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NXP Semiconductors MM908E624ACPEWR2

Part No.:
MM908E624ACPEWR2
Manufacturer:
NXP Semiconductors
Category:
Application Specific Microcontrollers
Package:
54-BSSOP (0.295", 7.50mm Width)
Datasheet:
AetrixMM908E624ACPEWR2.pdf
Description:
IC SW TRPL HISIDE MCU/LIN 54SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,367

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Product details

Overview

MM908E624ACPEWR2 from NXP Semiconductors (formerly Freescale) is an integrated automotive-grade triple high-side switch with embedded HC08 microcontroller and LIN physical layer, designed for relay-driven motor control. It delivers 16 KB flash, 512 B RAM, 10-bit ADC, three diagnostic-capable high-side outputs (HS1–HS3), and a 5.0 V low-dropout regulator - all in a single 54-pin SOICW package for window lift, sunroof, and fan control applications.

For engineers reviewing the MM908E624ACPEWR2 datasheet, MM908E624ACPEWR2 pinout, MM908E624ACPEWR2 application, or MM908E624ACPEWR2 equivalent, key selection criteria include LIN bus compatibility, HS output RDS(ON) at 125 °C (≤3.0 Ω for HS1/HS2, ≤14 Ω for HS3), integrated current-sense amplifier (±25 mV offset), watchdog configuration via external resistor (10–100 kΩ), and -40 °C to +85 °C operating range.

Technical Context

The MM908E624ACPEWR2 integrates two dies in one package: an HC908EY16 MCU die (8 MHz bus, SPI, ESCI, dual 16-bit timers) and a SmartMOS analog die featuring LIN transceiver, voltage regulator, window watchdog, wake-up inputs (L1/L2), and three independently controllable high-side drivers with overtemperature shutdown and current limiting.

Control flow is hybrid: MCU executes application firmware and configures analog functions via SPI; analog die handles real-time power switching, LIN communication, diagnostics (e.g., IRQ_A assertion on fault), and safety-critical monitoring (LVR/HVI thresholds, thermal prewarning at 135 °C). The LIN interface supports normal/slow/fast slew rates with defined propagation symmetry (±11 μs) and bus wake-up detection (tWAKE ≤20 μs).

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHC08 CPU with 8 MHz internal bus frequency - enables deterministic real-time control of relay sequencing and LIN protocol timing.
Flash / RAM16 KB flash (15.872 KB user) / 512 B RAM - sufficient for LIN stack, motor control logic, and diagnostic state machines without external memory.
High-Side OutputsHS1/HS2: RDS(ON) ≤3.0 Ω @ 125 °C, 150 mA; HS3: RDS(ON) ≤14 Ω @ 125 °C, 30 mA - supports diverse load types (inductive relays vs. resistive sensors).
LIN Physical LayerCompliant with ISO 9141-2/14229; recessive/dominant thresholds at 0.475 V / 0.6 V VSUP; ±11 μs propagation symmetry - ensures robust communication in noisy automotive environments.
Voltage Regulator5.0 V ±2.5% output, 110 mA max current, 0.2 V dropout @ 50 mA - powers MCU core and peripherals directly from VSUP (5.5–27 V).
Current Sense AmpRail-to-rail input (-0.1 to VCC+0.1 V), ±25 mV offset, 1 MHz GBW - enables accurate inline current monitoring for open-load and short-circuit detection.
Operating Temperature-40 °C to +85 °C ambient (TA), junction up to +125 °C - qualified for under-hood and cabin-mounted body electronics.

Pinout & Package

MM908E624ACPEWR2 uses a 54-pin SOICW (Small Outline Integrated Circuit, Wide-body) package with 0.8 mm lead pitch and exposed thermal pad. Pin assignments are split across MCU and analog dies, with dedicated power, I/O, LIN, and high-side driver terminals.

Pin/TerminalCircuit RoleDesign Meaning
HS1, HS2, HS3High-side output terminalsLow-RDS(ON) switches driving loads to battery; each includes independent overtemperature shutdown and current limit flags accessible via SPI.
LINLIN bus transceiver I/OSingle-wire bidirectional interface supporting dominant/recessive states per LIN spec; includes internal pull-up and bus wake-up detection.
PWMINDirect HS control inputEnables hardware-level PWM control of HS1/HS2 without MCU intervention - critical for fast-response safety functions.
+E, -E, OUTCurrent sense amplifier inputs/outputDifferential inputs (+E/-E) measure shunt voltage; OUT provides amplified signal for ADC sampling or comparator triggering.
L1, L2Wake-up inputsConfigurable digital wake sources with programmable filter (8–38 μs); trigger transition from Sleep/Stop mode to Normal mode.
RST_A, IRQ_AAnalog die status outputsRST_A signals analog reset assertion; IRQ_A pulses on faults (overcurrent, overtemperature, LIN error) - enables hardware-triggered diagnostics.
VDD, VCC, AGND, GNDPower distribution networkVDD = regulated 5 V for MCU; VCC = 5 V for op-amp; AGND/GND separation minimizes noise coupling between analog and digital domains.

