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NXP Semiconductors MM908E624ACPEW

Part No.:
MM908E624ACPEW
Manufacturer:
NXP Semiconductors
Category:
Application Specific Microcontrollers
Package:
54-BSSOP (0.295", 7.50mm Width)
Datasheet:
AetrixMM908E624ACPEW.pdf
Description:
IC SW TRPL HISIDE MCU/LIN 54SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,972

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Product details

Overview

MM908E624ACPEW from NXP Semiconductors (formerly Freescale) is an integrated automotive-grade IC combining a HC08 microcontroller and SmartMOS analog control die in a single 54-pin SOICW package. It delivers triple high-side switch control (HS1–HS3), LIN physical layer interface, 5 V voltage regulator, current-sense op-amp, watchdog, and wake-up inputs - all optimized for relay-driven motor control in window lift, sunroof, and fan systems.

For engineers reviewing the MM908E624ACPEW datasheet, MM908E624ACPEW pinout, MM908E624ACPEW application, or MM908E624ACPEW equivalent, this page provides verified functional partitioning (MCU + analog die), LIN timing specs, HS RDS(ON) values per channel, diagnostic capabilities (current sense, over-temp shutdown, fault flags), and validated alternative options for relay driver subsystems.

Technical Context

The MM908E624ACPEW implements a dual-die architecture: an M68HC908EY16 MCU core (8 MHz bus, 16 KB flash, 512 B RAM, 10-bit ADC, ESCI, SPI) co-packaged with a SmartMOS analog die featuring three independent high-side drivers, LIN transceiver, 5 V LDO regulator (110 mA typical output), and rail-to-rail current-sense amplifier (±25 mV offset, 1 MHz GBW).

Control flow is split across domains: MCU handles protocol stack, diagnostics, and SPI command sequencing; analog die executes real-time switching, thermal protection (latched shutdown at 155–190 °C), LIN bus signaling (recessive/dominant propagation ≤50 μs), and wake-up detection via L1/L2 inputs with programmable hysteresis (0.5–1.3 V).

Key Specifications

Parameter Value and Actual Design Meaning
LIN Physical Layer Single-wire ISO 9141-2/ISO 17987 compliant interface with recessive/dominant propagation ≤50 μs (normal slew); supports wake-up event reporting in ≤20 μs
High-Side Outputs HS1/HS2: RDS(ON) ≤3.0 Ω @ 125 °C, 150 mA; HS3: RDS(ON) ≤10 Ω @ 125 °C, 50 mA; all include over-current (50–150 mA threshold) and over-temperature latched shutdown
Voltage Regulator 5.0 V ±2.5% output (4.75–5.25 V), 110 mA max load, 0.1 V dropout @ 50 mA; supplies MCU core and digital I/Os
Current Sense Amplifier Rail-to-rail input (−0.1 to VCC+0.1 V), ±25 mV offset, 1 MHz gain-bandwidth, 0.5 V/μs slew rate; outputs amplified current signal on OUT pin
Wake-Up Inputs L1/L2 support wake-up detection across full VSUP range (−18 to 40 V); low/high thresholds configurable per supply voltage (e.g., 2.5/3.0 V @ 6–18 V)
Operating Temperature −40 °C to +85 °C ambient (MM908E624ACPEW); junction temperature limited to 125 °C for parametric guarantee
Package 54-pin SOICW (Wide-body), Pb-free, RoHS-compliant; thermal resistance θJA = 40 °C/W typical

Pinout & Package

MM908E624ACPEW uses a 54-pin SOICW (Small Outline Integrated Circuit, Wide) package with 0.8 mm lead pitch and exposed thermal pad. Pin numbering follows standard SOICW convention (pin 1 = top-left corner, counterclockwise). The device integrates two physically separate dies - MCU and analog - sharing common power/ground rails but with distinct pin assignments.

Pin/Terminal Circuit Role Design Meaning
HS1, HS2, HS3 High-side switch outputs Low-RDS(ON) power outputs driving relays/motors; each includes independent over-temp and over-current protection with latched fault flag
LIN LIN bus transceiver I/O Single-wire bidirectional interface; drives/receives ISO 9141-2/17987 signals; includes internal pull-up (20–60 kΩ) and wake-up deglitcher (35–150 μs)
PWMIN Direct HS1/HS2 enable & PWM input Allows external PWM control of HS1/HS2 without MCU intervention; logic-high enables switches, duty cycle modulates average current
L1, L2 Wake-up inputs Dedicated analog wake-up pins supporting wide-voltage detection (−18 to 40 V); hysteresis prevents false triggers during transients
VDD 5 V regulator output Stable 5.0 V supply for MCU core and digital peripherals; 110 mA max output; includes line/load regulation specs (≤150 mV variation)
+E, −E, OUT Current sense amplifier terminals +E/−E connect across shunt resistor; OUT delivers amplified differential voltage (gain = 20 V/V typical) for MCU ADC monitoring
RST_A, IRQ_A Analog die status outputs RST_A asserts low on analog die reset; IRQ_A pulses low on fault (over-temp, over-current) or wake-up event - both readable via MCU GPIO
VSP1, VSP SmartMOS power supply inputs VSP1/VSP accept battery input (5.5–27 V); feed internal regulator and high-side drivers; support ISO 7637 pulse immunity up to ±100 V

