NXP Semiconductors MM912I637AV1EPR2
- Part No.:
- MM912I637AV1EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Application Specific Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MM912I637AV1EPR2.pdf
- Description:
- IC MCU LIN BATT MONITOR 48QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,489
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Product details
Overview
MM912I637AV1EPR2 from NXP Semiconductors is an intelligent integrated precision battery sensor combining a 96 kB S12 microcontroller and SMARTMOS analog front-end in a single 48-pin QFN package. It performs high-accuracy battery voltage measurement (±0.5% full-scale), current sensing across up to 8 ranges via external shunt, and on-die temperature monitoring - all with LIN 2.1 interface output for automotive 12 V lead-acid battery monitoring systems.
For engineers reviewing the MM912I637AV1EPR2 datasheet, MM912I637AV1EPR2 pinout, MM912I637AV1EPR2 application, or MM912I637AV1EPR2 equivalent, key selection criteria include its dual-die architecture (MCU + analog), programmable gain amplifier with auto-gain control, LIN 2.1 compliance, -40 °C to +105 °C operating range, and support for external temperature/voltage sense inputs (VTEMP/VOPT).
Technical Context
The MM912I637AV1EPR2 implements a cascaded die architecture: an analog die handles precision signal conditioning (voltage/current/temperature acquisition, PGA, low-pass filtering, internal regulators) while a separate S12 MCU die (96 kB Flash, 6 kB RAM) executes firmware, LIN protocol stack, and wake-up logic. Communication between dies occurs via a dedicated die-to-die interface with clock/data/interrupt signals.
Its analog subsystem features automatic gain control for current measurement across eight selectable ranges, self-protected VSENSE input capable of direct battery-plus connection (with reverse-battery immunity), and dual-mode operation (normal/low-power) with LIN-triggered or periodic wake-up. The integrated 5.0 V and 2.5 V regulators supply independent domains for MCU core, flash, ADC, and digital I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temperature | -40 °C to +105 °C - qualified for under-hood automotive environments without derating. |
| Battery Voltage Accuracy | ±0.5% full-scale - enables reliable state-of-charge estimation in 12 V lead-acid systems. |
| Current Measurement Ranges | 8 programmable ranges - supports high dynamic range sensing from standby leakage to cranking currents. |
| LIN Interface | LIN 2.1 compliant - interoperable with standard automotive body control modules and diagnostic tools. |
| Flash Memory | 96 kB - sufficient for LIN protocol stack, sensor calibration algorithms, and OEM-specific diagnostics. |
| Analog Supply | VDDA = 2.5 V (regulated) - powers precision analog front-end independently of digital noise sources. |
| Package | 48-pin QFN (EP suffix, WF-type) - thermally enhanced for automotive PCB mounting with exposed pad. |
Pinout & Package
MM912I637AV1EPR2 uses a 48-pin QFN package with exposed thermal pad (WF-type, EP suffix). Pin assignment follows NXP's standardized layout for dual-die battery sensors, with dedicated domains for analog sensing (VSENSE, ISENSEL/ISENSEH, TSUP/VTEMP), LIN physical layer (LIN, LGND), MCU I/O (PA0–PA7, PTB0–PTB3), power (VSUP, VDDX, VDDH, VDDA), and debug/test (BKGD/MODC, TEST_A, TCLK).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSENSE | Battery voltage sense input | Direct connection point to battery positive pole; includes internal voltage divider and reverse-battery protection. |
| ISENSEH / ISENSEL | Differential current sense inputs | Measure voltage drop across external shunt resistor; support auto-ranging PGA with ±1 mA input current limit. |
| LIN / LGND | LIN bus transceiver interface | Single-wire bidirectional LIN 2.1 communication; LGND provides isolated ground reference for noise immunity. |
| PTB3 / L0 | High-voltage wake-up input | 5.0 V tolerant GPIO with internal clamping; enables wake-up from low-power mode via external LIN or chassis event. |
| VDDX / VDDH / VDDA | Independent power domains | VDDX (5.0 V) powers MCU core/flash; VDDH (2.5 V) powers die-to-die buffer; VDDA (2.5 V) powers analog front-end. |
