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NXP Semiconductors MM912H634DV1AE

Part No.:
MM912H634DV1AE
Manufacturer:
NXP Semiconductors
Category:
Application Specific Microcontrollers
Package:
48-LQFP Exposed Pad
Datasheet:
AetrixMM912H634DV1AE.pdf
Description:
MM912H634 - Integrated HCS12 Bas
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,462

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Product details

Overview

MM912H634DV1AE from NXP Semiconductors is an intelligent integrated precision battery sensor combining a 128 kB S12 MCU with SMARTMOS analog front-end for automotive 12 V lead-acid battery monitoring. It delivers ±0.5% battery voltage accuracy, ±1.5% current measurement across 8 ranges via external shunt, and on-die temperature sensing with LIN 2.1 interface - deployed in vehicle battery management systems for state-of-charge estimation and cranking diagnostics.

For engineers reviewing the MM912H634DV1AE datasheet, MM912H634DV1AE pinout, MM912H634DV1AE application, or MM912H634DV1AE equivalent, key selection criteria include its integrated PGA with auto-gain control, dual low-power wake-up triggers (LIN + current threshold), 48-pin QFN thermal-enhanced package, and support for optional external temperature/voltage sense inputs.

Technical Context

The MM912H634DV1AE integrates two dies: an analog die handling precision current/voltage/temperature acquisition using a 16-bit ΣΔ ADC, programmable gain amplifier, and cascaded voltage regulators (VDDH=2.5 V, VDDX=5.0 V); and an MCU die featuring an S12 core with 128 kB flash, 6 kB RAM, and background debug module. Communication occurs over a LIN 2.1 physical layer with built-in EMC protection.

Its analog architecture supports cranking-mode operation with full characterization, includes signal low-pass filtering for current/voltage channels, and enables wake-up from standby via current averaging or threshold detection - all synchronized to the internal accurate oscillator (±1% over –40 °C to +105 °C) with optional external quartz for extended accuracy.

Key Specifications

ParameterValue and Actual Design Meaning
Battery voltage accuracy±0.5% over –40 °C to +105 °C - enables reliable SoC estimation without external calibration.
Current measurement range8 selectable ranges via ISENSEL/ISENSEH - supports high-resolution shunt-based monitoring from microamp to 1000 A.
ADC resolution16-bit ΣΔ ADC - provides >90 dB SNR for precise low-noise analog acquisition.
LIN interfaceLIN 2.1 compliant - ensures interoperability with standard automotive body control modules and gateways.
Operating temperature–40 °C to +105 °C - qualified for under-hood deployment in passenger and commercial vehicles.
Flash memory128 kB with ECC - supports robust firmware storage and field updates in safety-critical applications.
Wake-up sourcesCurrent threshold detection + periodic LIN polling - reduces system power consumption during sleep mode.

Pinout & Package

MM912H634DV1AE uses a 48-pin HVQFN package (SOT619-25(D)), 7 mm × 7 mm × 0.9 mm body, 0.5 mm pitch, wettable flank, and exposed thermal pad (EP). The package supports high thermal dissipation required for continuous current sensing in automotive environments.

Pin/TerminalCircuit RoleDesign Meaning
ISENSEH / ISENSELCurrent sense differential inputAccepts voltage drop across external shunt; enables bidirectional current measurement with auto-gain control.
VSENSEBattery voltage inputDirect connection to battery positive pole with internal scaling and reverse-battery protection up to –40 V.
PTB3 / L0High-voltage wake-up input5.0 V tolerant GPIO with internal clamping; supports wake-up from low-power mode during LIN bus activity or external event.
LINLIN bus transceiver I/OSingle-wire physical layer interface compliant with LIN 2.1; includes transient protection for automotive load dump.
VDDX / VDDH / VDDAPower supply railsDedicated 5.0 V (core), 2.5 V (D2D buffer), and 2.5 V (analog) regulators - minimize noise coupling between digital and analog domains.

Key Features

FeatureDesign Value
Integrated PGA with auto-gain controlEliminates manual gain selection and enables seamless current range switching during runtime without firmware intervention.
On-die temperature sensor + TSUP/VTEMP optionEnables direct battery-can thermal monitoring while supporting external NTC sensors for enhanced thermal profiling.
Programmable low-pass filteringReduces noise in current and voltage measurements during engine cranking or alternator ripple conditions.
Two low-power modes with wake-up triggersExtends system battery life by enabling <10 µA standby current with configurable wake-up on LIN message or current threshold crossing.
Industry-standard EMC complianceMeets ISO 11452-4 (BCI) and ISO 7637-2 (transients) - validated for integration into OEM ECU designs without additional shielding.

Applications

Start-Stop Battery Management12 V Lead-Acid State-of-Health Monitoring

Use Scenario: Real-time monitoring of battery voltage, current, and temperature during engine start-stop cycles in modern ICE and mild-hybrid vehicles.

IC Role / Device Role / Timing Role: Primary battery sensor providing synchronized analog acquisition and LIN-reporting of cranking voltage sag, charge acceptance, and impedance trends.

Use Value: Enables accurate prediction of battery end-of-life and prevents unexpected no-start events through trend-based degradation analysis.

Use Scenario: Continuous logging of battery parameters in commercial fleet telematics units to assess aging and warranty claims.

IC Role / Device Role / Timing Role: Standalone precision sensor feeding data to gateway ECUs via LIN; operates in low-power mode between scheduled reports.

Use Value: Delivers ±0.5% voltage accuracy and ±1.5% current accuracy over full temperature range - reducing need for field recalibration.

