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NXP Semiconductors MM912F634DV2AER2
- Part No.:
- MM912F634DV2AER2
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- 48-LQFP Exposed Pad
- Datasheet:
-
MM912F634DV2AER2.pdf
- Description:
- IC MCU DUAL LS/HS SWITCH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,310
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Product details
Overview
MM912F634DV2AER2 from NXP Semiconductors (formerly Freescale) is an integrated S12-based relay driver with LIN 2.1 physical layer, combining an HCS12 microcontroller (32 kB Flash, 2 kB RAM) and SMARTMOS analog control IC in a single 48-pin LQFP-EP package. It delivers two protected high-side outputs, two protected low-side outputs, six high-voltage wake-up inputs (L0–L5), and supports automotive body electronics applications including smart junction boxes and lighting control modules.
For engineers reviewing the MM912F634DV2AER2 datasheet, MM912F634DV2AER2 pinout, MM912F634DV2AER2 application, or MM912F634DV2AER2 equivalent, key selection criteria include its integrated LIN transceiver, dual high-/low-side driver protection architecture, current sense module (ISENSEH/ISENSEL), cyclic wake-up capability, and automotive-grade temperature range (−40 °C to +105 °C).
Technical Context
The MM912F634DV2AER2 implements a die-to-die (D2D) interface between its MCU die (HCS12 core) and analog die, enabling transparent memory-mapped access to analog peripherals including high-voltage inputs, driver outputs, and sensor interfaces. Its LIN 2.1 PHY integrates SCI functionality and supports bus speeds up to 20 kbps with built-in ESD and transient protection per ISO 7637-2.
It features dual voltage regulators (2.5 V for MCU core/Flash, 5.0 V for I/O), reverse-battery-protected VS1/VS2 supply inputs, and a dedicated Hall sensor supply (HSUP, 18 V regulated). The analog die option 2 (indicated by 'V2' in part number) excludes the current sense module and limits wake-up inputs to L0–L3 - confirmed by Table 2 of the official datasheet.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS12 16-bit CPU with background debug (BDM) and trace buffer; enables real-time firmware debugging without halting execution. |
| Memory | 32 kB on-chip FLASH (programmable in-system), 2 kB RAM; sufficient for LIN node firmware with driver control logic and diagnostics. |
| LIN Interface | LIN 2.1 compliant physical layer with integrated SCI; supports master/slave operation and automatic sync field detection for robust automotive network integration. |
| Driver Outputs | Two protected high-side (HS1, HS2) and two protected low-side (LS1, LS2) outputs; each includes short-circuit protection, active clamp, and PWM controllability for relay/LED load switching. |
| High-Voltage Inputs | Six Lx pins (L0–L5) supporting digital input, analog measurement (0–18 V via selectable divider), and wake-up/cyclic sense; L4/L5 disabled in Analog Option 2 (V2). |
| Operating Range | −40 °C to +105 °C ambient temperature; qualified for under-hood and body-control module environments per AEC-Q100 requirements. |
| Package | 48-pin LQFP with exposed pad (AE suffix); thermal pad improves heat dissipation during sustained high-side output conduction. |
Pinout & Package
MM912F634DV2AER2 is housed in a 7.0 mm × 7.0 mm 48-pin LQFP-EP package (98ASA00173D) with exposed thermal pad recommended to be connected to PGND for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HS1 / HS2 | High-side driver outputs | Switched 12 V loads (e.g., lamps, solenoids); internally protected against overcurrent, overtemperature, and load dump; support PWM dimming/control. |
| LS1 / LS2 | Low-side driver outputs | Drive inductive loads (e.g., relays, motors); feature active clamp circuitry to suppress flyback voltage and prevent MOSFET damage. |
| L0–L3 | High-voltage wake-up/analog inputs | Accept 0–18 V inputs; configurable as digital wake-up sources or ADC channels with internal scaling; L4/L5 not functional in Analog Option 2 (V2). |
| LIN | LIN bus I/O | Single-wire bidirectional LIN PHY interface; integrates bus driver, receiver, and slew-rate control per LIN 2.1 spec; requires no external transceiver. |
| VSENSE | Battery voltage sense input | Direct connection to vehicle battery; internal reverse-battery protection and voltage divider enable accurate monitoring without external components. |
| RESET / RESET_A | MCU and analog die reset signals | Bi-directional active-low reset lines; RESET_A (analog die) must be externally tied to RESET (MCU) for synchronized initialization. |
