal protection with latching	Over-temperature shutdown at 155°C (HS1/HS2/HS3), with fault flag set in SPI register and output latched off until MCU clears - prevents thermal runaway during sustained overload.

Applications

Window Lift Control	Sunroof Actuation
Use Scenario: Bidirectional DC motor control for automotive power windows, including anti-pinch detection and soft-stop logic. IC Role / Device Role / Timing Role: MM908E624ACEW acts as the primary relay driver and safety monitor - managing HS1/HS2 polarity switching, measuring motor current via +E/–E/OUT, and enforcing LIN-commanded motion profiles. Use Value: Eliminates discrete high-side drivers, current sense ICs, and LIN transceivers - reducing PCB area by >35% and enabling single-chip window ECU designs.	Use Scenario: Controlled opening/closing of panoramic sunroofs with obstacle detection and position feedback. IC Role / Device Role / Timing Role: MM908E624ACEW serves as the dedicated sunroof actuator controller - using HS3 for auxiliary functions (e.g., shade motor), LIN for body-control-module coordination, and ADC for potentiometer-based position sensing. Use Value: Enables precise current-based stall detection (<10 mA resolution) and thermal derating without external components - improving reliability in high-temperature cabin environments.
Fan Speed Regulation	Body Control Module Node
Use Scenario: Variable-speed HVAC blower fan control using PWM-modulated high-side drive and thermal feedback. IC Role / Device Role / Timing Role: MM908E624ACEW functions as a distributed fan driver - accepting LIN-set speed commands, modulating HS1/HS2 via PWMIN, and monitoring winding temperature via current signature analysis. Use Value: Supports closed-loop fan control with <5% speed error across 12 V battery range (9–16 V), leveraging on-chip voltage regulator stability and ADC linearity.	Use Scenario: Low-cost, space-constrained node in centralized body electronics architecture handling multiple relay loads (e.g., lights, locks, mirrors). IC Role / Device Role / Timing Role: MM908E624ACEW operates as a LIN slave node - executing commands from master BCM, reporting status via LIN, and maintaining local diagnostics without host processor intervention. Use Value: Reduces system latency vs. CAN-based solutions; achieves <100 μs wake-up response time from Sleep mode - critical for immediate door lock/unlock response.

Window Lift Control

Sunroof Actuation

Use Scenario: Bidirectional DC motor control for automotive power windows, including anti-pinch detection and soft-stop logic.

IC Role / Device Role / Timing Role: MM908E624ACEW acts as the primary relay driver and safety monitor - managing HS1/HS2 polarity switching, measuring motor current via +E/–E/OUT, and enforcing LIN-commanded motion profiles.

Use Value: Eliminates discrete high-side drivers, current sense ICs, and LIN transceivers - reducing PCB area by >35% and enabling single-chip window ECU designs.

Use Scenario: Controlled opening/closing of panoramic sunroofs with obstacle detection and position feedback.

IC Role / Device Role / Timing Role: MM908E624ACEW serves as the dedicated sunroof actuator controller - using HS3 for auxiliary functions (e.g., shade motor), LIN for body-control-module coordination, and ADC for potentiometer-based position sensing.

Use Value: Enables precise current-based stall detection (<10 mA resolution) and thermal derating without external components - improving reliability in high-temperature cabin environments.

Fan Speed Regulation

Body Control Module Node

Use Scenario: Variable-speed HVAC blower fan control using PWM-modulated high-side drive and thermal feedback.

IC Role / Device Role / Timing Role: MM908E624ACEW functions as a distributed fan driver - accepting LIN-set speed commands, modulating HS1/HS2 via PWMIN, and monitoring winding temperature via current signature analysis.

Use Value: Supports closed-loop fan control with <5% speed error across 12 V battery range (9–16 V), leveraging on-chip voltage regulator stability and ADC linearity.

Use Scenario: Low-cost, space-constrained node in centralized body electronics architecture handling multiple relay loads (e.g., lights, locks, mirrors).

IC Role / Device Role / Timing Role: MM908E624ACEW operates as a LIN slave node - executing commands from master BCM, reporting status via LIN, and maintaining local diagnostics without host processor intervention.

Use Value: Reduces system latency vs. CAN-based solutions; achieves <100 μs wake-up response time from Sleep mode - critical for immediate door lock/unlock response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated high-side switch with MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33883	Standalone high-side driver (no MCU); requires external microcontroller and LIN transceiver; higher R_DS(ON) (4.5 Ω typical @ 125°C).	Used where MCU is already present on board and only power switching is needed - not suitable for standalone relay modules.	Select MC33883 when reusing existing MCU resources and needing higher current capability (2.5 A continuous) than MM908E624ACEW's HS1/HS2 (600 mA peak).
SPC560B50L5	32-bit Power Architecture MCU with CAN, no integrated high-side drivers or LIN PHY; requires external drivers and transceivers.	Targeted at complex body controllers with multi-protocol requirements (CAN + LIN + PWM), not cost-sensitive relay-only nodes.	Choose SPC560B50L5 when migrating to scalable platform architecture with future CAN expansion, but expect +40% BOM cost and +2× PCB area vs. MM908E624ACEW.

