NXP Semiconductors MM912F634DV2APR2
- Part No.:
- MM912F634DV2APR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
MM912F634DV2APR2.pdf
- Description:
- IC MCU DUAL LS/HS SWITCH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MM912F634DV2APR2 from NXP Semiconductors (formerly Freescale) is an integrated S12-based relay driver with LIN physical layer, combining an HCS12 microcontroller (32 kB Flash, 2 kB RAM, 16-bit CPU) and SMARTMOS analog control IC in a single 48-pin LQFP package. It delivers two protected high-side outputs, two protected low-side outputs, LIN 2.1 interface, 10-bit 15-channel ADC, and six high-voltage wake-up inputs - designed for automotive body control modules requiring consolidated power switching and communication.
For engineers reviewing the MM912F634DV2APR2 datasheet, MM912F634DV2APR2 pinout, MM912F634DV2APR2 application, or MM912F634DV2APR2 equivalent, this page provides verified functional architecture, validated pin roles, confirmed analog die Option 2 configuration (no current sense, L0–L3 wake-up only), and real-world design implications for automotive relay control and LIN node integration.
Technical Context
The MM912F634DV2APR2 implements a dual-die architecture: an HCS12 MCU die (20 MHz bus max for DV1AE, 16 MHz for DV2AP) communicates with an analog die via Die-to-Die (D2D) bus, enabling transparent memory-mapped access to high-voltage I/O, drivers, and sensing functions. The analog die includes cascaded voltage regulators (VDD = 2.5 V, VDDX = 5.0 V), reverse-battery-protected VS1/VS2 supplies, and integrated LIN transceiver with SCI coupling.
It supports low-power cyclic sense mode with forced wake-up via six configurable high-voltage inputs (L0–L5), though Option 2 restricts wake-up capability to L0–L3. The device integrates Hall sensor supply (HSUP, 18 V regulated), chip temperature sensing, and battery voltage monitoring (VSENSE) with internal scaling - all coordinated through shared MCU peripherals including TIM16B4C, PWM8B2C, and ADC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS12 16-bit MCU with BDM debug module and 64-byte trace buffer RAM |
| Memory | 32 kB on-chip Flash (programmable), 2.0 kB RAM - sufficient for LIN stack + relay control firmware |
| LIN Interface | LIN 2.1 physical layer with integrated SCI; single-wire bus I/O on dedicated LIN pin |
| Driver Outputs | Two protected high-side (HS1, HS2) and two protected low-side (LS1, LS2) outputs for inductive/resistive loads |
| Analog Inputs | 10-bit, 15-channel ADC with selectable 0–2.5 V / 0–5 V / 0–18 V ranges on Lx pins (L0–L3 active in Option 2) |
| Wake-up Inputs | Six high-voltage capable inputs (L0–L5); Option 2 enables only L0–L3 for cyclic sense and forced wake-up |
| Package | 48-pin LQFP (98ASH00962A), 7.0 mm × 7.0 mm, non-exposed pad (AP suffix) |
Pinout & Package
MM912F634DV2APR2 uses a 48-pin LQFP package (98ASH00962A) with 0.5 mm pitch and non-exposed pad (AP). Pin functions are validated per Freescale Document MM912F634 Rev. 9.0 (June 2015), Table 3. Analog die Option 2 disables ISENSEL/ISENSEH and L4/L5 wake-up functionality.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HS1, HS2 | High-side driver outputs | VS2-supplied outputs for driving resistive loads (e.g., LEDs, solenoids); support PWM modulation and cyclic activation in low-power mode |
| LS1, LS2 | Low-side driver outputs | PGND-referenced outputs with short-circuit protection and active clamp; optimized for relay coils and inductive loads |
| L0–L3 | High-voltage wake-up/analog inputs | Automotive transient-protected inputs (up to 18 V); configurable as digital wake-up sources or ADC channels with selectable voltage dividers |
| LIN | LIN bus I/O | Single-wire physical layer interface compliant with LIN 2.1; connects directly to LIN bus with no external transceiver required |
| VSENSE | Battery voltage sense input | Reverse-battery-protected input for direct battery line monitoring; scaled internally for ADC measurement without external divider |
| HSUP | Hall sensor supply | Regulated 18 V output (from VS1) for powering Hall-effect sensors; requires external CHSUP capacitor |
| RESET, RESET_A | MCU and analog die reset I/O | Bidirectional active-low reset signals; RESET_A (VDDX-based) must be externally tied to RESET for synchronized initialization |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die integration | Seamless HCS12 MCU + SMARTMOS analog die coexistence via D2D bus - eliminates inter-chip timing skew and reduces PCB routing complexity |
| LIN 2.1 compliance | Integrated physical layer with built-in slew rate control and fault detection - enables direct connection to LIN cluster without external transceiver |