Key Features

Feature Design Value
Integrated LIN Physical Layer Eliminates need for external LIN transceiver; supports standard baud rates (up to 20 kbps), recessive/dominant timing compliance, and bus wake-up with <20 μs latency
Triple Independent High-Side Drivers HS1/HS2 rated for ≥300 mA peak load; HS3 for ≥100 mA; each features diagnostic feedback (SPI-accessible flags), thermal shutdown, and current limiting
Embedded Current Sense Amplifier Monitors load current via external shunt; rail-to-rail input, 1 MHz bandwidth, and low offset enable accurate real-time current measurement for closed-loop control
Programmable Window Watchdog Configurable timeout (97–205 ms) via external resistor on WDCONF pin; prevents MCU lockup while allowing flexible software timing margins
Dual-Die Thermal Management Analog die thermal shutdown at 155–190 °C; MCU die operates up to 125 °C junction; shared package enables coordinated thermal response without discrete sensors

Applications

Automotive Window Lift Control Automotive Sunroof Actuation

Use Scenario: Precise bidirectional control of DC motors driving glass lift mechanisms with soft-start, stall detection, and anti-pinch safety logic.

IC Role / Device Role / Timing Role: MM908E624ACPEW acts as LIN-addressable relay driver and current monitor; executes position estimation via ADC sampling of HS current and timing-based commutation.

Use Value: Integrates motor drive, diagnostics, and LIN communication in one package - reduces BOM count by ≥4 components (transceiver, regulator, op-amp, discrete HS switches) and PCB area by >35%.

Use Scenario: Reliable open/close control of sunroof panels under variable load conditions including ice, debris, or mechanical binding.

IC Role / Device Role / Timing Role: MM908E624ACPEW serves as LIN node with embedded current sensing; detects abnormal current rise (>200 mA) within 10 μs and initiates emergency stop via HS latch-off.

Use Value: Enables ASIL-B–capable safety functions (e.g., reverse torque detection) using on-chip current sense amplifier and fast fault response (<100 μs total latency).

Automotive HVAC Fan Control Industrial Relay Panel Management

Use Scenario: Multi-speed control of blower fans using PWM-modulated high-side switching, with thermal derating and over-current protection.

IC Role / Device Role / Timing Role: MM908E624ACPEW provides LIN-commanded PWM generation on HS1/HS2, monitors fan current via +E/−E inputs, and adjusts speed based on thermal feedback.

Use Value: Replaces discrete MOSFET gate drivers + current sense + LIN transceiver; achieves <1% speed regulation error across 12–16 V battery range using internal 5 V regulator and ADC reference stability.

Use Scenario: Centralized control of multiple 12/24 V relays in industrial control cabinets, with remote diagnostics and predictive maintenance via LIN network.

IC Role / Device Role / Timing Role: MM908E624ACPEW functions as smart relay driver node; reports HS on/off state, temperature, and cumulative fault counts over LIN to PLC master.

Use Value: Reduces wiring complexity by replacing 3-wire relay coils with single-wire LIN bus; enables firmware-upgradable logic and field calibration without hardware change.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side relay driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33883A Single high-side switch (not triple); no embedded MCU; requires external microcontroller and LIN transceiver Used in simpler relay nodes where MCU functionality is handled externally; lacks integrated current sense amplifier and wake-up inputs Choose when only one high-side channel is needed and system already includes a LIN-capable MCU; lower integration but higher flexibility in firmware design
MC33972 Quad high-side driver with SPI interface (no LIN PHY); includes watchdog and current sense but no embedded MCU core Designed for CAN-based systems; supports higher voltage (40 V) and current (600 mA/channel); lacks LIN physical layer and on-chip flash memory Prefer for CAN networks or applications requiring >27 V operation; requires external CAN controller and separate 5 V regulator

Compared with MM908E624ACPEW, MC33883A offers lower integration but greater design modularity, while MC33972 provides higher channel count and voltage rating at the cost of LIN compatibility and MCU autonomy - making MM908E624ACPEW uniquely suited for cost-sensitive, space-constrained LIN body electronics nodes.