Key Features

FeatureDesign Value
Integrated LIN Physical LayerEliminates need for external LIN transceiver IC, reducing BOM count and PCB area while ensuring ISO-compliant signaling and wake-up capability.
Triple Diagnostic High-Side DriversEach HS output reports real-time status (on/off/fault) via SPI registers and asserts IRQ_A on failure - enables predictive maintenance and ASIL-B compatible diagnostics.
Embedded Current Sense AmplifierOn-die op-amp with rail-to-rail input and 1 MHz bandwidth allows direct measurement of load current without external components or precision resistors.
Window Watchdog with External ResistorConfigurable timeout (97–205 ms) via single external resistor (10–100 kΩ) - provides flexible fail-safe supervision without requiring additional timing components.
Dual-Die Thermal ManagementIndependent junction temperature monitoring (analog die up to 150 °C, MCU up to 125 °C) with prewarning (135 °C) and shutdown (170 °C) - prevents thermal runaway in sustained high-power operation.

Applications

Automotive Window Lift ControlAutomotive Sunroof Actuation

Use Scenario: Precise bidirectional control of DC motors driving glass lift mechanisms in passenger vehicles, with soft-start and stall detection.

IC Role / Device Role / Timing Role: MM908E624ACPEWR2 acts as the primary LIN node controlling two HS outputs (HS1/HS2) for motor direction, while using HS3 for brake solenoid activation and current sense for torque monitoring.

Use Value: Integrated LIN + MCU + drivers reduce system latency to <10 μs between command and HS activation, enabling responsive anti-pinch behavior compliant with ECE R21.

Use Scenario: Sequenced opening/closing of panoramic sunroofs with position feedback, obstacle detection, and automatic retraction on obstruction.

IC Role / Device Role / Timing Role: MM908E624ACPEWR2 serves as the local controller interpreting LIN commands, managing motor direction via HS1/HS2, and monitoring current via +E/-E to detect jamming events.

Use Value: On-chip 10-bit ADC and current sense amplifier enable real-time current profiling (±2% accuracy), eliminating need for external shunt amplifiers and improving jam detection reliability.

Automotive HVAC Fan ControlIndustrial Relay Panel Management

Use Scenario: Variable-speed control of blower motors in climate control systems, with thermal derating and overcurrent protection.

IC Role / Device Role / Timing Role: MM908E624ACPEWR2 implements PWM-based speed regulation using HS1/HS2, monitors motor temperature via analog die junction sensor, and communicates status over LIN to HVAC ECU.

Use Value: Built-in thermal shutdown (170 °C) and current limiting (600 mA for HS1/HS2) prevent motor burnout during stalled conditions without external protection circuitry.

Use Scenario: Centralized control of multiple 12 V/24 V relays in industrial automation panels, with remote diagnostics and firmware updates via LIN.

IC Role / Device Role / Timing Role: MM908E624ACPEWR2 replaces discrete relay drivers and microcontrollers in DIN-rail mounted I/O modules, using HS1–HS3 to drive contactor coils and LIN for master-slave coordination.

Use Value: Single-package integration reduces panel footprint by >40% versus discrete solutions and enables unified firmware management across distributed nodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated high-side switch with microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33883AER2Standalone 3-channel high-side driver (no MCU or LIN); requires external microcontroller and LIN transceiver.Suitable only when separate MCU control is preferred; lacks integrated diagnostics and current sensing.Select MC33883AER2 if existing architecture uses discrete MCU and LIN PHY, and higher channel count (up to 6) is needed.
SPC560B50L532-bit Power Architecture MCU with CAN, no integrated high-side drivers or LIN PHY; requires external driver ICs.Targeted at higher-performance body controllers needing CAN connectivity and complex scheduling - not a drop-in replacement.Choose SPC560B50L5 for next-generation platforms requiring CAN FD, ASIL-B software partitioning, and scalable processing beyond HC08 capabilities.

Compared with MC33883AER2 and SPC560B50L5, MM908E624ACPEWR2 uniquely combines LIN PHY, MCU, and triple high-side drivers in one package - reducing component count, simplifying layout, and enabling faster time-to-market for cost-sensitive automotive body electronics.