| BKGD/MODC | Background debug interface | Pseudo-open-drain pin for single-wire BDM programming and real-time debugging during development. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Gain Amplifier (PGA) | Auto-gain control across 8 current ranges eliminates manual scaling and improves resolution at low currents. |
| Integrated LIN 2.1 Physical Layer | Eliminates need for external LIN transceiver; reduces BOM count and PCB area in battery monitoring nodes. |
| Low-Power Wake-Up Logic | Current threshold detection + averaging in standby enables autonomous wake-up without host controller intervention. |
| Dual-Die Architecture | Separate analog and MCU dies minimize noise coupling and allow independent power domain optimization. |
| External Sensor Support | VTEMP and VOPT pins enable optional external temperature sensing and secondary voltage monitoring for redundancy. |
Applications
| Automotive Battery Management Unit (BMU) | Start-Stop System Monitoring |
|---|---|
|
Use Scenario: Real-time monitoring of 12 V lead-acid battery health in modern vehicles with energy recuperation and load shedding. IC Role / Device Role / Timing Role: Primary battery sensor providing voltage, current, and temperature data over LIN to the vehicle's central gateway. Use Value: Enables accurate state-of-charge (SoC) and state-of-health (SoH) calculation, extending battery life by 15–20% through optimized charging and load management. |
Use Scenario: Continuous supervision of battery performance during engine cranking and restart cycles in micro-hybrid vehicles. IC Role / Device Role / Timing Role: High-speed current acquisition during cranking events (up to 500 A) with fast wake-up response (< 100 µs) triggered by LIN command or voltage dip. Use Value: Prevents false start-stop disable due to transient voltage drops, improving system reliability and driver experience. |
| Commercial Vehicle Telematics Gateway | Aftermarket Battery Diagnostics Module |
|
Use Scenario: Integration into fleet telematics units for remote battery health reporting and predictive maintenance alerts. IC Role / Device Role / Timing Role: Standalone LIN node collecting and preprocessing battery telemetry before transmission via CAN or cellular modem. Use Value: Reduces host processor load and bandwidth usage by performing local averaging, thresholding, and fault flagging. |
Use Scenario: Compact plug-and-play diagnostic tool connecting directly to battery terminals and OBD-II port. IC Role / Device Role / Timing Role: Self-contained sensor with built-in LIN interface and configurable thresholds for user-alert generation. Use Value: Delivers OEM-grade battery diagnostics without requiring vehicle ECU access or proprietary software. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar battery sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MM912J637AV1EPR2 | 128 kB Flash, same package and pinout; higher memory for extended diagnostics or dual-firmware updates. | Required when application firmware exceeds 96 kB or needs field-upgradable safety-critical code partitions. | Select MM912J637AV1EPR2 if future firmware growth or ASIL-B compliance requires additional Flash and data flash (4 kB vs. 4 kB shared). |
| MAX17205 | Standalone fuel gauge IC (no MCU, no LIN); uses ModelGauge m5 algorithm; I²C interface only. | Suitable for non-LIN systems or where host MCU handles protocol translation and power management. | Choose MAX17205 only if LIN bus integration is unnecessary and host processor can manage I²C communication and battery modeling. |
Compared with MM912J637AV1EPR2, the MM912I637AV1EPR2 offers identical analog performance and LIN functionality but with 32 kB less Flash - sufficient for basic LIN-compliant battery monitoring without complex diagnostics. Versus MAX17205, it provides integrated LIN and MCU execution capability, eliminating external protocol bridging and reducing system-level BOM cost.
Availability
MM912I637AV1EPR2 is available at Aetrix Electronics and suitable for automotive battery monitoring, start-stop system integration, and commercial vehicle telematics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MM912I637AV1EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal ICs and functional safety.
The MM912I637AV1EPR2 belongs to NXP's Intelligent Battery Sensor family, designed specifically for high-accuracy, LIN-connected battery monitoring in demanding automotive environments - emphasizing robustness, precision, and seamless integration into existing vehicle networks.