| Protected driver outputs | HS/LS outputs include overcurrent shutdown, thermal foldback, and active clamp - eliminate need for discrete protection components in relay/solenoid drive |
| Low-power cyclic sense | Configurable periodic wake-up using L0–L3 inputs during STOP mode - extends battery life in always-on automotive nodes (e.g., door modules) |
| Multi-range ADC | 10-bit converter with programmable input dividers on Lx pins - supports direct measurement of battery (0–18 V), 5 V rails, and sensor signals without external signal conditioning |
| Reverse-battery protection | Integrated diode protection on VS1, VS2, and VSENSE pins - ensures robustness against incorrect battery installation in vehicle service environments |
Applications
| Body Control Module (BCM) | Smart Junction Box |
|---|---|
Use Scenario: Centralized control of lighting, wipers, and door locks in modern vehicles. IC Role / Device Role / Timing Role: Integrated relay driver and LIN slave node managing load switching and status reporting via LIN bus. Use Value: Reduces component count by consolidating MCU, LIN PHY, and protected drivers - lowers BOM cost and board space vs. discrete solutions. |
Use Scenario: Distributed power distribution unit with intelligent fuse monitoring and load control. IC Role / Device Role / Timing Role: High-voltage input monitoring (L0–L3) and protected low/high-side switching for branch circuit control. Use Value: Enables real-time battery voltage tracking (VSENSE), temperature sensing (TSENSE), and cyclic wake-up for energy-efficient diagnostics. |
| Seat Control Unit | Roof Module (Sunroof/Windows) |
Use Scenario: Motorized seat position adjustment with Hall sensor feedback and overload protection. IC Role / Device Role / Timing Role: HSUP supplies Hall sensors; LS1/LS2 drive seat motors; ADC reads position sensors and current sense (via external shunt). Use Value: On-chip 18 V Hall supply and motor driver protection eliminate external regulators and flyback diodes - improves reliability in confined spaces. |
Use Scenario: Sunroof and window lift control with anti-pinch detection and LIN command interface. IC Role / Device Role / Timing Role: LIN slave receiving commands; HS1/HS2 drive DC motors; L0–L3 monitor limit switches and battery voltage. Use Value: Wake-up capability on Lx inputs allows immediate response to mechanical switch events without continuous MCU polling - saves standby power. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated relay driver with LIN applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12G240F0MLH | Standalone HCS12G MCU (240 kB Flash, no integrated analog die); requires external LIN transceiver and discrete drivers | Greater firmware flexibility but higher system-level BOM and layout complexity | Select when custom driver behavior or extended memory is required beyond MM912F634DV2APR2's fixed analog functionality |
| SPC560B50L5 | Power Architecture-based 32-bit MCU with embedded LIN PHY and GPIOs; no integrated high-/low-side drivers or HV inputs | Higher performance core and CAN support, but lacks protected outputs and wake-up inputs for direct relay control | Select for next-generation platforms needing CAN+LIN hybrid networks and scalable processing, accepting added external driver ICs |
Compared with MC9S12G240F0MLH and SPC560B50L5, MM912F634DV2APR2 uniquely combines MCU, LIN PHY, and protected drivers in one package - reducing bill-of-materials, PCB area, and qualification effort for cost-sensitive automotive body electronics where integration outweighs raw compute headroom.
Availability
MM912F634DV2APR2 is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, seat control units, and roof modules requiring stable component supply across extended temperature ranges (−40 °C to +105 °C).
Supply support for MM912F634DV2APR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, formed from the acquisition of Freescale Semiconductor in 2015.
The MM912F634 series belongs to NXP's legacy automotive microcontroller portfolio, specifically engineered for integrated power switching and LIN communication in body electronics - targeting reduced system cost and enhanced functional safety in 12 V vehicle architectures.
FAQ
What is the maximum bus frequency supported by MM912F634DV2APR2?
The MM912F634DV2APR2 supports a maximum bus frequency of 16 MHz, as specified in Table 1 of the Freescale MM912F634 datasheet Rev. 9.0. This is lower than the 20 MHz capability of the DV1AE variant due to analog die Option 2 timing constraints. The 16 MHz clock enables deterministic execution of LIN protocol timing and relay control loops within the HCS12 core.
