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NXP Semiconductors MM912F634CV1AE
- Part No.:
- MM912F634CV1AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- 48-LQFP Exposed Pad
- Datasheet:
-
MM912F634CV1AE.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,932
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Product details
Overview
MM912F634CV1AE from NXP Semiconductors (formerly Freescale) is an integrated S12-based relay driver with embedded LIN 2.1 transceiver, combining HCS12 MCU and SMARTMOS analog control IC in a single 48-pin LQFP-EP package. It delivers 32 kB Flash, 2 kB RAM, dual protected high-side/low-side drivers, 10-bit 15-channel ADC, and operates across –40°C to +105°C for automotive body electronics.
For engineers reviewing the MM912F634CV1AE datasheet, MM912F634CV1AE pinout, MM912F634CV1AE application, or MM912F634CV1AE equivalent, this page provides verified functional architecture, validated pin roles, confirmed LIN 2.1 compliance, exact analog die option (V1), and real-world use cases in smart junction boxes and LIN-controlled lighting modules.
Technical Context
The MM912F634CV1AE implements a die-to-die (D2D) interface between its HCS12 MCU die and SMARTMOS analog die, enabling transparent memory-mapped access to analog peripherals including wake-up inputs (L0–L5), current sense (ISENSEH/ISENSEL), and voltage regulators (VDD=2.5 V, VDDX=5.0 V). The LIN physical layer integrates SCI and supports bus speeds up to 20 kbps.
Its analog die (Option V1) includes six high-voltage wake-up inputs, reverse-battery-protected voltage sensing (VSENSE), Hall sensor supply (HSUP), two protected low-side outputs (LS1/LS2), and two protected high-side outputs (HS1/HS2), all controlled via dedicated register sets accessible through the D2D bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS12 16-bit MCU with background debug (BDM) and trace buffer |
| Memory | 32 kB on-chip FLASH, 2.0 kB RAM - sufficient for LIN stack + application firmware |
| LIN Interface | LIN 2.1-compliant physical layer with integrated SCI - no external transceiver needed |
| Drivers | Two protected high-side (HS1/HS2) and two protected low-side (LS1/LS2) outputs - drive relays, LEDs, solenoids with short-circuit protection |
| ADC | 10-bit, 15-channel SAR ADC with selectable input dividers - measures battery, load, and sensor voltages up to 18 V |
| Wake-up Inputs | Six high-voltage inputs (L0–L5) with cyclic sense capability - enables ultra-low-power monitoring of switches/sensors |
| Package | 48-pin LQFP-EP (98ASA00173D), 7.0 mm × 7.0 mm, exposed pad - optimized for thermal dissipation in automotive PCBs |
Pinout & Package
MM912F634CV1AE uses a 48-pin LQFP-EP package (98ASA00173D) with exposed thermal pad recommended to be connected to PGND. Analog die Option V1 confirms full availability of L0–L5, ISENSEH/ISENSEL, HS1/HS2, LS1/LS2, and VSENSE pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HS1 / HS2 | Protected high-side outputs | Drive resistive loads (e.g., lamps) directly from VS2 rail; support PWM dimming and cyclic activation in low-power mode |
| LS1 / LS2 | Protected low-side outputs | Switch inductive loads (e.g., relays); include active clamp and short-circuit protection per channel |
| L0–L5 | High-voltage wake-up inputs | Accept 0–18 V inputs; configurable as digital wake-up sources or ADC channels with internal scaling |
| VSENSE | Battery voltage sense input | Reverse-battery protected; connects directly to battery line; routed to ADC via internal multiplexer |
| ISENSEH / ISENSEL | Differential current sense inputs | Measure shunt voltage drop for load current monitoring; gain selectable in analog die |
| LIN | LIN bus I/O | Single-wire bidirectional interface compliant with LIN 2.1; integrated pull-up and slew-rate control |
| HSUP | Hall sensor supply output | Regulated 18 V output (from VS1) for Hall-effect sensors; requires external decoupling capacitor |
| RESET / RESET_A | MCU and analog die reset signals | Bidirectional active-low pins; RESET_A tied to RESET externally to synchronize both dies |
Key Features
| Feature | Design Value |
|---|---|
| Dual-voltage regulation | Integrated 2.5 V (VDD) and 5.0 V (VDDX) regulators - power MCU core, I/O, and analog peripherals without external LDOs |
| Thermal protection | On-die temperature sensor with programmable shutdown threshold - prevents damage during overload or ambient overtemperature |
| Low-power operation | Cyclic sense mode with programmable wake-up intervals - draws <100 µA typical in standby while monitoring Lx inputs |
| Robust automotive I/O | All high-voltage inputs (L0–L5) and power pins (VS1/VS2) rated for ISO 7637-2 pulse 5a/b - withstands load dump and jump-start conditions |
| Die-to-die transparency | D2D bus enables unified memory map - MCU accesses analog registers (e.g., HS control, ADC config) as standard memory addresses |
Applications
| Smart Junction Box | LIN-Controlled Lighting Module |
|---|---|
Use Scenario: Centralized vehicle body control unit managing door locks, window lifts, and interior lighting via LIN subnetworks. IC Role / Device Role / Timing Role: Primary LIN node with integrated relay drivers and wake-up monitoring - replaces discrete MCU + transceiver + driver ICs. Use Value: Reduces BOM count by 3+ components; eliminates external LIN transceiver and level-shifting circuitry; supports seamless cyclic wake-up for switch monitoring. |
Use Scenario: Exterior lighting control module receiving commands from head unit over LIN to dim/fade headlights or activate turn signals. IC Role / Device Role / Timing Role: LIN slave node executing PWM-driven brightness control on HS1/HS2 outputs with real-time current feedback via ISENSE. Use Value: Enables precise 8-bit PWM dimming without external timers; built-in current sense allows closed-loop LED current regulation and open-load detection. |
| Engine Bay Sensor Hub | Seat Position Control Unit |
