NXP Semiconductors MM908E624AYPEW

Overview

MM908E624AYPEW from NXP Semiconductors (formerly Freescale) is an integrated automotive-grade triple high-side switch with embedded HC08 microcontroller and LIN physical layer, designed for relay-driven motor control. It delivers 16 KB flash, 512 B RAM, 10-bit ADC, three diagnostic-capable high-side outputs (HS1–HS3), and a 5.0 V low-dropout regulator - all in a single 54-pin SOICW package rated for -40°C to +125°C operation.

For engineers reviewing the MM908E624AYPEW datasheet, MM908E624AYPEW pinout, MM908E624AYPEW application, or MM908E624AYPEW equivalent, this page provides verified functional identity, validated thermal and electrical specs, confirmed LIN timing behavior, real-world wake-up and diagnostic timing, and accurate MCU/analog die interface constraints - essential for automotive body electronics design validation and production qualification.

Technical Context

The MM908E624AYPEW integrates two physically separate dies - an HC908EY16 MCU die and a SmartMOS analog die - bonded in one 54-pin SOICW package. The MCU operates at up to 8 MHz bus frequency with internal clock generator, while the analog die implements LIN transceiver (ISO 17987-2 compliant), three independent high-side drivers with current limiting and overtemperature shutdown, and a rail-to-rail current sense amplifier with ±25 mV offset.

Communication between dies occurs via SPI and dedicated status/interrupt lines (RST_A, IRQ_A). Wake-up is supported through dual analog inputs (L1/L2) with programmable thresholds and deglitching (8–38 μs), and LIN bus activity triggers sleep-to-normal mode transition within 20 μs. Voltage regulation is handled by an on-die LDO delivering 4.75–5.25 V at up to 110 mA in normal mode.

Key Specifications

Pinout & Package

MM908E624AYPEW is housed in a Pb-free 54-pin SOICW (Small Outline Integrated Circuit, Wide-body) package measuring 18.5 mm × 7.6 mm × 2.65 mm (JEDEC MS-013AC), with gull-wing leads and 1.27 mm pitch. Thermal resistance θ_JA = 45°C/W (typical, JEDEC JESD51-2 test board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated high-side switch with MCU and LIN applications.

Compared with MC33883 and SPC560B50L5, MM908E624AYPEW uniquely combines MCU, LIN PHY, and three diagnostic high-side drivers in one package - reducing system-level complexity, interconnect points, and qualification effort for entry-level automotive body controllers.

Availability

MM908E624AYPEW is available at Aetrix Electronics and suitable for automotive window lift systems, sunroof actuators, HVAC fan modules, and seat adjustment units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MM908E624AYPEW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal integration and functional safety.

The MM908E624AYPEW belongs to NXP's SmartMOS family of integrated power and control ICs, engineered specifically for cost-sensitive, space-constrained automotive body electronics that demand high reliability, diagnostic capability, and LIN network compatibility.

FAQ

What is the maximum junction temperature specification for MM908E624AYPEW?

The MM908E624AYPEW has a maximum junction temperature (T_J) of 125°C for guaranteed parametric operation. Its analog die thermal shutdown activates at 155–170°C, and overtemperature prewarning triggers at 120–160°C. These thresholds are process-monitored and documented in Table 3 of the datasheet. Operation above 125°C may cause parameter drift but does not immediately disable functionality until thermal shutdown engages.

Does MM908E624AYPEW support hardware PWM control of its high-side outputs?

Yes, MM908E624AYPEW supports direct hardware PWM control of HS1 and HS2 via the PWMIN pin. This feature allows external PWM signals to drive the outputs independently of the embedded HC08 MCU, enabling fast, deterministic actuation for safety-critical or timing-sensitive functions such as anti-pinch braking or emergency stop sequences.

How does the current sense amplifier in MM908E624AYPEW interface with the MCU?

The current sense amplifier in MM908E624AYPEW provides differential inputs (+E, -E) and a buffered output (OUT), which connects to an MCU ADC channel (e.g., PTA0–PTA4 or PTB0–PTB7). The amplifier's rail-to-rail input range (-0.1 V to V_CC+0.1 V) and ±25 mV offset allow precise low-side or high-side current measurement. Its output is read by the HC08's 10-bit ADC for real-time load monitoring and fault classification.

Can MM908E624AYPEW operate without an external crystal oscillator?

Yes, MM908E624AYPEW can operate without an external crystal. Its internal clock generator module (ICG) provides a selectable RC oscillator with frequencies up to 8 MHz bus speed. External crystals (via PTC3/OSC2 and PTC4/OSC1) are optional and used only when higher timing accuracy or stability is required - for example, in LIN baud rate-critical applications.

What LIN data rate does MM908E624AYPEW support?

MM908E624AYPEW supports standard LIN 2.x data rates up to 19.2 kbps via its integrated physical layer. The LIN transceiver complies with ISO 17987-2 and supports recessive/dominant timing with ≤50 μs propagation delay (normal slew rate), ensuring interoperability with common automotive LIN masters. No external LIN controller or protocol stack is needed - the embedded HC08 executes the LIN protocol in firmware.