| HSUP | Hall sensor supply output | Regulated 18 V output (from VS1); powers Hall-effect sensors directly; includes external capacitor requirement (CHSUP) for stability. |
Key Features
| Feature | Design Value |
|---|---|
| Dual voltage regulation | Integrated 2.5 V (VDD) and 5.0 V (VDDX) regulators eliminate need for external LDOs; reduces BOM count and PCB footprint in space-constrained modules. |
| Cyclic wake-up mode | Enables ultra-low-power operation (<100 µA typical) with periodic activation of HS/LS outputs and Lx inputs; ideal for always-on automotive nodes requiring event-triggered response. |
| LIN 2.1 compliance | Full physical layer implementation including bus fault detection, dominant timeout, and auto-resynchronization; ensures interoperability with standard LIN masters and slaves. |
| Protected driver architecture | Each HS/LS output includes diagnostics (open-load, short-to-battery, short-to-ground), thermal shutdown, and current limiting - reducing need for external protection circuitry. |
| Die-to-die transparency | D2D interface maps analog die registers into MCU memory space; simplifies firmware development by enabling unified register access without custom drivers or message passing. |
Applications
| Smart Junction Box | Automotive Lighting Control |
|---|---|
Use Scenario: Centralized power distribution unit managing switched 12 V loads across vehicle body systems (doors, trunk, HVAC). IC Role / Device Role / Timing Role: Integrated relay driver with LIN interface acts as intelligent load switch controller; handles load sequencing, diagnostics, and network communication. Use Value: Reduces wiring harness complexity and ECU count by consolidating discrete switches and LIN transceivers into one AEC-Q100-qualified device. |
Use Scenario: Adaptive headlight or interior LED control module requiring PWM dimming, overvoltage protection, and LIN-based configuration. IC Role / Device Role / Timing Role: High-side driver with integrated 5 V regulator and LIN PHY serves as self-contained lighting node controller. Use Value: Enables precise 0–100% PWM dimming via TIM/PWM modules while providing real-time fault reporting (open-circuit, overtemp) over LIN bus. |
| Seat Position Memory Module | Window Lift Control Unit |
Use Scenario: Motorized seat control system storing position data and driving actuators via relays or H-bridges. IC Role / Device Role / Timing Role: MCU + analog driver combo executes position sensing logic, drives motor relays (LS1/LS2), and communicates seat status via LIN. Use Value: On-chip ADC (10-bit, 15-channel) reads potentiometer feedback; cyclic wake-up allows low-power position monitoring without continuous MCU operation. |
Use Scenario: One-touch window lift/down control with anti-pinch detection and LIN-based diagnostic reporting. IC Role / Device Role / Timing Role: Low-side drivers (LS1/LS2) switch window motor direction; high-voltage inputs (L0–L3) monitor switch states and detect stall current via ISENSE (not present in V2). Use Value: Built-in wake-up inputs enable immediate response to window switch press; LIN interface allows OEM-level calibration and error code retrieval. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar relay driver with LIN applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33816 | Standalone LIN transceiver + high-side driver IC (no embedded MCU); requires external microcontroller for logic. | Lacks integrated MCU, ADC, and timer resources - suitable only when existing host MCU handles control algorithms. | Select MC33816 when system already uses a separate MCU and only needs LIN-compliant driver expansion. |
| MM912F634DV1AER2 | Same package and core, but Analog Option 1: includes current sense module (ISENSEH/ISENSEL) and full L0–L5 wake-up support. | Enables current-based diagnostics (e.g., motor stall detection) and broader wake-up coverage - required for safety-critical or high-diagnostic-depth applications. | Choose MM912F634DV1AER2 if current monitoring or all six wake-up inputs are mandatory for your design. |
Compared with MC33816, MM912F634DV2AER2 reduces system component count and software complexity by integrating MCU, LIN PHY, and drivers; versus MM912F634DV1AER2, it trades current sensing and two wake-up inputs for lower cost and simplified analog routing - ideal for cost-sensitive body control modules where those features are unused.
