NXP Semiconductors MM908E626AVPEK
- Part No.:
- MM908E626AVPEK
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MM908E626AVPEK.pdf
- Description:
- IC STEPPER MOTOR DRVR 54SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MM908E626AVPEK from NXP (formerly Freescale) is an integrated automotive stepper motor driver combining a 68HC08EY16 microcontroller and SMARTMOS analog control IC in a single 54-pin SOICW-EP package. It delivers 4 half-bridge outputs (RDS(ON) ≤ 500 mΩ), LIN physical layer compliance, embedded 16 KB flash/512 B RAM, and operates across -40 °C to +115 °C for climate control and headlight leveling systems.
For engineers reviewing the MM908E626AVPEK datasheet, MM908E626AVPEK pinout, MM908E626AVPEK application, or MM908E626AVPEK equivalent, key selection criteria include LIN bus interface timing, HB1–HB4 current-limiting configuration via FGEN, BEMF-based stall detection using PTD0/TACH0/BEMF, and thermal management of dual-die operation under 12 V automotive supply.
Technical Context
The MM908E626AVPEK integrates two physically separate dies: an HC08 MCU die (68HC908EY16 core, 8 MHz bus, 10-bit ADC, ESCI, SPI) and an analog SMARTMOS die (LIN transceiver, 4 half-bridges, voltage regulator, autonomous watchdog). Communication between dies occurs via dedicated SPI signals (SS, MOSI, MISO, SPSCK) and shared interrupt/reset lines (IRQ_A/RST_A).
Its LIN physical layer supports 20 kbaud with programmable slew rate, recessive/dominant thresholds referenced to VSUP, and wake-up capability. The analog die provides diagnostic features including BEMF monitoring (VBEMFH/VBEMFL thresholds), current recopy (7.0 V/A ratio), and overcurrent shutdown (3.0–7.5 A per half-bridge).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 68HC08EY16 MCU with 8 MHz internal bus frequency and 16 KB flash/512 B RAM |
| Half-Bridge Outputs | Four independent HB1–HB4 outputs, each with high-side RDS(ON) ≤ 500 mΩ and low-side RDS(ON) ≤ 500 mΩ at 25 °C |
| LIN Compliance | Single-wire LIN 2.0/2.1 physical layer with 20 kbaud default, VIL/VIH thresholds tied to VSUP, ±1.0 µA RXD leakage |
| Operating Temperature | -40 °C to +115 °C case temperature, junction limited to +135 °C with thermal coupling between MCU and analog dies |
| Voltage Regulation | Integrated 5.0 V regulator (VDD) with ±250 mV load regulation at 60 mA; switchable HVDD output rated for 30 mA with overcurrent shutdown |
| BEMF Detection | Dedicated BEMF pin with programmable thresholds: VBEMFH = 0 V (max), VBEMFL = -5.0 mV (max), hysteresis = 30 mV |
| Current Limiting | Five selectable low-side current limits (210–880 mA) controlled by CLS2:CLS0 pins on analog die |
Pinout & Package
MM908E626AVPEK uses a 54-pin SOICW-EP (exposed pad) package with thermally enhanced construction. Pin assignments are split between MCU die (e.g., PTA0–PTA4, PTB1/AD1, PTC2/MCLK, PTD0/TACH0/BEMF, PTE1/RXD) and analog die (e.g., HB1–HB4, LIN, FGEN, BEMF, RST_A, IRQ_A, VSUP1–VSUP3, GND1–GND2, HVDD, VDD, VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HB1–HB4 | Half-bridge power outputs | Configurable as stepper phase drivers, DC motor H-bridges, or discrete high/low-side switches with integrated short-circuit and overtemperature protection |
| PTD0/TACH0/BEMF | MCU input pin | Direct connection point for analog die BEMF signal enabling stall detection and coil fault diagnosis in stepper applications |
| FGEN | Analog die input | Accepts PWM period signal (0.1–20 kHz) to configure low-side current limiting without requiring duty-cycle control |
| LIN | LIN bus interface | Single-wire bidirectional LIN transceiver I/O supporting standard automotive 3-wire bus topology (VSUP, GND, LIN) |
| RST_A / IRQ_A | Analog die control | Open-drain reset/interrupt outputs tied to MCU RST/IRQ pins for coordinated system-level fault handling and wake-up signaling |
| VDD / HVDD | Regulated supplies | VDD powers MCU core (5.0 V ±250 mV); HVDD provides switchable 5.0 V for external sensors (30 mA max, short-circuit protected) |
