NXP Semiconductors MM908E625ACPEKR2

Overview

MM908E625ACPEKR2 from NXP (formerly Freescale) is an integrated automotive system-on-chip combining a 68HC908EY16 MCU core, four protected half-bridge drivers (R_DS(ON) ≤ 500 mΩ HS / 500 mΩ LS), one low-R_DS(ON) high-side switch (600 mΩ), LIN physical layer, and 5.0 V voltage regulator - all in a single 54-pin SOICW-EP package. It delivers complete motor control for mirror actuation, door lock latching, and headlight leveling via three-wire LIN bus.

For engineers reviewing the MM908E625ACPEKR2 datasheet, MM908E625ACPEKR2 pinout, MM908E625ACPEKR2 application, or MM908E625ACPEKR2 equivalent, this page provides verified technical context, validated pin functions, confirmed automotive-grade operating range (−40 °C to +85 °C), real-world diagnostic features (BEMF detection, current recopy, autonomous watchdog with cyclic wake-up), and two documented alternative parts for body electronics design.

Technical Context

The MM908E625ACPEKR2 integrates dual-die architecture: an HC08-based MCU die (16 KB Flash, 512 B RAM, 10-bit ADC, ESCI, SPI, ICG) and a SMARTMOS analog die providing power switching, LIN transceivers, and protection logic. The analog die implements autonomous fault management - including over-current shutdown (HB1–HB4: 2.8–7.5 A; HS: 3.9–7.0 A), thermal monitoring (HTI at 160 °C), and BEMF sensing (VBEMFH = −30 V, VBEMFL = −60 mV).

Communication is handled via dedicated LIN physical layer (20 kBaud default, slew-rate programmable) with internal pull-up (30 kΩ typical), recessive/dominant thresholds referenced to VSUP, and integrated wake-up detection (VWTH = VSUP/2). Power sequencing is coordinated across dies: HVDD supplies Hall sensors (switchable 5.0 V), while VDD powers the MCU, regulated from VSUP (8–18 V) with ±25 mV load regulation at 60 mA.

Key Specifications

Pinout & Package

MM908E625ACPEKR2 uses a 54-pin SOICW-EP (wide-body surface-mount) package with exposed thermal pad (EP) for enhanced heat dissipation. Pin count and layout match Freescale document 98ARL10519D.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive motor control applications.

Compared with MC33883 and MLX81205, MM908E625ACPEKR2 uniquely combines MCU, LIN PHY, HVDD, Hall inputs, and four half-bridges in one package - making it optimal for cost-sensitive, space-constrained body electronics modules where integration reduces PCB area and validation effort.

Availability

MM908E625ACPEKR2 is available at Aetrix Electronics and suitable for automotive mirror control, door lock actuation, and headlight auto-leveling applications requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for MM908E625ACPEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors develops high-reliability automotive ICs with focus on functional safety, power efficiency, and system integration for body electronics and powertrain applications.

The MM908E625ACPEKR2 belongs to NXP's SMARTMOS family - engineered to consolidate MCU, power drivers, and communication into single-package solutions for automotive body control modules (BCMs) and actuator nodes.

FAQ

What is the maximum continuous current rating for the half-bridge outputs in MM908E625ACPEKR2?

The MM908E625ACPEKR2 half-bridge outputs (HB1–HB4) support continuous load currents up to 2.8–7.5 A depending on configuration and thermal conditions, with over-current shutdown triggered at IHBLSOC = 2.8 A (low-side) and IHBHSOC = 4.0 A (high-side). Actual sustained current is limited by package thermal resistance and PCB copper area; derating is required above 85 °C ambient.

Does MM908E625ACPEKR2 include an internal voltage regulator for the MCU core?

Yes, MM908E625ACPEKR2 includes an integrated voltage regulator that generates a stable 5.0 V output (VDD) for the embedded HC08 MCU core. The regulator accepts 8–18 V input (VSUP), maintains ±25 mV load regulation at 60 mA, and operates across −40 °C to +85 °C ambient temperature.

How does the BEMF feature work in MM908E625ACPEKR2 and what is its purpose?

In MM908E625ACPEKR2, the BEMF pin outputs an analog signal representing back-electromotive force generated during motor rotation. It is used primarily for stall detection in stepper motor applications. The signal must be connected directly to PTD0/TACH0/BEMF on the MCU die, where dedicated hardware evaluates thresholds (VBEMFH = −30 V, VBEMFL = −60 mV) to detect rotor lock.

Can MM908E625ACPEKR2 operate without an external crystal or resonator?

Yes, MM908E625ACPEKR2 can operate without an external crystal because it includes an Internal Clock Generation (ICG) module with factory-trimmed accuracy (±2% after trim). The ICG supports internal oscillator frequencies up to 8 MHz bus speed, sufficient for LIN communication and motor control timing - eliminating need for external timing components.

What is the function of the FGEN pin on MM908E625ACPEKR2?

The FGEN pin on MM908E625ACPEKR2 accepts an external PWM signal's period (0.1–20 kHz) to configure current-limiting behavior for both half-bridge and high-side outputs. It is not a duty-cycle input; the device internally generates the required PWM waveform based on the supplied period, enabling precise inrush and overload current control without MCU overhead.