FAQ
What is the maximum input voltage rating for the VSUP pin on the MM912I637AV1EPR2?
The MM912I637AV1EPR2 VSUP pin has an absolute maximum rating of 42 V, making it suitable for 12 V automotive systems with load-dump transients per ISO 7637-2 Pulse 5a. This rating ensures reliable operation during alternator regulation faults and battery jump-start scenarios without external overvoltage protection circuitry.
Does the MM912I637AV1EPR2 support external crystal oscillators for improved timing accuracy?
Yes, the MM912I637AV1EPR2 supports external crystal oscillators via PE0/EXTAL and PE1/XTAL pins. While it includes an accurate internal oscillator, using an external quartz crystal enables extended timing accuracy required for LIN baud rate stability under wide temperature and voltage variations - critical for error-free communication in noisy automotive environments.
How does the MM912I637AV1EPR2 handle battery reverse polarity connection?
The MM912I637AV1EPR2 VSENSE pin includes built-in reverse-battery protection, allowing direct connection to the battery positive terminal without external diodes. Its VSUP pin requires an external reverse-battery protection diode per datasheet recommendation, but the analog front-end remains undamaged during accidental reverse connection due to internal clamp structures on VSENSE and ISENSEH/ISENSEL pins.
Can the MM912I637AV1EPR2 measure temperature using both internal and external sensors simultaneously?
Yes, the MM912I637AV1EPR2 integrates an on-die temperature sensor and supports external NTC/PTC sensors via the VTEMP and TSUP pins. When both are enabled, firmware can perform cross-validation - using internal die temperature for thermal compensation of analog measurements and external sensor data for ambient or battery-can temperature reporting over LIN.
What is the function of the PTB3/L0 pin on the MM912I637AV1EPR2, and how is it configured for wake-up?
The PTB3/L0 pin on the MM912I637AV1EPR2 serves as a high-voltage wake-up input capable of detecting LIN bus activity or external chassis events. It is configured for wake-up by enabling the internal pull-down and wake-up interrupt in the GPIO control register; upon voltage transition exceeding threshold, it exits low-power mode within < 100 µs and triggers the current-threshold detection module to assess battery condition.
MM912I637AV1EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Applications:
- Battery Monitor
- Core Processor:
- S12
- Program Memory Type:
- FLASH (96KB)
- Controller Series:
- HCS12
- RAM Size:
- 6K x 8
- Interface:
- LIN, SCI, SPI
- Number of I/O:
- 8
- Voltage - Supply:
- 2.25V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-QFN-EP (7x7)
MM912I637AV1EPR2 FAQ
1.How can I place an order for MM912I637AV1EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MM912I637AV1EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MM912I637AV1EPR2 reliable?
The price and inventory of MM912I637AV1EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MM912I637AV1EPR2 is usually 5 days.
3.What payment methods are accepted for MM912I637AV1EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MM912I637AV1EPR2 transactions.
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4.How is shipping managed for MM912I637AV1EPR2?
MM912I637AV1EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MM912I637AV1EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MM912I637AV1EPR2?
For technical support, including MM912I637AV1EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MM912I637AV1EPR2 requirements.
6.How does Aetrix verify that MM912I637AV1EPR2 is sourced from the original manufacturer or authorized distributors?
All MM912I637AV1EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MM912I637AV1EPR2 meets industry standards.
7.What is the process for return or replacement of MM912I637AV1EPR2?
All MM912I637AV1EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MM912I637AV1EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MM912I637AV1EPR2 part is unused and in its original packaging.
Return procedure for MM912I637AV1EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MM912I637AV1EPR2 Tags

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CYPD3175-24LQXQ
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SLB9672VU20FW1523XTMA1
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SLB9670VQ20FW785XTMA1
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AT97SC3204-U2A1A-20
Microchip Technology

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SLM9670AQ20FW1311XTMA1
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SLB9672XU20FW1613XTMA1
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SLB9672AU20FW1613XTMA1
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SLB9673AU20FW2613XTMA1
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