Does MM912F634DV2APR2 include current sense functionality?
No, MM912F634DV2APR2 implements Analog Option 2, which excludes the current sense module (ISENSEL/ISENSEH pins are not functional). This is confirmed in Table 2 of the datasheet and Section 4.2.3. Designers requiring current monitoring must add an external shunt and amplifier or select the DV1AE/DV2AE variants with Option 1 enabled.
What is the purpose of the HSUP pin on MM912F634DV2APR2?
The HSUP pin on MM912F634DV2APR2 provides a regulated 18 V output derived from VS1, specifically designed to power Hall-effect sensors. As documented in Section 4.10, it requires an external decoupling capacitor (CHSUP) and supports typical Hall sensor current loads up to 10 mA - eliminating the need for a separate voltage regulator in seat or motor position sensing applications.
How many wake-up inputs does MM912F634DV2APR2 support in its configured analog option?
MM912F634DV2APR2 uses Analog Option 2, which supports wake-up functionality on L0 through L3 only - four high-voltage inputs. L4 and L5 are present physically but lack wake-up capability in this variant, as explicitly stated in Table 2 and Section 4.2.3 of the datasheet. This configuration balances feature set and cost for mid-tier automotive modules.
Is MM912F634DV2APR2 pin-compatible with other MM912F634 variants?
Yes, all MM912F634 variants - including MM912F634DV2APR2 - share identical 48-pin LQFP packaging and pinout per Figure 4 and Table 3. However, functional differences exist: DV2AP excludes current sense and limits wake-up to L0–L3, while DV1AE enables full L0–L5 wake-up and ISENSE. Hardware layout remains interchangeable, but firmware must account for disabled features.
MM912F634DV2APR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Applications:
- -
- Core Processor:
- S12
- Program Memory Type:
- FLASH (32KB)
- Controller Series:
- HCS12
- RAM Size:
- 2K x 8
- Interface:
- LIN, SCI
- Number of I/O:
- 9
- Voltage - Supply:
- 2.25V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-LQFP (7x7)
MM912F634DV2APR2 FAQ
1.How can I place an order for MM912F634DV2APR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MM912F634DV2APR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MM912F634DV2APR2 reliable?
The price and inventory of MM912F634DV2APR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM912F634DV2APR2 is usually 5 days.
3.What payment methods are accepted for MM912F634DV2APR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM912F634DV2APR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MM912F634DV2APR2?
MM912F634DV2APR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MM912F634DV2APR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MM912F634DV2APR2?
For technical support, including MM912F634DV2APR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM912F634DV2APR2 requirements.
6.How does Aetrix verify that MM912F634DV2APR2 is sourced from the original manufacturer or authorized distributors?
All MM912F634DV2APR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM912F634DV2APR2 meets industry standards.
7.What is the process for return or replacement of MM912F634DV2APR2?
All MM912F634DV2APR2 units undergo pre-shipment inspection (PSI). If there is an issue with MM912F634DV2APR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MM912F634DV2APR2 part is unused and in its original packaging.
Return procedure for MM912F634DV2APR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MM912F634DV2APR2 Tags

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CYPD3175-24LQXQ
Infineon Technologies

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SLB9672VU20FW1523XTMA1
Infineon Technologies

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SLB9670VQ20FW785XTMA1
Infineon Technologies

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SLB9672XU20FW1523XTMA1
Infineon Technologies

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SLB9673XU20FW2613XTMA1
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CYPD3125-40LQXIT
Infineon Technologies

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AT97SC3204-U2A1A-20
Microchip Technology

-
AT97SC3204-U2A1A-10
Microchip Technology

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SLM9670AQ20FW1311XTMA1
Infineon Technologies

-
SLB9672XU20FW1613XTMA1
Infineon Technologies

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SLB9672AU20FW1613XTMA1
Infineon Technologies

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SLB9673AU20FW2613XTMA1
Infineon Technologies
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