| VSUP1–VSUP3 / GND1–GND2 | Power distribution | Multiple parallel supply/ground pins reduce IR drop and improve thermal performance for high-current half-bridge operation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LIN Physical Layer | Eliminates need for external LIN transceiver; supports wake-up, diagnostics, and 20 kbaud communication directly from MCU ESCI module |
| BEMF-Based Stall Detection | Hardware-accelerated back-EMF monitoring via dedicated analog pin and MCU BEMF counter module enables real-time motor stall/failure identification |
| Configurable Half-Bridge Current Limits | Five discrete current limit settings (210–880 mA) selected via CLS2:CLS0 pins allow precise torque/speed tuning without firmware changes |
| Dual-Die Thermal Management | Exposed pad (EP) and separate VSUP/GND pins enable efficient heat dissipation from both MCU and analog dies under continuous 1.0 A load per bridge |
| Autonomous Watchdog & Cyclic Wake-up | On-die AWD oscillator (40 µs period) provides independent safety monitoring and low-power periodic wake-up without MCU intervention |
Applications
| Climate Control Actuators | Adaptive Headlight Leveling |
|---|---|
Use Scenario: Precise positioning of HVAC blend doors and air flaps in automotive cabin climate systems. IC Role / Device Role / Timing Role: MM908E626AVPEK serves as closed-loop stepper controller with LIN command interface, BEMF feedback, and 4-phase drive sequencing. Use Value: Enables accurate position control using BEMF-based stall detection instead of mechanical end-stops, reducing calibration complexity and component count. |
Use Scenario: Dynamic adjustment of headlight vertical aim based on vehicle pitch angle and load conditions. IC Role / Device Role / Timing Role: MM908E626AVPEK executes LIN-commanded step sequences while monitoring motor current and temperature for safe operation. Use Value: Integrates motor drive, diagnostics, and LIN communication in one package-reducing PCB area by >40% versus discrete MCU + driver + transceiver solutions. |
| Seat Position Memory Systems | Power Sunroof Drives |
Use Scenario: Motorized seat track and backrest adjustment with position memory and soft-start functionality. IC Role / Device Role / Timing Role: MM908E626AVPEK manages multi-phase stepping, current ramping, and LIN-synchronized position reporting. Use Value: Leverages embedded 16 KB flash to store multiple seat profiles and execute smooth acceleration/deceleration profiles without external memory. |
Use Scenario: Controlled opening/closing of panoramic sunroofs with obstacle detection and anti-pinch logic. IC Role / Device Role / Timing Role: MM908E626AVPEK monitors HB1–HB4 current recopy (7.0 V/A) and BEMF to detect mechanical obstruction during travel. Use Value: Provides hardware-level current sensing and fast-response overcurrent shutdown (<100 µs), meeting ISO 12646 anti-pinch requirements without additional ASICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated stepper motor driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33816AEKR2 | 32-bit S12ZVM MCU core, 64 KB flash, 6 half-bridges, CAN+LIN dual interface, higher integration but larger 64-pin QFP package | Supports CAN-based body networks and higher-power motors (>2 A per bridge); requires CAN infrastructure not needed for pure LIN systems | Select MC33816AEKR2 when CAN bus connectivity, higher processing bandwidth, or >1.5 A per channel is required; MM908E626AVPEK remains optimal for cost-sensitive LIN-only stepper control. |
| BD3901FV-ME2 | Standalone LIN stepper driver (no embedded MCU), 4 half-bridges, 5 V regulator, BEMF detection, but relies on external microcontroller for sequencing logic | Requires external MCU for motion control algorithms and LIN protocol stack-increasing BOM count and software development effort | Choose BD3901FV-ME2 only if existing MCU resources are available and separation of control/driver functions is preferred; MM908E626AVPEK reduces total system complexity with integrated HC08 core. |
Compared with MC33816AEKR2 and BD3901FV-ME2, MM908E626AVPEK uniquely balances embedded control (16 KB flash, ESCI, ADC), LIN interface, and 4-channel half-bridge drive in a compact SOICW-EP package-making it ideal for space-constrained, LIN-only automotive stepper applications where full CAN capability or external MCU coordination is unnecessary.