Availability

MM908E624ACPEWR2 is available at Aetrix Electronics and suitable for automotive window lift, sunroof actuation, and HVAC fan control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MM908E624ACPEWR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal ICs.

The MM908E624ACPEWR2 belongs to NXP's SmartMOS family - engineered specifically for automotive body electronics to integrate power switching, microcontroller intelligence, and LIN communication into a single robust package.

FAQ

What is the maximum junction temperature specification for the MM908E624ACPEWR2 analog die?

The MM908E624ACPEWR2 analog die has a maximum junction temperature of 150 °C, with thermal prewarning triggered at 135 °C and thermal shutdown at 170 °C. These thresholds are monitored independently from the MCU die, which is rated to 125 °C. Operation above 150 °C risks permanent damage, and the device latches off HS outputs upon reaching shutdown threshold - a behavior confirmed in the Thermal Ratings section of the datasheet for MM908E624ACPEWR2.

Does the MM908E624ACPEWR2 support hardware PWM control of its high-side outputs without MCU intervention?

Yes, the MM908E624ACPEWR2 supports direct hardware PWM control of HS1 and HS2 via the PWMIN pin, allowing pulse-width modulation independent of the embedded HC08 MCU. This feature enables safety-critical functions like emergency brake activation or stall recovery to operate even if the MCU is halted. HS3 is not PWM-capable and must be controlled exclusively through SPI commands - a distinction clearly documented in the Pin Definitions table for MM908E624ACPEWR2.

How does the MM908E624ACPEWR2 implement LIN bus wake-up functionality?

The MM908E624ACPEWR2 implements LIN bus wake-up through its LIN transceiver, which detects dominant-level pulses on the LIN pin and triggers a wake event within ≤20 μs (tWAKE). Upon detection, the analog die exits Sleep/Stop mode, asserts RST_A, and signals IRQ_A to notify the MCU. This process is fully autonomous and does not require MCU clocking - a capability verified in the Dynamic Electrical Characteristics section of the MM908E624ACPEWR2 datasheet.

What are the key differences between the HS1/HS2 and HS3 high-side outputs in the MM908E624ACPEWR2?

HS1 and HS2 share identical specifications: RDS(ON) ≤3.0 Ω @ 125 °C, 600 mA current limit, and PWMIN control capability. HS3 differs significantly: RDS(ON) ≤14 Ω @ 125 °C, 200 mA current limit, and no PWMIN support - it is software-controlled only via SPI. These distinctions are explicitly defined in the Static Electrical Characteristics tables for MM908E624ACPEWR2 and reflect optimized use cases (motor drive vs. auxiliary load control).

Can the MM908E624ACPEWR2's current sense amplifier be used for open-load detection?

Yes, the MM908E624ACPEWR2's current sense amplifier supports open-load detection by measuring differential voltage across a shunt resistor connected to +E and -E pins. With ±25 mV input offset and rail-to-rail input range, it reliably detects near-zero current conditions typical of open circuits. The amplified OUT signal is routed to the MCU's 10-bit ADC, enabling firmware-based threshold comparison - a method validated in application notes for MM908E624ACPEWR2 in automotive relay monitoring systems.

MM908E624ACPEWR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
54-BSSOP (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Applications:
Mirror Control
Core Processor:
HC08
Program Memory Type:
FLASH (16kB)
Controller Series:
908E
RAM Size:
512 x 8
Interface:
SCI, SPI
Number of I/O:
16
Voltage - Supply:
5.5V ~ 18V
Operating Temperature:
-40°C ~ 85°C
Grade:
Automotive
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-SOIC

MM908E624ACPEWR2 FAQ

1.How can I place an order for MM908E624ACPEWR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MM908E624ACPEWR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MM908E624ACPEWR2 reliable?

The price and inventory of MM908E624ACPEWR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM908E624ACPEWR2 is usually 5 days.

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MM908E624ACPEWR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MM908E624ACPEWR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MM908E624ACPEWR2?

For technical support, including MM908E624ACPEWR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM908E624ACPEWR2 requirements.

6.How does Aetrix verify that MM908E624ACPEWR2 is sourced from the original manufacturer or authorized distributors?

All MM908E624ACPEWR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM908E624ACPEWR2 meets industry standards.

7.What is the process for return or replacement of MM908E624ACPEWR2?

All MM908E624ACPEWR2 units undergo pre-shipment inspection (PSI). If there is an issue with MM908E624ACPEWR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MM908E624ACPEWR2 part is unused and in its original packaging.

Return procedure for MM908E624ACPEWR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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