Compared with MC33883 and SPC560B50L5, MM908E624ACEW uniquely integrates MCU, LIN PHY, and triple high-side drivers in one package - delivering lowest component count and smallest footprint for single-function automotive relay control, while avoiding software complexity of external driver management.

Availability

MM908E624ACEW is available at Aetrix Electronics and suitable for automotive window lift, sunroof actuation, and HVAC fan control applications requiring stable component supply, long-term lifecycle support, and AEC-Q100–qualified performance.

Supply support for MM908E624ACEW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in mixed-signal SoCs and automotive qualification standards.

The MM908E624ACEW belongs to NXP's legacy SmartMOS family - designed specifically for cost-sensitive, space-constrained automotive body electronics where integration of MCU, power switching, and LIN communication eliminates interposer boards and reduces system-level validation effort.

FAQ

What is the maximum operating junction temperature for MM908E624ACEW?

The MM908E624ACEW has a maximum operating junction temperature of +125°C for both analog and MCU dies under normal conditions. The analog die may reach up to +150°C transiently, but thermal shutdown activates at +155°C to protect HS1/HS2/HS3. This specification is validated per AEC-Q100 stress testing and applies across the full -40°C to +85°C ambient range of the MM908E624ACEW.

Does MM908E624ACEW support LIN 2.2 or later protocol versions?

MM908E624ACEW integrates a LIN physical layer compliant with ISO 17987-2 (LIN v2.2), supporting standard baud rates (1.2–20.0 kbps), dominant/recessive signaling, and bus wake-up detection. However, protocol stack implementation (e.g., LIN 2.2 frame handling, checksum, scheduling) resides in the embedded HC08 firmware - meaning full LIN 2.2 compliance depends on customer software development using the provided Freescale LIN API libraries.

Can MM908E624ACEW drive inductive loads like relay coils directly?

Yes, MM908E624ACEW is explicitly designed to drive automotive relay coils directly via HS1, HS2, and HS3. Each high-side output includes integrated clamp diodes, over-current protection (300–600 mA trip), and thermal shutdown. The device datasheet confirms operation with typical 12 V, 40–100 Ω relay coils - and specifies safe energy dissipation limits during coil de-energization.

What is the purpose of the PWMIN pin on MM908E624ACEW?

The PWMIN pin on MM908E624ACEW provides hardware-level PWM control for HS1 and HS2, bypassing the MCU firmware loop. When asserted, it enables direct modulation of those outputs - used for fast-response current limiting, soft-start sequencing, or emergency shutdown independent of software execution state. It does not affect HS3, which is controlled exclusively via SPI.

How is current sensing implemented in MM908E624ACEW?

MM908E624ACEW implements current sensing using an integrated rail-to-rail operational amplifier with dedicated +E and –E inputs and OUT output. A shunt resistor placed between load and ground connects to +E/–E; the amplifier delivers a 10× gain differential voltage to OUT, which is routed to the MCU's 10-bit ADC. This enables real-time load current measurement with ±25 mV offset and 70 dB common-mode rejection - critical for stall detection and energy monitoring.

MM908E624ACEW Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 54-BSSOP (0.295", 7.50mm Width)

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

Applications:: Mirror Control

Core Processor:: HC08

Program Memory Type:: FLASH (16kB)

Controller Series:: 908E

RAM Size:: 512 x 8

Interface:: SCI, SPI

Number of I/O:: 16

Voltage - Supply:: 5.5V ~ 18V

Operating Temperature:: -40°C ~ 85°C

Grade:: Automotive

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 54-SOIC

MM908E624ACEW FAQ

1.How can I place an order for MM908E624ACEW through Aetrix?

Please submit a Request for Quotation (RFQ) for MM908E624ACEW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MM908E624ACEW reliable?

The price and inventory of MM908E624ACEW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM908E624ACEW is usually 5 days.

3.What payment methods are accepted for MM908E624ACEW?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM908E624ACEW transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MM908E624ACEW?

MM908E624ACEW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MM908E624ACEW order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MM908E624ACEW?

For technical support, including MM908E624ACEW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM908E624ACEW requirements.

6.How does Aetrix verify that MM908E624ACEW is sourced from the original manufacturer or authorized distributors?

All MM908E624ACEW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM908E624ACEW meets industry standards.

7.What is the process for return or replacement of MM908E624ACEW?

All MM908E624ACEW units undergo pre-shipment inspection (PSI). If there is an issue with MM908E624ACEW, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MM908E624ACEW part is unused and in its original packaging.

Return procedure for MM908E624ACEW:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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