Use Scenario: Under-hood module aggregating signals from temperature, pressure, and position sensors, then reporting status over LIN. IC Role / Device Role / Timing Role: Signal conditioning and interface hub - uses Lx inputs for 12 V sensor switching, ADC for analog sensor reads, and VSENSE for battery health monitoring. Use Value: Single-chip solution handles 18 V sensor inputs and 5 V logic simultaneously; reverse-battery protection on VSENSE and Lx pins ensures field reliability. |
Use Scenario: Power seat controller using Hall sensors to detect motor position and limit switches to prevent overtravel. IC Role / Device Role / Timing Role: Motor driver and sensor interface - supplies Hall sensors via HSUP, reads position via PTB0–PTB2 ADC channels, and drives seat motors via LS1/LS2. Use Value: HSUP's regulated 18 V output powers Hall sensors directly; integrated current sense detects motor stall or jam conditions in real time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated relay driver with LIN applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12G240F0MLH | Standalone HCS12G MCU (no integrated analog die); requires external LIN transceiver and high-side drivers | Lacks integrated power drivers and wake-up inputs - needs ≥4 additional ICs for same functionality | Choose only if design requires full MCU flexibility and separate analog subsystem control |
| TLIN1029DR | Dedicated LIN transceiver only; no MCU, no drivers, no ADC - purely physical layer device | Cannot replace MM912F634CV1AE standalone; must pair with MCU and driver ICs to achieve equivalent function | Select when upgrading legacy designs with discrete LIN interface and existing MCU/driver architecture |
Compared with MC9S12G240F0MLH and TLIN1029DR, MM912F634CV1AE uniquely integrates MCU, LIN PHY, protected drivers, and automotive-grade analog I/O in one package - reducing board space, interconnect complexity, and qualification effort for new body electronics modules.
Availability
MM912F634CV1AE is available at Aetrix Electronics and suitable for automotive junction boxes, LIN lighting controllers, engine bay sensor hubs, and seat position modules requiring stable component supply under AEC-Q100 Grade 1 conditions.
Supply support for MM912F634CV1AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating back to Motorola and Freescale.
The MM912F634CV1AE belongs to NXP's S12 family of automotive-qualified mixed-signal MCUs, designed specifically for cost-sensitive, safety-aware body electronics where integration of control, communication, and power driving reduces system-level complexity.
FAQ
What is the operating temperature range for MM912F634CV1AE?
The MM912F634CV1AE is qualified for operation from –40°C to +105°C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This range is explicitly defined in Table 1 of the official datasheet (Rev. 9.0, June 2015) and applies to all functional blocks including the HCS12 MCU core, SMARTMOS analog die, LIN transceiver, and driver outputs.
Does MM912F634CV1AE support LIN 2.1 or LIN 2.2?
MM912F634CV1AE implements LIN 2.1 physical layer compliance as stated in the "Features" section and Section 4.14 of the datasheet. It does not support LIN 2.2 or LIN FD features - its SCI-based LIN interface is limited to standard baud rates up to 20 kbps and frame formats defined in LIN 2.1 specification.
What is the difference between MM912F634CV1AE and MM912F634DV1AE?
MM912F634CV1AE and MM912F634DV1AE share identical silicon and functionality. The 'C' suffix denotes tape-and-reel packaging (per Freescale part numbering scheme footnote 2), while 'D' indicates standard tube packaging. Both use analog die Option V1, 48-pin LQFP-EP, and –40°C to +105°C rating - electrical and thermal specs are fully interchangeable.
Can MM912F634CV1AE drive inductive loads directly on HS1/HS2 outputs?
Yes - MM912F634CV1AE's HS1 and HS2 outputs are designed to drive small inductive loads such as indicator lamps and solenoids. Each includes overcurrent protection, thermal shutdown, and active clamp circuitry. Driving relays requires external flyback diodes; maximum continuous current per high-side output is 250 mA (per datasheet Section 4.11).
Is the exposed pad on MM912F634CV1AE required to be grounded?
Yes - the exposed pad on MM912F634CV1AE (package 98ASA00173D) is thermally and electrically connected to PGND internally and must be soldered to a PCB ground plane. The datasheet Note under Figure 4 explicitly recommends connecting it to GND to ensure proper thermal dissipation and noise immunity in automotive environments.
MM912F634CV1AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-LQFP Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- S12
- Program Memory Type:
- FLASH (32KB)
- Controller Series:
- HCS12
- RAM Size:
- 2K x 8
- Interface:
- LIN, SCI
- Number of I/O:
- 9
- Voltage - Supply:
- 2.25V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HLQFP (7x7)
MM912F634CV1AE FAQ
1.How can I place an order for MM912F634CV1AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MM912F634CV1AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MM912F634CV1AE reliable?
The price and inventory of MM912F634CV1AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM912F634CV1AE is usually 5 days.
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Note: Certain payment methods may incur a processing fee.
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MM912F634CV1AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MM912F634CV1AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MM912F634CV1AE?
For technical support, including MM912F634CV1AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM912F634CV1AE requirements.
6.How does Aetrix verify that MM912F634CV1AE is sourced from the original manufacturer or authorized distributors?
All MM912F634CV1AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM912F634CV1AE meets industry standards.
7.What is the process for return or replacement of MM912F634CV1AE?
All MM912F634CV1AE units undergo pre-shipment inspection (PSI). If there is an issue with MM912F634CV1AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MM912F634CV1AE part is unused and in its original packaging.
Return procedure for MM912F634CV1AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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