Availability

MM908E624ACPEW is available at Aetrix Electronics and suitable for automotive window lift, sunroof actuation, and HVAC fan control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MM908E624ACPEW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in automotive-grade mixed-signal ICs and functional safety compliance.

The MM908E624ACPEW belongs to NXP's SmartMOS family - engineered specifically for automotive body electronics to consolidate relay control, diagnostics, and LIN communication into single-package solutions meeting AEC-Q100 Grade 2 requirements.

FAQ

What is the maximum operating junction temperature for MM908E624ACPEW?

The MM908E624ACPEW has a guaranteed parametric operating junction temperature range of −40 °C to +125 °C. The analog die thermal shutdown activates at 155–190 °C (latched off), but sustained operation above 125 °C voids specification compliance. Derating curves and thermal resistance data (θJA ≈ 40 °C/W) are provided in the Freescale datasheet Rev. 11.0 to support board-level thermal design for MM908E624ACPEW.

Does MM908E624ACPEW support direct PWM control of its high-side outputs without MCU involvement?

Yes, MM908E624ACPEW supports direct PWM control via the PWMIN pin, which independently enables or disables HS1 and HS2. When PWMIN is asserted high, HS1/HS2 follow the logic state of their respective control registers; when PWMIN is low, both outputs are forced off regardless of register state. This allows external microcontrollers or timers to modulate motor current without firmware intervention - a key feature confirmed in the Functional Description section of the MM908E624ACPEW datasheet.

How does the current sense amplifier in MM908E624ACPEW interface with the onboard ADC?

The current sense amplifier in MM908E624ACPEW outputs a buffered, amplified differential voltage on the OUT pin, referenced to VCC (5 V). This analog signal connects directly to any of the MCU's 10-bit ADC input channels (e.g., PTA0–PTA4, PTB0–PTB7). With typical gain of 20 V/V and ±25 mV input offset, the amplifier enables resolution of ~10 mA current steps across a 100 mΩ shunt - a capability explicitly supported by the MM908E624ACPEW's integrated ADC architecture and verified in the Electrical Characteristics tables.

Can MM908E624ACPEW operate with battery voltages below 9 V?

Yes, MM908E624ACPEW supports functional operation down to 5.5 V supply (VSUP), with guaranteed specifications from 9.0 V to 16 V. Below 9 V, certain parameters degrade: high-side RDS(ON) increases, regulator dropout rises, and LIN bus timing margins narrow. The device remains operational at 5.5 V (e.g., during cranking), but users must validate timing, current limits, and thermal behavior per the Static Electrical Characteristics table in the MM908E624ACPEW datasheet Rev. 11.0.

What LIN protocol versions and data rates does MM908E624ACPEW support?

MM908E624ACPEW implements the LIN physical layer compliant with ISO 9141-2 and ISO 17987-4, supporting standard LIN 1.x and 2.x frame formats. It operates at baud rates up to 20 kbps with guaranteed timing (≤50 μs propagation delay) under normal slew rate conditions. The MCU's ESCI module handles protocol stack execution; physical layer timing and bus wake-up behavior are fully characterized in the Dynamic Electrical Characteristics section of the MM908E624ACPEW datasheet.

MM908E624ACPEW Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
54-BSSOP (0.295", 7.50mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Applications:
Mirror Control
Core Processor:
HC08
Program Memory Type:
FLASH (16kB)
Controller Series:
908E
RAM Size:
512 x 8
Interface:
SCI, SPI
Number of I/O:
16
Voltage - Supply:
5.5V ~ 18V
Operating Temperature:
-40°C ~ 85°C
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-SOIC

MM908E624ACPEW FAQ

1.How can I place an order for MM908E624ACPEW through Aetrix?

Please submit a Request for Quotation (RFQ) for MM908E624ACPEW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MM908E624ACPEW reliable?

The price and inventory of MM908E624ACPEW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM908E624ACPEW is usually 5 days.

3.What payment methods are accepted for MM908E624ACPEW?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM908E624ACPEW transactions.

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MM908E624ACPEW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MM908E624ACPEW order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MM908E624ACPEW?

For technical support, including MM908E624ACPEW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM908E624ACPEW requirements.

6.How does Aetrix verify that MM908E624ACPEW is sourced from the original manufacturer or authorized distributors?

All MM908E624ACPEW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM908E624ACPEW meets industry standards.

7.What is the process for return or replacement of MM908E624ACPEW?

All MM908E624ACPEW units undergo pre-shipment inspection (PSI). If there is an issue with MM908E624ACPEW, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MM908E624ACPEW part is unused and in its original packaging.

Return procedure for MM908E624ACPEW:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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