Availability
MM912F634DV2AER2 is available at Aetrix Electronics and suitable for automotive body electronics, smart junction boxes, and lighting control modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MM912F634DV2AER2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive microcontrollers and analog power systems.
The MM912F634 series belongs to NXP's legacy S12-based automotive system basis chips (SBCs), designed specifically for intelligent power distribution and LIN-connected body electronics - emphasizing integration, functional safety readiness, and AEC-Q100 reliability.
FAQ
What is the operating temperature range for MM912F634DV2AER2?
The MM912F634DV2AER2 is rated for −40 °C to +105 °C ambient operation, meeting AEC-Q100 Grade 2 requirements for automotive under-hood and body-control applications. This range is validated across all electrical parameters in the official datasheet Rev. 9.0, including driver output characteristics, LIN bus timing, and ADC accuracy.
Does MM912F634DV2AER2 include an integrated LIN transceiver?
Yes, MM912F634DV2AER2 integrates a fully compliant LIN 2.1 physical layer transceiver on-die, eliminating the need for an external LIN transceiver IC. The LIN pin supports single-wire bus communication at up to 20 kbps, with built-in protection against ESD, load dump, and ground shift per ISO 7637-2.
What are the key differences between MM912F634DV2AER2 and MM912F634DV1AER2?
MM912F634DV2AER2 uses Analog Option 2, which disables the current sense module (ISENSEH/ISENSEL) and limits high-voltage wake-up inputs to L0–L3. In contrast, MM912F634DV1AER2 (Analog Option 1) includes both features. All other MCU and driver specifications remain identical between the two variants.
Can MM912F634DV2AER2 drive inductive loads like relays?
Yes, MM912F634DV2AER2 provides two protected low-side outputs (LS1, LS2) specifically designed for driving inductive loads such as relays and solenoids. Each output includes active clamp circuitry to suppress flyback voltage, short-circuit protection, and thermal shutdown - enabling direct connection without external snubbers or diodes.
Is the exposed thermal pad on MM912F634DV2AER2 required to be connected to ground?
Yes, the exposed pad on the 48-pin LQFP-EP package (98ASA00173D) of MM912F634DV2AER2 is recommended to be connected to PGND per the datasheet Note in Section 2.1. This connection improves thermal dissipation during sustained high-side or low-side output conduction and enhances long-term reliability in automotive environments.
MM912F634DV2AER2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-LQFP Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- S12
- Program Memory Type:
- FLASH (32KB)
- Controller Series:
- HCS12
- RAM Size:
- 2K x 8
- Interface:
- LIN, SCI
- Number of I/O:
- 9
- Voltage - Supply:
- 2.25V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HLQFP (7x7)
MM912F634DV2AER2 FAQ
1.How can I place an order for MM912F634DV2AER2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MM912F634DV2AER2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MM912F634DV2AER2 reliable?
The price and inventory of MM912F634DV2AER2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM912F634DV2AER2 is usually 5 days.
3.What payment methods are accepted for MM912F634DV2AER2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM912F634DV2AER2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MM912F634DV2AER2?
MM912F634DV2AER2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MM912F634DV2AER2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MM912F634DV2AER2?
For technical support, including MM912F634DV2AER2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM912F634DV2AER2 requirements.
6.How does Aetrix verify that MM912F634DV2AER2 is sourced from the original manufacturer or authorized distributors?
All MM912F634DV2AER2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM912F634DV2AER2 meets industry standards.
7.What is the process for return or replacement of MM912F634DV2AER2?
All MM912F634DV2AER2 units undergo pre-shipment inspection (PSI). If there is an issue with MM912F634DV2AER2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MM912F634DV2AER2 part is unused and in its original packaging.
Return procedure for MM912F634DV2AER2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MM912F634DV2AER2 Tags
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CYPD3175-24LQXQ
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SLB9672VU20FW1523XTMA1
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SLB9670VQ20FW785XTMA1
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SLB9672XU20FW1523XTMA1
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SLB9673XU20FW2613XTMA1
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CYPD3125-40LQXIT
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AT97SC3204-U2A1A-20
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AT97SC3204-U2A1A-10
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SLM9670AQ20FW1311XTMA1
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SLB9672XU20FW1613XTMA1
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SLB9672AU20FW1613XTMA1
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SLB9673AU20FW2613XTMA1
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