Availability
MM908E626AVPEK is available at Aetrix Electronics and suitable for automotive climate control, adaptive lighting, seat actuation, and power sunroof systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MM908E626AVPEK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors develops high-reliability automotive ICs with focus on functional safety, power efficiency, and system integration for body electronics and powertrain applications.
The MM908E626AVPEK belongs to NXP's SMARTMOS family of integrated motor drivers, designed specifically for cost-effective, space-efficient LIN-based stepper motor control in automotive comfort systems.
FAQ
What is the maximum operating temperature for MM908E626AVPEK?
The MM908E626AVPEK has a specified operating case temperature range of -40 °C to +115 °C. Its junction temperature must not exceed +135 °C, with thermal coupling between the MCU and analog dies requiring careful PCB layout and heatsinking-especially when driving 1.0 A loads continuously through HB1–HB4. The exposed pad (EP) must be soldered to a thermal plane for reliable operation at maximum ratings.
How does MM908E626AVPEK implement BEMF-based stall detection?
The MM908E626AVPEK implements BEMF-based stall detection by routing the analog die's BEMF pin directly to MCU pin PTD0/TACH0/BEMF. The MCU's dedicated BEMF counter module samples this signal to identify zero-crossings and amplitude anomalies. When BEMF falls below VBEMFL (-5.0 mV) or exceeds VBEMFH (0 V) with insufficient hysteresis, the system triggers stall or coil-failure flags-enabling closed-loop position verification without external sensors.
Can MM908E626AVPEK drive a unipolar stepper motor?
No, MM908E626AVPEK is designed exclusively for bipolar stepper motors using its four half-bridge outputs (HB1–HB4) in dual-H-bridge configuration. It lacks the center-tap drive architecture required for unipolar steppers. Each half-bridge supports bidirectional current flow, enabling full-step, half-step, and microstepping modes-but only with 4-wire or 6-wire bipolar motors, not 5-wire unipolar variants.
What LIN baud rate does MM908E626AVPEK support by default?
The MM908E626AVPEK's LIN physical layer defaults to 20 kbaud with initial slew rate selection (SRS0:SRS1 = 00), as confirmed in Table 3 and Figure 4 of the datasheet. While the LIN specification allows 1–20 kbaud, the device's timing parameters-including tTXD-LIN-LOW (≤6.0 µs) and slew rates (1.0–3.0 V/µs)-are characterized and guaranteed only at this default rate. Deviations require validation against LIN conformance test plans.
Is external decoupling required for MM908E626AVPEK's VDD and HVDD outputs?
Yes, external decoupling is mandatory: a minimum 10 µF low-ESR capacitor must be placed between VDD and VSS to stabilize the 5.0 V MCU supply, and a 1 µF ceramic capacitor is required between HVDD and VSS for the switchable 5.0 V output. These capacitors prevent voltage droop during high-current half-bridge switching events and ensure reliable LIN transceiver operation and ADC reference stability.
MM908E626AVPEK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- Mirror Control
- Core Processor:
- HC08
- Program Memory Type:
- FLASH (16kB)
- Controller Series:
- 908E
- RAM Size:
- 512 x 8
- Interface:
- SCI, SPI
- Number of I/O:
- 13
- Voltage - Supply:
- 8V ~ 18V
- Operating Temperature:
- -40°C ~ 115°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-SOIC-EP
MM908E626AVPEK FAQ
1.How can I place an order for MM908E626AVPEK through Aetrix?
Please submit a Request for Quotation (RFQ) for MM908E626AVPEK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MM908E626AVPEK reliable?
The price and inventory of MM908E626AVPEK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM908E626AVPEK is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM908E626AVPEK transactions.
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MM908E626AVPEK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MM908E626AVPEK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MM908E626AVPEK?
For technical support, including MM908E626AVPEK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM908E626AVPEK requirements.
6.How does Aetrix verify that MM908E626AVPEK is sourced from the original manufacturer or authorized distributors?
All MM908E626AVPEK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM908E626AVPEK meets industry standards.
7.What is the process for return or replacement of MM908E626AVPEK?
All MM908E626AVPEK units undergo pre-shipment inspection (PSI). If there is an issue with MM908E626AVPEK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MM908E626AVPEK part is unused and in its original packaging.
Return procedure for MM908E626AVPEK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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