Automotive Body Control Module IntegrationAftermarket Battery Tester Calibration Reference

Use Scenario: Embedded battery sensing within BCMs for intelligent charging control and load shedding decisions.

IC Role / Device Role / Timing Role: LIN-slave device reporting battery status every 100 ms; supports diagnostic request-response protocol per LIN specification.

Use Value: Integrates voltage, current, and temperature into single BOM item - eliminates discrete sensor fusion and reduces PCB area by >40%.

Use Scenario: High-accuracy reference unit in handheld battery testers used for workshop diagnostics and replacement validation.

IC Role / Device Role / Timing Role: Precision analog front-end with calibrated 16-bit ΣΔ ADC and internal temperature compensation - serves as traceable measurement standard.

Use Value: Eliminates external calibration drift via on-chip trimming and factory-programmed IFR coefficients stored in flash.

Equivalent & Alternatives

The following parts are listed as comparable options for similar battery sensing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX17205Standalone fuel gauge IC with ModelGauge m5 algorithm; no integrated MCU or LIN interface.Requires external microcontroller and LIN transceiver for automotive bus communication.Select when advanced coulomb counting and battery modeling are prioritized over integrated LIN reporting.
STM32G071 + TLE9183Discrete solution: ARM Cortex-M0+ MCU + dedicated battery monitor IC; higher BOM count and layout complexity.Offers greater firmware flexibility but lacks monolithic calibration and pre-validated EMC performance.Select when custom algorithm development or multi-cell support beyond 12 V is required.

Compared with MAX17205 and STM32G071+TLE9183, MM912H634DV1AE provides a fully integrated, LIN-ready solution with factory-trimmed analog front-end - reducing design cycle time by eliminating sensor fusion logic and external bus interface validation.

Availability

MM912H634DV1AE is available at Aetrix Electronics and suitable for automotive battery management, start-stop systems, and fleet telematics requiring stable component supply and long-term production continuity.

Supply support for MM912H634DV1AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in secure connectivity and embedded processing.

The MM912H634DV1AE belongs to NXP's SMARTMOS-based battery sensor family, designed specifically for high-accuracy, low-power, and EMC-robust 12 V battery monitoring in automotive environments.

FAQ

What is the operating temperature range for MM912H634DV1AE?

The MM912H634DV1AE is rated for operation from –40 °C to +105 °C ambient temperature, meeting AEC-Q100 Grade 2 requirements for under-hood automotive deployment. This range is validated across all key functions including voltage/current measurement, LIN communication, and internal oscillator stability - ensuring consistent performance in extreme thermal environments where the MM912H634DV1AE is typically mounted near the battery terminal.

Does MM912H634DV1AE support external crystal oscillators?

Yes, MM912H634DV1AE supports external crystal oscillators via PE0/EXTAL and PE1/XTAL pins for improved timing accuracy beyond the ±1% internal oscillator. When enabled, the external crystal replaces the internal RC oscillator for MCU clock generation, enhancing LIN baud rate stability and ADC sampling consistency - critical for high-precision battery parameter correlation in the MM912H634DV1AE.

How does MM912H634DV1AE handle reverse battery connection?

MM912H634DV1AE includes built-in reverse-battery protection on the VSENSE pin, rated to withstand –40 V continuously. The internal protection circuitry prevents damage during jump-start misconnections or battery polarity reversal, eliminating the need for external diodes in most 12 V lead-acid applications - a key reliability feature confirmed in the MM912H634DV1AE datasheet Section 4.6.

What LIN protocol versions does MM912H634DV1AE support?

MM912H634DV1AE implements a LIN 2.1-compliant physical layer and protocol stack, including support for LIN 2.0 frame formats and diagnostic services. It operates at standard LIN baud rates (1.2 kbps to 20 kbps) and handles automatic synchronization, checksum calculation, and error detection - ensuring full interoperability with legacy and current-generation automotive LIN networks where the MM912H634DV1AE serves as a slave node.

Can MM912H634DV1AE measure temperature using both internal and external sensors?

Yes, MM912H634DV1AE integrates an on-die temperature sensor and supports external NTC thermistors via VTEMP and TSUP pins. The internal sensor provides board-level thermal context, while the external option enables direct battery-can or terminal temperature measurement - both channels are digitized by the same 16-bit ΣΔ ADC and compensated using factory-trimmed coefficients stored in the MM912H634DV1AE's flash memory.

MM912H634DV1AE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
48-LQFP Exposed Pad
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Applications:
-
Core Processor:
-
Program Memory Type:
-
Controller Series:
-
RAM Size:
-
Interface:
Serial
Number of I/O:
-
Voltage - Supply:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
48-HLQFP (7x7)

MM912H634DV1AE FAQ

1.How can I place an order for MM912H634DV1AE through Aetrix?

Please submit a Request for Quotation (RFQ) for MM912H634DV1AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MM912H634DV1AE reliable?

The price and inventory of MM912H634DV1AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM912H634DV1AE is usually 5 days.

3.What payment methods are accepted for MM912H634DV1AE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM912H634DV1AE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MM912H634DV1AE?

MM912H634DV1AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MM912H634DV1AE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MM912H634DV1AE?

For technical support, including MM912H634DV1AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM912H634DV1AE requirements.

6.How does Aetrix verify that MM912H634DV1AE is sourced from the original manufacturer or authorized distributors?

All MM912H634DV1AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM912H634DV1AE meets industry standards.

7.What is the process for return or replacement of MM912H634DV1AE?

All MM912H634DV1AE units undergo pre-shipment inspection (PSI). If there is an issue with MM912H634DV1AE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MM912H634DV1AE part is unused and in its original packaging.

Return procedure for MM912H634DV1AE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MM912H634DV1AE Tags

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